Manufacturing method of light-emitting device, light-emitting device, module, and electronic device

Patent metadata

Field	Value
Publication number	US-10135037-B2
Application number	US-201815897191-A
Country	US
Kind code	B2
Filing date	Feb 15, 2018
Priority date	Jul 30, 2015
Publication date	Nov 20, 2018
Grant date	Nov 20, 2018

Abstract

A highly reliable light-emitting device is provided. A yield in a manufacturing process of a light-emitting device is increased. A light-emitting device is provided in which a non-light-emitting portion having a frame-like shape outside a light-emitting portion includes a portion thinner than the light-emitting portion. A light-emitting element and a bonding layer are formed over a substrate. The light-emitting element is sealed by overlapping a pair of substrates and curing the bonding layer. Then, while the cured bonding layer is heated, pressure is applied to at least a portion of the non-light-emitting portion with a member having a projection.

First claim

The invention claimed is:

1. A method for manufacturing a light-emitting device comprising a light-emitting portion including a light-emitting element and a non-light-emitting portion having a frame-like shape outside the light-emitting portion, the method comprising:
forming a separation layer over a first substrate;
forming a layer to be separated over the separation layer;
arranging a second substrate and the first substrate so as to overlap with each other with a bonding layer between the second substrate and the first substrate, wherein the light-emitting element is positioned in a space surrounded by the bonding layer, the first substrate, and the second substrate;
curing the bonding layer;
separating the first substrate and the layer to be separated from each other; and
applying pressure to at least a portion of the non-light-emitting portion with a member having a projection while heating the bonding layer after curing the bonding layer,
wherein an insulating layer over the separation layer and the light-emitting element over the insulating layer are formed as the layer to be separated, and
wherein the bonding layer overlaps with the separation layer and the layer to be separated before separating the first substrate and the layer to be separated from each other.

2. The method for manufacturing the light-emitting device according to claim 1 , further comprising:
attaching a third substrate to the separated layer between separating the first substrate and the layer to be separated from each other and applying pressure to at least the portion of the non-light-emitting portion with the member.

3. The method for manufacturing the light-emitting device according to claim 1 , further comprising:
attaching a third substrate to the separated layer after applying pressure to at least the portion of the non-light-emitting portion with the member.

4. The method for manufacturing the light-emitting device according to claim 1 ,
wherein the non-light-emitting portion comprises a spacer and an inorganic insulating layer,
wherein the spacer and the inorganic insulating layer covering a side surface and a top surface of the spacer are formed over the first substrate or the second substrate before arranging the second substrate and the first substrate, and
wherein the projection overlaps with the inorganic insulating layer when applying pressure to at least the portion of the non-light-emitting portion with the member.

5. The method for manufacturing the light-emitting device according to claim 1 ,
wherein a part of the bonding layer is dented after applying pressure, and
wherein the part of the bonding layer overlaps with the non-light-emitting portion.

6. The method for manufacturing the light-emitting device according to claim 1 ,
wherein a thickness of the bonding layer in a first region which overlaps with the non-light-emitting portion is smaller than a thickness of the bonding layer in a second region which overlaps with the light-emitting portion after applying pressure.

7. A module comprising:
the light-emitting device manufactured in the method according to claim 1 ; and
a flexible printed circuit board or an integrated circuit.

8. An electronic device comprising:
the module according to claim 7 ; and
at least one of a sensor, an antenna, a battery, a housing, a camera, a speaker, a microphone, and an operation button.

Assignees

• Semiconductor Energy Lab

Inventors

• Chida Akihiro

Classifications

• Y02P70/521

  Cross-Sectional Technologies · mapped topic

• H01L51/56 Primary

  Electricity · mapped topic

• H01L51/5246

  Electricity · mapped topic

• H01L51/0097

  Electricity · mapped topic

• Y02E10/549

  Organic PV cells · CPC title