Common terminal heater for ceramic pedestals used in semiconductor for fabrication

Patent metadata

Field	Value
Publication number	US-12379720-B2
Application number	US-201916506933-A
Country	US
Kind code	B2
Filing date	Jul 9, 2019
Priority date	Feb 17, 2016
Publication date	Aug 5, 2025
Grant date	Aug 5, 2025

Abstract

System and methods for processing a substrate using a reactor with multiple heating zones and control of said heating zones using a common terminal shared between two power supplies are provided. The reactor includes a heater assembly for supporting the substrate and a showerhead for supplying process gases into the reactor. An inner heater and an outer heater are integrated in the heater assembly. An inner power supply has a positive terminal connected to a first end of the inner heater and a negative terminal is connected to a second end of the inner heater that is coupled to a common terminal. An outer power supply has a positive terminal connected to a first end of the outer heater and a negative terminal connected to a second end of the outer heater that is coupled to the common terminal. A common-terminal heater module is configured to receive a measured temperature that is proximate to the inner heater. A desired temperature setting is received and a servo control law is processed to identify a direct control setting of an inner voltage of the inner power supply and an open-loop control setting of an outer voltage for the outer power supply. The outer voltage is defined as a ratio of the inner voltage.

First claim

What is claimed is:

1. A system for processing a substrate, comprising:
a reactor including a pedestal for supporting the substrate, the reactor configured to receive process gases;
a first resistive element integrated in the pedestal and extending for a first length;
a second resistive element integrated in the pedestal and extending for a second length, a first area covered by the first resistive element and a second area covered by the second resistive element define distinct heater zones,
wherein an inner power supply has a positive terminal connected to a first end of the first resistive element and a negative terminal connected to a second end of the first resistive element through a common terminal connection;
wherein an outer power supply has a positive terminal connected via a first wire to a first end of the second resistive element and a negative terminal connected via a second wire to a second end of the second resistive element through the common terminal connection, each of the first and the second wires have a substantially lower resistance than each of the first and the second resistive elements;
wherein the first and the second resistive elements vary in dimensions defined by the first length and the second length
wherein the common terminal connection is configured to electrically couple the second end of the first resistive element to the second end of the second resistive element; and
a common-terminal heater module is configured to provide a direct control setting of an inner voltage of the inner power supply and to determine an open-loop control setting of an outer voltage for the outer power supply as a ratio of the inner voltage, and
wherein the common-terminal heater module defines the ratio by proportioning the outer voltage of the outer power supply and the inner voltage of the inner power supply to compensate for difference in the dimensions defined by the first and the second lengths of and areas covered by the first and the second resistive elements.

2. The system of claim 1 , wherein the second resistive element is arranged to surround the first resistive element.

3. The system of claim 1 , wherein the common-terminal heater module is connected to the pedestal and is configured to receive a measured temperature from a region proximate to the first resistive element of the pedestal and a desired temperature setting and process a servo control law to provide the direct control setting and determine the open-loop control setting.

4. The system of claim 1 , wherein the common-terminal heater module proportions the ratio to achieve custom temperature setting at a region covered by the first resistive element and a region covered by the second resistive element.

5. The system of claim 1 , wherein the common terminal connection allows defining n heater zones with n+1 connections.

6. A pedestal for use in a system for processing a substrate, comprising:
an inner resistive element integrated in the pedestal and extending for a first length;
an outer resistive element integrated in the pedestal and extending for a second length, the outer resistive element arranged to surround the inner resistive element to define distinct heater zones,
wherein an inner power supply has a positive terminal connected to a first end of the inner resistive element and a negative terminal connected to a second end of the inner resistive element through a common terminal connection;
wherein an outer power supply has a positive terminal connected via a first wire to a first end of the outer resistive element and a negative terminal connected via a second wire to a second end of the outer resistive element through the common terminal connection, each of the first and the second wires having a substantially lower resistance than each of the inner resistive element and the outer resistive element,
wherein the first and the second resistive elements vary in dimensions defined by the first length and the second length
wherein the common terminal connection is configured to electrically couple the second end of the inner resistive element to the second end of the outer resistive element; and
the pedestal is configured to connect to a common-terminal heater module that receives a measured temperature from a region proximate to the inner resistive element, the common-terminal heater module receives a desired temperature setting for heating the distinct heater zone defined by the inner resistive element and processes a servo control law to identify a direct control setting of an inner voltage of the inner power supply and determine an open-loop control setting of an outer voltage for the outer power supply,
wherein the outer voltage is defined as a ratio of the inner voltage, wherein the ratio is specific to a process performed in the system and is defined based on process parameters defined for the process, and wherein the common-terminal heater module proportions the ratio to consider increase in amperage requirements due to cabling of the common terminal connection and to compensate for difference in the lengths of and regions covered by the inner and the outer resistive elements.

7. The pedestal of claim 6 , wherein the common-terminal heater module proportions the ratio of the outer voltage to the inner voltage to achieve custom temperature setting at a first region covered by the inner resistive element and a second region covered by the outer resistive element.

8. The pedestal of claim 7 , wherein the custom temperature setting is defined such that temperature in the first region covered by the inner resistive element is different from temperature in the second region covered by the outer resistive element.

9. The pedestal of claim 7 , wherein the custom temperature settings for the first and the second regions covered by the inner and the outer resistive elements are each dynamically defined in substantial real time for different processing stages, the custom temperature setting being part of process parameters.

10. The pedestal of claim 7 , wherein the custom temperature settings for the first and the second regions covered by the inner resistive element and the outer resistive element are defined, such that temperature in each of the first and the second regions is distinct and is uniform across respective region.

11. The pedestal of claim 6 , wherein a resistive value of each of the inner resistive element and the outer resistive element changes as a function of temperature.

12. The pedestal of claim 6 , wherein inner resistive element defines an inner heater zone and the outer resistive element defines an outer heater zone, and wherein the common terminal connection allows defining n heater zones with n+1 connections.

13. The pedestal of claim 6 , further comprising,
a temperature sensor is disposed in the pedestal in a region proximate to the inner resistive element to obtain the measured temperature of the pedestal in the region proximate to the inner resistive element.

14. The pedestal of claim 6 , wherein the pedestal is defined from a ceramic material.

15. The pedestal of claim 6 , wherein the common terminal connection is defined outside of the pedestal.

16. The pedestal of claim 6 , wherein the servo control law processes a closed loop analysis of a difference between the desired temperature and a measured temperature from the inner resistive element, and wherein the closed loop analysis is configured to iterate until the measured temperature is equal to the desired temperature.

Assignees

• Lam Res Corp

Inventors

• Leeser Karl F

Classifications

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title