Hybrid round superconductor wires using Nb—Ti filaments

US12412681B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12412681-B2
Application numberUS-202017801984-A
CountryUS
Kind codeB2
Filing dateDec 23, 2020
Priority dateFeb 24, 2020
Publication dateSep 9, 2025
Grant dateSep 9, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A round superconductor wire, method for fabricating same, and method for detecting quench in the same are disclosed. A round superconductor wire includes a superconductor wire former and at least one superconductor tape wound on the superconductor wire former. Each superconductor tape includes a substrate, a buffer film stack overlying the substrate, and a superconductor film overlying the buffer film stack.

First claim

Opening claim text (preview).

What is claimed is: 1. A round superconductor wire comprising: a superconductor wire former; and at least one superconductor tape wound on the superconductor wire former, each superconductor tape comprising: a substrate; a buffer film stack overlying the substrate; and a superconductor film overlying the buffer film stack, wherein the superconducting wire has an engineering current density (J e ) of 400-1500 A/mm 2 at 4.2 K, 20 T. 2. The round superconductor wire of claim 1 , wherein the superconductor wire former comprises a composition selected from a group consisting of Nb—Ti, Nb3Sn, MgB2, Bi—Sr—Ca—Cu—O, and combinations thereof. 3. The round superconductor wire of claim 1 , wherein the superconductor wire former comprises a plurality of superconductor filaments. 4. The round superconductor wire of claim 1 , wherein the superconductor wire former comprises a composite comprising a plurality of superconductor filaments embedded within a non-superconducting metal matrix. 5. The round superconductor wire of claim 1 , wherein the superconductor wire former comprises a composite comprising a plurality of Nb—Ti filaments embedded within a copper matrix. 6. The round superconductor wire of claim 1 , wherein the at least one superconductor tape comprises at least two superconductor tapes. 7. The round superconductor wire of claim 1 , wherein the round superconductor wire comprises a diameter of 1-3 mm, and the superconductor wire former comprises a diameter of 0.4-1.1 mm. 8. A method for fabricating a round superconductor wire, the method comprising: providing a superconductor wire former; and winding a superconductor tape around the superconductor wire former; wherein the superconductor tape comprises: a substrate; a buffer film stack overlying the substrate; and a superconductor film overlying the buffer film stack, wherein the superconducting wire has an engineering current density (J e ) of 400-1500 A/mm 2 at 4.2 K, 20 T. 9. The method of claim 8 , wherein the superconductor wire former comprises a composition selected from a group consisting of Nb—Ti, Nb3Sn, MgB2, Bi—Sr—Ca—Cu—O, and combinations thereof. 10. The method of claim 8 , wherein the superconductor wire former comprises a plurality of superconductor filaments. 11. The method of claim 8 , wherein the superconductor wire former comprises a composite comprising a plurality of superconductor filaments embedded within a non-superconducting metal matrix. 12. The method of claim 8 , wherein the superconductor wire former comprises a composite comprising a plurality of Nb—Ti filaments embedded within a copper matrix. 13. The method of claim 8 , wherein the superconductor tape is a first superconductor tape, the method further comprises: winding a second superconductor tape around the first superconductor tape; wherein the second superconductor tape comprises: a substrate; a buffer film stack overlying the substrate; and a superconductor film overlying the buffer film stack. 14. The method of claim 8 , wherein the round superconductor wire comprises a diameter of 1-3 mm, and the superconductor wire former comprises a diameter of 0.4-1.1 mm. 15. A method for detecting quench in a round superconductor wire, the method comprising: employing the round superconductor wire in a coil configuration, wherein the round superconductor wire comprises a superconductor tape and a superconductor wire former on which the superconductor tape is wound; and monitoring current or voltage distribution between the superconductor tape and the superconductor wire former. 16. The method of claim 15 , wherein the superconductor wire former comprises a composition selected from a group consisting of Nb—Ti, Nb3Sn, MgB2, Bi—Sr—Ca—Cu—O, and combinations thereof. 17. The method of claim 15 , wherein the superconductor wire former comprises a plurality of superconductor filaments. 18. The method of claim 15 , wherein the superconductor wire former comprises a composite comprising a plurality of superconductor filaments embedded within a nonsuperconducting metal matrix. 19. The method of claim 15 , wherein the superconductor wire former comprises a composite comprising a plurality of Nb—Ti filaments embedded within a copper matrix. 20. The method of claim 15 , wherein the round superconductor wire comprises a diameter of 1-3 mm, and the superconductor wire former comprises a diameter of 0.4-1.1 mm.

Assignees

Inventors

Classifications

  • Details · CPC title

  • Stranded or braided wires · CPC title

  • Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment · CPC title

  • H01B12/06Primary

    Films or wires on bases or cores · CPC title

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Frequently asked questions

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What does patent US12412681B2 cover?
A round superconductor wire, method for fabricating same, and method for detecting quench in the same are disclosed. A round superconductor wire includes a superconductor wire former and at least one superconductor tape wound on the superconductor wire former. Each superconductor tape includes a substrate, a buffer film stack overlying the substrate, and a superconductor film overlying the buff…
Who is the assignee on this patent?
Univ Houston System, Ampeers Llc
What technology area does this patent fall under?
Primary CPC classification H01B12/06. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 09 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).