Server apparatus and solid-state storage device thereof

Patent metadata

Field	Value
Publication number	US-12376262-B2
Application number	US-202318330586-A
Country	US
Kind code	B2
Filing date	Jun 7, 2023
Priority date	Oct 9, 2022
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

A solid-state storage device is provided. The solid-state storage device includes a case, a solid-state storage module, and a heat dissipation unit. The case includes a receiving space. The solid-state storage module is disposed in the receiving space of the case. The heat dissipation unit is connected to the case. The heat dissipation unit covers the receiving space and is thermally connected to the solid-state storage module. The heat dissipation unit includes a working fluid, a cooling channel, and at least one heat conductive rib. The cooling channel extends into the heat dissipation unit. The working fluid travels in the cooling channel. The heat conductive rib extends into the cooling channel. The solid-state storage device satisfies the specification of SNIA SFF-TA-1008.

First claim

What is claimed is:

1. A solid-state storage device, comprising:
a case, comprising a receiving space;
a solid-state storage module, disposed in the receiving space of the case; and
a heat dissipation unit, connected to the case, wherein the heat dissipation unit covers the receiving space and is thermally connected to the solid-state storage module, the heat dissipation unit comprises a working fluid, a cooling channel and at least one heat conductive rib, the cooling channel extends into the heat dissipation unit, the working fluid travels in the cooling channel, and the heat conductive rib extends into the cooling channel,
wherein the solid-state storage device satisfies the specification of SNIA SFF-TA-1008.

2. The solid-state storage device as claimed in claim 1 , wherein the solid-state storage device satisfies the specification of E3S-2T.

3. The solid-state storage device as claimed in claim 1 , wherein the heat dissipation unit comprises a first unit housing and a second unit housing, the second unit housing is located between the first unit housing and the solid-state storage module, the first unit housing comprises a first groove, the second unit housing comprises a second groove, and the first groove is combined with the second groove to form the cooling channel.

4. The solid-state storage device as claimed in claim 3 , wherein the first unit housing comprises a plurality of first heat conductive ribs, the first heat conductive ribs are formed in the first groove and extend along the first groove, the second unit housing comprises a plurality of second heat conductive ribs, the second heat conductive ribs are formed in the second groove and extend along the second groove, and the first heat conductive ribs correspond to the second heat conductive ribs.

5. The solid-state storage device as claimed in claim 3 , wherein the heat dissipation unit further comprises two elastic waterproof strips, the first unit housing comprises two waterproof slots, the waterproof slots are formed on both sides of the first groove and extend along the first groove, and the elastic waterproof strips are embedded in the waterproof slots.

6. The solid-state storage device as claimed in claim 5 , wherein the second unit housing comprises two waterproof ribs, the waterproof ribs are formed on both sides of the second groove and extend along the second groove, the waterproof ribs press the elastic waterproof strips, and the waterproof ribs are inserted into the waterproof slots.

7. The solid-state storage device as claimed in claim 3 , wherein the heat dissipation unit further comprises a first joint and a second joint, the first joint is connected to the first unit housing and the second unit housing and communicates with one end of the cooling channel, and the second joint is connected to the first unit housing and the second unit housing and communicates with the other end of the cooling channel.

8. The solid-state storage device as claimed in claim 3 , wherein the first unit housing comprises a plurality of heat dissipation protrusions and a first surface, and the heat dissipation protrusions are formed on the first surface.

9. The solid-state storage device as claimed in claim 8 , wherein the heat dissipation protrusions comprise a plurality of first heat dissipation protrusions and a plurality of second heat dissipation protrusions, the first heat dissipation protrusions are arranged in a matrix, a length of each second heat dissipation protrusion is longer than a length of each first heat dissipation protrusion, and the second heat dissipation protrusions are parallel to each other.

10. The solid-state storage device as claimed in claim 8 , wherein the second unit housing comprises a second surface, the second surface is opposite to the first surface, the second surface faces the solid-state storage module, and the second surface is connected to the solid-state storage module.

11. The solid-state storage device as claimed in claim 10 , wherein the heat dissipation unit comprises a plurality of unit bolts, the second unit housing comprises a plurality of housing through holes, and the unit bolts pass through the housing through holes from the second surface to affix the second unit housing to the first unit housing.

12. The solid-state storage device as claimed in claim 10 , further comprising a plurality of thermal pads, wherein the thermal pads are sandwiched between the solid-state storage module and the second surface of the second unit housing.

13. The solid-state storage device as claimed in claim 10 , wherein the solid-state storage module comprises a substrate, a controller chip, a plurality of DRAM chips and a plurality of flash memory chips, wherein the controller chip, the DRAM chips and the flash memory chips are disposed on the substrate, and the controller chip, at least a portion of the DRAM chips and at least a portion of the flash memory chips are thermally connected to the second surface of the second unit housing via the thermal pads.

14. The solid-state storage device as claimed in claim 13 , wherein the solid-state storage module further comprises a plurality of power supplies and a capacitor, and the power supplies and the capacitor are disposed on the substrate.

15. A server apparatus, comprising:
a mainboard;
a cooling circulation pipeline; and
a plurality of solid-state storage devices, coupled to the circuit board, wherein
at least one of the solid-state storage devices comprises:
a case, comprising a receiving space;
a solid-state storage module, disposed in the receiving space of the case; and
a heat dissipation unit, connected to the case, wherein the heat dissipation unit covers the receiving space and is thermally connected to the solid-state storage module, the heat dissipation unit comprises a cooling channel and at least one heat conductive rib, the cooling channel extends into the heat dissipation unit, the cooling channel communicates with the cooling circulation pipeline, a working fluid travels in the cooling channel and the cooling circulation pipeline, and the heat conductive rib extends into the cooling channel,

wherein the solid-state storage device satisfies the specification of SNIA SFF-TA-1008.

Assignees

• Shannon Systems Ltd

Inventors

• Li Jiangshan
• He Jia

Classifications

• H05K7/20772

  within server blades for removing heat from heat source · CPC title

• G06F1/183

  Internal mounting support structures, e.g. for supporting printed circuit boards · CPC title

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title

• G06F1/20 Primary

  Cooling means · CPC title