Manufacturing method of light-emitting device, light-emitting device, module, and electronic device

Patent metadata

Field	Value
Publication number	US-9917282-B2
Application number	US-201615220455-A
Country	US
Kind code	B2
Filing date	Jul 27, 2016
Priority date	Jul 30, 2015
Publication date	Mar 13, 2018
Grant date	Mar 13, 2018

Abstract

A highly reliable light-emitting device is provided. A yield in a manufacturing process of a light-emitting device is increased. A light-emitting device is provided in which a non-light-emitting portion having a frame-like shape outside a light-emitting portion includes a portion thinner than the light-emitting portion. A light-emitting element and a bonding layer are formed over a substrate. The light-emitting element is sealed by overlapping a pair of substrates and curing the bonding layer. Then, while the cured bonding layer is heated, pressure is applied to at least a portion of the non-light-emitting portion with a member having a projection.

First claim

The invention claimed is:

1. A method for manufacturing a light-emitting device comprising a light-emitting portion including a light-emitting element and a non-light-emitting portion having a frame-like shape outside the light-emitting portion, the method comprising:
forming the light-emitting element over a first substrate;
arranging a second substrate and the first substrate so as to overlap with each other with a bonding layer between the second substrate and the first substrate, wherein the light-emitting element is positioned in a space surrounded by the bonding layer, the first substrate, and the second substrate;
curing the bonding layer; and
applying pressure to at least a portion of the non-light-emitting portion with a member having a projection while heating the bonding layer after curing the bonding layer,
wherein a thickness of the bonding layer, in a direction from the first substrate to the second substrate, in a first region which overlaps with the non-light-emitting portion is smaller than a thickness of the bonding layer in a second region which overlaps with the light-emitting portion after applying pressure.

2. The method for manufacturing the light-emitting device according to claim 1 ,
wherein the non-light-emitting portion comprises a spacer and an inorganic insulating layer,
wherein the spacer and the inorganic insulating layer covering a side surface and a top surface of the spacer are formed over the first substrate or the second substrate before arranging the second substrate and the first substrate, and
wherein the projection overlaps with the inorganic insulating layer when applying pressure to at least the portion of the non-light-emitting portion with the member.

3. A method for manufacturing a light-emitting device comprising a light-emitting portion including a light-emitting element and a non-light-emitting portion having a frame-like shape outside the light-emitting portion, the method comprising:
forming a first separation layer over a first substrate;
forming a first layer to be separated over the first separation layer;
forming a second separation layer over a second substrate;
forming a second layer to be separated over the second separation layer;
arranging the second substrate and the first substrate so as to overlap with each other with a bonding layer between the second substrate and the first substrate, wherein the light-emitting element is positioned in a space surrounded by the bonding layer, the first substrate, and the second substrate;
curing the bonding layer;
separating the first substrate and the first layer to be separated from each other;
attaching a third substrate to the first separated layer;
separating the second substrate and the second layer to be separated from each other; and
applying pressure to at least a portion of the non-light-emitting portion with a member having a projection while heating the bonding layer after curing the bonding layer,
wherein an insulating layer and the light-emitting element over the insulating layer are formed as the first layer to be separated or the second layer to be separated, and
wherein the bonding layer overlaps with the first separation layer and the first layer to be separated before separating the first substrate and the first layer to be separated from each other.

4. The method for manufacturing the light-emitting device according to claim 3 , further comprising:
attaching a fourth substrate to the second separated layer between separating the second substrate and the second layer to be separated and applying pressure to at least the portion of the non-light-emitting portion with the member.

5. The method for manufacturing the light-emitting device according to claim 3 , further comprising:
attaching a fourth substrate to the second separated layer after applying pressure to at least the portion of the non-light-emitting portion with the member.

6. The method for manufacturing the light-emitting device according to claim 3 , further comprising:
forming a partition over the first substrate or the second substrate before arranging the second substrate and the first substrate,
wherein the partition is formed to surround the bonding layer.

7. The method for manufacturing the light-emitting device according to claim 3 ,
wherein the non-light-emitting portion comprises a spacer and an inorganic insulating layer,
wherein the spacer and the inorganic insulating layer covering a side surface and a top surface of the spacer are formed over the first substrate or the second substrate before arranging the second substrate and the first substrate, and
wherein the projection overlaps with the inorganic insulating layer when applying pressure to at least the portion of the non-light-emitting portion with the member.

8. A module comprising:
the light-emitting device manufactured in the method according to claim 1 ; and
a flexible printed circuit board or an integrated circuit.

9. An electronic device comprising:
the module according to claim 8 , and
at least one of a sensor, an antenna, a battery, a housing, a camera, a speaker, a microphone, and an operation button.

10. The method for manufacturing the light-emitting device, according to claim 3 , wherein a thickness of the bonding layer in a first region which overlaps with the non-light-emitting portion is smaller than a thickness of the bonding layer in a second region which overlaps with the light-emitting portion after applying pressure.

Assignees

• Semiconductor Energy Lab

Inventors

• Chida Akihiro

Classifications

• Y02E10/549

  Organic PV cells · CPC title

• H01L2251/5338

  Electricity · mapped topic

• H01L51/56 Primary

  Electricity · mapped topic

• H01L51/5246

  Electricity · mapped topic

• H01L51/0097

  Electricity · mapped topic