Silicon metal oxide encapsulation film comprising metal or metal oxide in thin film, and manufacturing method therefor

Patent metadata

Field	Value
Publication number	US-12398459-B2
Application number	US-202017435350-A
Country	US
Kind code	B2
Filing date	Mar 6, 2020
Priority date	Mar 8, 2019
Publication date	Aug 26, 2025
Grant date	Aug 26, 2025

Abstract

The present invention relates to a silicon oxide encapsulation film comprising a metal or a metal oxide, and a manufacturing method therefor. The silicon metal oxide encapsulation film according to the present invention has a high thin film growth rate and low moisture and oxygen permeabilities, thereby exhibiting a very excellent sealing effect even at a low thickness, and the stress strength and refractive index thereof can be controlled, thereby enabling a high-quality silicon metal oxide encapsulation film that is applicable to a flexible display to be readily manufactured.

First claim

What is claimed is:

1. A silicon metal oxide encapsulation layer formed on a substrate, wherein the silicon metal oxide encapsulation layer comprises a silicon metal oxide represented by the following Chemical Formula 1:
Si x M y O z   [Chemical Formula 1]

wherein
M is a metal selected from the group consisting of Zr, Ga, In, Sn, Pb, V, Cu, Ag, Nb and Cd,
x satisfies 0.1<x<1,
y satisfies 0<y<2,
z satisfies 1≤z≤3,
x+y satisfies 1<x+y<3, and
x+y+z satisfies 1.5<x+y+z<6.

2. The silicon metal oxide encapsulation layer of claim 1 , wherein the encapsulation layer is an encapsulation layer for a display OLED.

3. The silicon metal oxide encapsulation layer of claim 1 , wherein the silicon metal oxide encapsulation layer includes a metal atom at a content within 1 to 50 at % relative to a total content of a silicon metal oxide.

4. The silicon metal oxide encapsulation layer of claim 1 , wherein the silicon metal oxide encapsulation layer has a vapor transmission rate of 1.0×10 −2 to 1.0×10 −6 g/m 2- day.

5. The silicon metal oxide encapsulation layer of claim 1 , wherein the silicon metal oxide encapsulation layer has a stress of −700 to +700 MPa and a refractive index of 1.0 to 10.

6. The silicon metal oxide encapsulation layer of claim 1 , wherein the silicon metal oxide encapsulation layer is dry-etched by one or more etching gases selected from fluorine-containing compounds, NF 3 , and BCl 3 .

7. The silicon metal oxide encapsulation layer of claim 1 , wherein the silicon metal oxide encapsulation layer has a thickness of 50 to 700 Å.

8. A method of producing the silicon metal oxide encapsulation layer formed on a substrate according to claim 1 , using an atomic layer deposition (ALD), comprising:
introducing a metal precursor which is an organometal compound including at least one metal element selected from the group consisting of Zr, Ga, In, Sn, Pb, V, Cu, Ag, Nb and Cd as a central metal and a silicon precursor into a reactor at the same time so that the precursors are in contact with the substrate; and
bringing a reaction gas into contact with the substrate.

9. The method of claim 8 , wherein the silicon precursor is an organoaminosilane compound including a Si-N bond.

10. The method of claim 8 , wherein the atomic layer deposition (ALD) is a plasma enhanced atomic layer deposition (PEALD).

11. The method of claim 8 , wherein the reaction gas is one or two or more selected from O 2 , N 2 O, NO 2 , H 2 O, H 2 O 2 , and O 3 .

12. A multilayer thin film for an OLED comprising: a substrate, a first layer including a first silicon metal oxide represented by the following Chemical Formula 1, a second layer including a crosslinkable polymer, disposed on the first layer, and a third layer including a second silicon metal oxide represented by the following Chemical Formula 1, disposed on the second layer, wherein the first silicon metal oxide and the second silicon metal oxide are the same as or different from each other:
Si x M y O z   [Chemical Formula 1]

wherein
M is a metal which is at least one selected from the group consisted of Zr, Ga, In, Sn, Pb, V, Cu, Ag, Nb and Cd,
x satisfies 0.1<x<1,
y satisfies 0<y<2,
z satisfies 1≤z≤3,
x+y satisfies 1<x+y<3, and
x+y+z satisfies 1.5<x+y+z<6.

13. The multilayer thin film for an OLED of claim 12 , wherein the substrate is a flexible transparent substrate.

14. The multilayer thin film for an OLED of claim 12 , wherein the multilayer thin film has a radius of curvature of 2R or less.

15. An OLED device comprising the silicon metal oxide encapsulation layer formed on the substrate according to claim 1 .

Assignees

• Dnf Co Ltd

Inventors

• Kim Myoung Woon
• Lee Sang Ick
• Jang Se Jin
• Kim Sung Gi
• Park Jeong Joo
• Chae Won Mook
• Cho A Ra
• Yang Byeong Il
• Park Joong Jin
• Park Gun Joo
• Lee Sam Dong
• Lim Haeng Don
• Jeon Sang Yong

Classifications

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10K2102/311

  Flexible OLED · CPC title

• C23C16/45531

  specially adapted for making ternary or higher compositions · CPC title