Memory device with daughter board fastening structure

Patent metadata

Field	Value
Publication number	US-10123441-B2
Application number	US-201715469798-A
Country	US
Kind code	B2
Filing date	Mar 27, 2017
Priority date	Dec 28, 2016
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

A memory device is provided. The memory device includes a motherboard, a controller, a first memory unit, a second memory unit and a heat sink. The motherboard includes a contact portion. The controller is disposed on the motherboard and corresponds to the contact portion. The first memory unit is coupled to the motherboard. The first memory unit is located on one side of the controller. The first memory unit includes a plurality of first memory chips. The second memory unit is coupled to the motherboard. The second memory unit is located on another side of the controller. The second memory unit includes a plurality of second memory chips. The heat sink is thermally connected to the controller. The heat sink is located between the first memory unit and the second memory unit.

First claim

What is claimed is:

1. A memory device, comprising:
a motherboard, wherein the motherboard comprises a contact portion;
a controller, disposed on the motherboard and corresponding to the contact portion;
a first memory unit, coupled to the motherboard, wherein the first memory unit is located on one side of the controller, and the first memory unit comprises a plurality of first memory chips;
a second memory unit, coupled to the motherboard, wherein the second memory unit is located on another side of the controller, and the second memory unit comprises a plurality of second memory chips;
a heat sink, thermally connected to the controller, wherein the heat sink is located between the first memory unit and the second memory unit, wherein number of first memory chips is equal to number of second memory chips, wherein the first memory unit comprises a first daughter board, the second memory unit comprises a second daughter board, the first memory chips are disposed on the first daughter board, the second memory chips are disposed on the second daughter board, and the first daughter board and the second daughter board are coupled to the motherboard;
a metal plate, wherein the motherboard comprises a first surface and a second surface, the controller is disposed on the first surface, and the metal plate is affixed to the second surface, wherein the motherboard comprises a first connector, a second connector, a third connector and a fourth connector, the first daughter board is connected to the first connector and a second connector, and the second daughter board is connected to the third connector and the fourth connector; and
a plurality of first fasteners and a plurality of second fasteners, the first daughter board comprises a plurality of first connection posts, the second daughter board comprises a plurality of second connection posts, the first fasteners pass the metal plate and the motherboard and are affixed to the first connection posts, and the second fasteners pass the metal plate and the motherboard and are affixed to the second connection posts.

2. The memory device as claimed in claim 1 , wherein the motherboard comprises a metal layer, and the metal plate is thermally connected to the metal layer.

3. The memory device as claimed in claim 1 , wherein the heat sink comprises a plurality of fins, and an extending direction of the fins is parallel to an extending direction of the first connector, the second connector, the third connector and the fourth connector.

4. The memory device as claimed in claim 1 , wherein the memory device is a full-height peripheral component interconnect memory card, the first memory chips sequentially comprise a first chip row, a second chip row, a third chip row and a fourth chip row, the first connector is located between the first chip row and the second chip row, and the second connector is located between the third chip row and the fourth chip row.

Assignees

• Shannon Systems Ltd

Inventors

• Wang Xinglong
• He Jia
• Chen Xiaoyan

Classifications

• H05K2201/10189

  Non-printed connector · CPC title

• H05K2201/10159

  Memory · CPC title

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title

• H05K1/147

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title

• H05K1/141 Primary

  One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence) · CPC title