Oxide superconducting wire, superconducting device, and method for producing oxide superconducting wire

Patent metadata

Field	Value
Publication number	US-10128025-B2
Application number	US-201515501248-A
Country	US
Kind code	B2
Filing date	Jul 2, 2015
Priority date	Aug 5, 2014
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

An oxide superconducting wire includes: a laminate which is formed by laminating a tape-shaped base, an intermediate layer, and an oxide superconducting layer; a first protective layer which is formed of Ag or an Ag alloy and is laminated on a main surface of the oxide superconducting layer of the laminate; a second protective layer which is formed of Cu or a Cu alloy, is laminated on a main surface of the first protective layer by performing film formation one or more times, and has a thickness of 0.3 μm to 10 μm; and a stabilization layer which is bonded to a main surface of the second protective layer with a solder layer interposed therebetween, wherein the second protective layer is formed to have a thickness of equal to or less than 2.1 μm per film formation.

First claim

The invention claimed is:

1. An oxide superconducting wire comprising:
a laminate which is formed by laminating a tape-shaped base, an intermediate layer, and an oxide superconducting layer;
a first protective layer which is formed of Ag or an Ag alloy and is laminated on a main surface of the oxide superconducting layer of the laminate;
a second protective layer which is formed of Cu or a Cu alloy, is laminated on a main surface of the first protective layer by performing film formation one or more times, and has a thickness of 0.3 μm to 10 μm, the second protective layer being formed of a plurality of laminated layers where each of the laminated layers has a thickness of equal to or less than 2.1 μm; and
a stabilization layer which is bonded to a main surface of the second protective layer with a solder layer interposed therebetween,
wherein the second protective layer is formed to have a thickness of equal to or less than 2.1 μm per film formation in each of the laminated layers.

2. The oxide superconducting wire according to claim 1 ,
wherein the oxide superconducting layer is formed to include a neutral surface in a thickness direction of an entire of the oxide superconducting wire.

3. The oxide superconducting wire according to claim 1 , further comprising:
a rear surface layer which is laminated on a rear surface of the base of the laminate and is formed of Cu or a Cu alloy,
wherein the stabilization layer is arranged to wrap around both side surfaces from a main surface of the laminate and to reach a rear surface, and is bonded to the rear surface layer with a solder layer interposed therebetween.

4. The oxide superconducting wire according to claim 1 ,
wherein the stabilization layer is formed of one of a group consisting of a Ni—Cr alloy, a Ni alloy, stainless steel, and brass.

5. The oxide superconducting wire according to claim 1 ,
wherein the second protective layer has a thickness of equal to or less than 2.1 μm.

6. A superconducting device comprising:
the oxide superconducting wire according to claim 1 .

7. A method of producing an oxide superconducting wire, the method comprising:
preparing a laminate in which an intermediate layer and an oxide superconducting layer are formed on a tape-shaped base;
forming a first protective layer formed of Ag or an Ag alloy on a main surface of the oxide superconducting layer of the laminate using a sputtering method;
forming a second protective layer formed of Cu or a Cu alloy to have a thickness of 0.3 μm to 2.1 μm on a main surface of the first protective layer using a sputtering method; and
forming a stabilization layer by bonding a metal tape to a main surface of the second protective layer with a solder layer interposed therebetween,
wherein, when forming the second protective layer, film formation is performed one or more times, and the second protective layer is formed to have a thickness of equal to or less than 2.1 μm per film formation, such that the second protective layer is formed of a plurality of laminated layers where each of the laminated layers has a thickness of equal to or less than 2.1 μm.

8. The method of producing an oxide superconducting wire according to claim 7 ,
wherein, before forming the stabilization layer, a rear surface layer formed of Cu or a Cu alloy is formed on a rear surface of the base of the laminate using a sputtering method, and
when forming the stabilization layer, the metal tape is arranged to wrap around the rear surface by way of both side surfaces from a main surface of the laminate, and the metal tape is bonded to the rear surface layer with a solder layer interposed therebetween.

Assignees

• Fujikura Ltd

Inventors

• KURIHARA Chihaya

Classifications

• H01B13/22

  Sheathing; Armouring; Screening; Applying other protective layers (H01B13/32 takes precedence) · CPC title

• H01B12/06 Primary

  Films or wires on bases or cores · CPC title

• H01B13/0026

  Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal · CPC title

• H01F2006/001

  Constructive details of inductive current limiters · CPC title

• H01B12/02

  characterised by their form · CPC title