Solid state memory device

Patent metadata

Field	Value
Publication number	US-10477706-B1
Application number	US-201916423438-A
Country	US
Kind code	B1
Filing date	May 28, 2019
Priority date	Mar 7, 2019
Publication date	Nov 12, 2019
Grant date	Nov 12, 2019

Abstract

A solid state memory device is provided. The solid state memory device includes a housing and a solid state memory module. The housing includes a housing fastening member, a first housing member, and a second housing member, wherein the second housing member is connected to the first housing member. The solid state memory module is disposed in the housing. The first housing member includes a plurality of first wedging portions, and the second housing member includes a plurality of second wedging portions. Each first wedging portion wedges the corresponding second wedging portion in a first direction. The first housing member further includes a first fastening portion, and the second housing member further includes a second fastening portion. The housing fastening member affixes the first fastening portion to the second fastening portion in a second direction, wherein the first direction differs from the second direction.

First claim

What is claimed is:

1. A solid state memory device, comprising:
a housing, comprising a housing fastening member, a first housing member, and a second housing member, wherein the second housing member is connected to the first housing member; and
a solid state memory module, disposed in the housing,
wherein the first housing member comprises a plurality of first wedging portions, the second housing member comprises a plurality of second wedging portions, each first wedging portion wedges the corresponding second wedging portion in a first direction, the first housing member further comprises a first fastening portion, the second housing member further comprises a second fastening portion, the housing fastening member affixes the first fastening portion to the second fastening portion in a second direction, and the first direction differs from the second direction.

2. The solid state memory device as claimed in claim 1 , wherein the first direction is perpendicular to the second direction.

3. The solid state memory device as claimed in claim 1 , wherein each first wedging portion comprises a protrusion, each second wedging portion comprises a recess, and the protrusion is inserted into the recess and is wedged into the recess.

4. The solid state memory device as claimed in claim 3 , wherein the protrusion comprises a first protrusion end and a second protrusion end, a width of the first protrusion end is smaller than a width of the second protrusion end, the recess comprises a first recess end and second recess end, a width of the first recess end is smaller than a width of the second recess end, and when the protrusion is inserted into the recess and is wedged into the recess, the first protrusion end correspondingly connects to the first recess end, and the second protrusion end correspondingly connects to the second recess end.

5. The solid state memory device as claimed in claim 3 , wherein the first housing member comprises an inner surface, the second housing member comprises a plurality of posts, the first wedging portions are formed on the inner surface, and the second wedging portions are respectively formed on the posts.

6. The solid state memory device as claimed in claim 5 , wherein each post comprises a post planer surface and a post curved surface, the post planer surface is opposite the post curved surface, the post curved surface faces the solid state memory module, and the second wedging portion is formed on the post planer surface.

7. The solid state memory device as claimed in claim 5 , wherein the posts comprise a first post and a second post, the first post comprises a first post planer surface, one of the second wedging portions is formed on the first post planer surface, and the second fastening portion is formed on the first post planer surface.

8. The solid state memory device as claimed in claim 7 , wherein the first fastening portion is a through hole, the second fastening portion is a slot, the housing fastening member is a bolt, and the housing fastening member passes through the first fastening portion in the second direction to be affixed to the second fastening portion.

9. The solid state memory device as claimed in claim 1 , wherein the solid state memory module comprises a first circuit board and a second circuit board, the first circuit board is coupled to the second circuit board, the first circuit board is parallel to the second circuit board, the first circuit board comprises a plurality of first memory chips, the second circuit board comprises a plurality of second memory chips, a gap is formed between the first circuit board and the second circuit board, the first housing member comprises a plurality of first ventilation holes, the second housing member comprises a plurality of second ventilation holes, the first ventilation holes are corresponding to the second ventilation holes, and the first ventilation holes and the second ventilation holes are both corresponding to the gap.

10. The solid state memory device as claimed in claim 9 , wherein the second circuit board comprises a connection port, the second housing member comprises a notch, and the connection port is exposed in the notch.

Assignees

• Shannon Systems Ltd

Inventors

• Wang Xinglong
• Li Jiangshan

Classifications

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title

• H05K1/144

  Stacked arrangements of planar printed circuit boards · CPC title

• H05K5/0213

  Venting apertures; Constructional details thereof · CPC title

• H05K5/0047 Primary

  having a two-part housing enclosing a PCB · CPC title

• H05K2201/10159

  Memory · CPC title