Light-emitting device, light-emitting module, electronic device, and manufacturing method of light-emitting device

Patent metadata

Field	Value
Publication number	US-12414443-B2
Application number	US-201917267857-A
Country	US
Kind code	B2
Filing date	Aug 8, 2019
Priority date	Aug 24, 2018
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

A light-emitting device capable of long-time display in a bent state is provided. A light-emitting device that can be repeatedly bent with a small radius of curvature is provided. The flexible light-emitting device includes a light-emitting element, a first inorganic insulating layer, a second inorganic insulating layer, and a first organic insulating layer. The first organic insulating layer is positioned over the first inorganic insulating layer. The light-emitting element is positioned over the first inorganic insulating layer with the first organic insulating layer therebetween. The second inorganic insulating layer is positioned over the light-emitting element. An end portion of the first inorganic insulating layer and an end portion of the second inorganic insulating layer are each positioned inward from an end portion of the first organic insulating layer. The end portion of the first organic insulating layer is exposed on a side surface of the light-emitting device. The first inorganic insulating layer and the second inorganic insulating layer are preferably in contact with each other outside an end portion of the light-emitting element.

First claim

The invention claimed is:

1. A flexible light-emitting device comprising a first substrate, a light-emitting element, a first inorganic insulating layer, a second inorganic insulating layer, a first organic insulating layer, a second organic insulating layer, and a second substrate,
wherein the first inorganic insulating layer is over the first substrate,
wherein the first organic insulating layer is over the first inorganic insulating layer,
wherein the light-emitting element comprises a first electrode over the first organic insulating layer, a light-emitting layer over the first electrode, and a second electrode over the light-emitting layer,
wherein the second inorganic insulating layer is over the second electrode,
wherein the second organic insulating layer is over the second inorganic insulating layer,
wherein the second substrate is over the second organic insulating layer,
wherein an end portion of the first inorganic insulating layer and an end portion of the second inorganic insulating layer are each inward from an end portion of the first organic insulating layer,
wherein the end portion of the first organic insulating layer and an end portion of the second organic insulating layer are in contact with each other and exposed on a side surface of the flexible light-emitting device, and
wherein the side surface of the flexible light-emitting device includes an end portion of the first substrate and an end portion of the second substrate.

2. The flexible light-emitting device according to claim 1 ,
wherein the first inorganic insulating layer and the second inorganic insulating layer are in contact with each other outside an end portion of the light-emitting element.

3. The flexible light-emitting device according to claim 1 ,
wherein the first organic insulating layer comprises an opening outside an end portion of the light-emitting element, and
wherein the first inorganic insulating layer and the second inorganic insulating layer are in contact with each other in the opening.

4. The flexible light-emitting device according to claim 1 , further comprising a third organic insulating layer,
wherein the first organic insulating layer comprises a material different from a material of the third organic insulating layer,
wherein the first organic insulating layer is over the third organic insulating layer, and
wherein an end portion of the third organic insulating layer is exposed on the side surface of the flexible light-emitting device.

5. A method for manufacturing a light-emitting device by manufacturing a plurality of light-emitting devices and dividing the plurality of light-emitting devices into individual light-emitting devices, comprising:
forming a separation layer over a first substrate;
forming a first inorganic insulating layer over the separation layer;
forming a first opening in the first inorganic insulating layer;
forming a first organic insulating layer over the first inorganic insulating layer;
forming a light-emitting element over the first organic insulating layer;
forming a second inorganic insulating layer over the light-emitting element;
bonding a second substrate onto the second inorganic insulating layer;
separating the first substrate and the first inorganic insulating layer from each other;
bonding a third substrate so that the third substrate overlaps with the second substrate with the first inorganic insulating layer therebetween; and
dividing the plurality of light-emitting devices into the individual light-emitting devices so that a dividing portion comprises the first opening, and
wherein an end portion of the first organic insulating layer is exposed on a side surface of the individual light-emitting devices.

6. The method for manufacturing a light-emitting device, according to claim 5 ,
wherein in the first organic insulating layer, a second opening is formed inward from the first opening, and
wherein the second inorganic insulating layer is inside the second opening.

7. The method for manufacturing a light-emitting device, according to claim 5 ,
wherein the separation layer comprises a metal oxide layer and a resin layer over the metal oxide layer.

8. The method for manufacturing a light-emitting device, according to claim 5 ,
wherein the separation layer comprises a resin layer.

9. The method for manufacturing a light-emitting device, according to claim 6 ,
wherein the separation layer comprises a metal layer and an oxide insulating layer over the metal layer,
wherein the metal layer comprises a third opening overlapping with the first opening,
wherein the oxide insulating layer comprises a fourth opening overlapping with both the first opening and the third opening, and
wherein the first substrate and the first organic insulating layer are in contact with each other in a portion where the first opening, the third opening, and the fourth opening overlap with each other.

10. The method for manufacturing a light-emitting device, according to claim 6 ,
wherein before the first organic insulating layer is formed, a second organic insulating layer is formed using a material different from a material of the first organic insulating layer,
wherein the separation layer comprises a metal layer and an oxide insulating layer over the metal layer,
wherein the metal layer comprises a third opening overlapping with the first opening,
wherein the oxide insulating layer comprises a fourth opening overlapping with both the first opening and the third opening, and
wherein the second organic insulating layer is in contact with the first substrate through the first opening, the third opening, and the fourth opening.

11. The method for manufacturing a light-emitting device, according to claim 5 ,
wherein the separation layer comprises a first metal layer, an oxide insulating layer over the first metal layer, and a second metal layer over the oxide insulating layer, and
wherein the first opening overlaps with the second metal layer.

12. The flexible light-emitting device according to claim 1 , further comprising a transistor and a third inorganic insulating layer,
wherein the transistor is over the third inorganic insulating layer,
wherein the first inorganic insulating layer is between the transistor and the first organic insulating layer, and
wherein an end portion of the third inorganic insulating layer is inward from the end portion of the first organic insulating layer.

13. The flexible light-emitting device according to claim 1 , wherein the second substrate includes a resin film.

14. The flexible light-emitting device according to claim 1 , wherein the first substrate and the second substrate are bonded to each other with the second organic insulating layer.

Assignees

• Semiconductor Energy Lab

Inventors

• Adachi Hiroki
• Yanaka Junpei
• Sato Masataka

Classifications

• Y02E10/549

  Organic PV cells · CPC title

• H10K50/844

  Encapsulations · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K71/40

  Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

• H10K59/8731

  multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers · CPC title