Superconductor and method for superconductor manufacturing

Patent metadata

Field	Value
Publication number	US-10453590-B2
Application number	US-201313907356-A
Country	US
Kind code	B2
Filing date	May 31, 2013
Priority date	Jun 1, 2012
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

Disclosed is a superconducting article comprising a silver overlayer consisting of no more than about 20% of grains over about 1 μm, having a minimum Vickers micro-hardness value of about 100, and a porosity of less than about 1%. A method of manufacturing a superconducting tape is disclosed as comprising, deposition of silver, oxygenation at about 400° C. for about 30 minutes, slitting, deposition of silver at a temperature of less than about 250° C., and application of copper.

First claim

I claim:

1. A superconducting tape comprising:
a substrate;
a biaxially-textured buffer layer overlying the substrate;
a superconducting film on the buffer layer; and
a silver layer deposited on the superconducting film, comprising:
an oxygenated first silver layer comprising a porosity of less than about 1%, and
a second silver layer formed on the first silver layer, wherein the second silver layer is not oxygenated,

wherein the silver layer comprises less than about 20% of silver grains over about 1 μm in size.

2. The tape of claim 1 , wherein the silver layer has a minimum Vickers micro-hardness value of about 100.

3. The tape of claim 1 , further comprising a copper layer overlying the silver layer.

4. A superconducting tape comprising:
a substrate;
a biaxially-textured buffer layer overlying the substrate;
a superconducting film on the buffer layer; and
a silver layer deposited on the superconducting film, comprising:
an oxygenated first silver layer, and
a final silver layer disposed above the first silver layer, wherein the final silver layer is not oxygenated.

5. The tape of claim 4 , wherein the silver layer comprises less than about 20% of silver grains over about 1 μm in size.

6. A superconducting tape comprising:
a substrate;
a biaxially-textured buffer layer overlying the substrate;
a superconducting film on the buffer layer; and
a silver layer deposited on the superconducting film, comprising:
a first silver layer comprising a porosity of less than about 1%, and
a second silver layer deposited on the first silver layer, wherein the second silver layer is not oxygenated, and wherein the silver layer comprises less than about 20% of silver grains over about 1 μm in size.

7. The tape of claim 6 , wherein the silver layer has a minimum Vickers micro-hardness value of about 100.

8. A superconducting tape comprising:
a substrate;
a biaxially-textured buffer layer overlying the substrate;
a superconducting film on the buffer layer; and
a silver layer deposited on the superconducting film, comprising:
a first silver layer, and
a final silver layer disposed above the first silver layer, wherein the final silver layer is not oxygenated;

wherein the first silver layer comprises a porosity of less than about 1%.

9. A superconducting tape comprising:
a substrate;
a biaxially-textured buffer layer overlying the substrate;
a superconducting film on the buffer layer; and
a silver layer deposited on the superconducting film, comprising:
a first silver layer, and
a final silver layer disposed above the first silver layer, wherein the final silver layer is not oxygenated;

wherein the silver layer has a minimum Vickers micro-hardness value of about 100.

10. A superconducting tape comprising:
a substrate;
a biaxially-textured buffer layer overlying the substrate;
a superconducting film on the buffer layer; and
a silver layer deposited on the superconducting film, comprising:
an oxygenated first silver layer; and
a second silver layer deposited on the first silver layer, wherein the second silver layer is not oxygenated.

11. The tape of claim 10 , wherein the silver layer comprises less than about 20% of silver grains over about 1 μm in size.

12. A superconducting tape comprising:
a substrate;
a biaxially-textured buffer layer overlying the substrate;
a superconducting film on the buffer layer; and
a silver layer deposited on the superconducting film, comprising:
a first silver layer; and
a second silver layer deposited on the first silver layer, wherein the second silver layer is not oxygenated;

wherein the first silver layer comprises a porosity of less than about 1%.

13. A superconducting tape comprising:
a substrate;
a biaxially-textured buffer layer overlying the substrate;
a superconducting film on the buffer layer; and
a silver layer deposited on the superconducting film, comprising:
a first silver layer; and
a second silver layer deposited on the first silver layer, wherein the second silver layer is not oxygenated;

wherein the silver layer has a minimum Vickers micro-hardness value of about 100.

14. A superconducting tape comprising:
a substrate;
a biaxially-textured buffer layer overlying the substrate;
a superconducting film on the buffer layer; and
a silver layer deposited on the superconducting film, comprising:
an oxygenated first silver layer and a final silver layer, wherein the final silver layer is not oxygenated.

15. The tape of claim 14 , wherein the silver layer comprises less than about 20% of silver grains over about 1 μm in size.

16. A superconducting tape comprising:
a substrate;
a biaxially-textured buffer layer overlying the substrate;
a superconducting film on the buffer layer; and
a silver layer deposited on the superconducting film, comprising:
a first silver layer and a final silver layer,

wherein the final silver layer is not oxygenated; and
wherein the first silver layer comprises a porosity of less than about 1%.

17. A superconducting tape comprising:
a substrate;
a biaxially-textured buffer layer overlying the substrate;
a superconducting film on the buffer layer; and
a silver layer deposited on the superconducting film, comprising:
a first silver layer and a final silver layer,

wherein the final silver layer is not oxygenated; and
wherein the silver layer has a minimum Vickers micro-hardness value of about 100.

Assignees

• Univ Houston System

Inventors

• Selvamanickam Venkat

Classifications

• H01B12/06 Primary

  Films or wires on bases or cores · CPC title

• H01B13/0036

  Details · CPC title

• H01L39/247

  Electricity · mapped topic

• H01L39/126

  Electricity · mapped topic

• H10N60/0716

  Passivating · CPC title