Metal particle for adhesive paste, method of preparing the same, solder paste including the same, composite bonding structure formed therefrom, and semiconductor device including the composite bonding structure

Patent metadata

Field	Value
Publication number	US-12370632-B2
Application number	US-202217965197-A
Country	US
Kind code	B2
Filing date	Oct 13, 2022
Priority date	Oct 15, 2021
Publication date	Jul 29, 2025
Grant date	Jul 29, 2025

Abstract

Provided is a metal particle for adhesive paste. The metal particle may include a core including at least one metal; and a shell on at least one surface of the core and including at least one metal and nanoparticles. The metal particle may be a transient liquid phase particle and the at least one metal of the core may have a higher melting point than a melting point of the at least one metal of the shell. In addition, provided are a method of preparing the metal particle for adhesive paste, a composite bonding structure formed from the metal particle for adhesive paste, and a semiconductor device including the composite bonding structure.

First claim

What is claimed is:

1. A metal particle for adhesive paste, the metal particle comprising:
a core including at least one metal;
and a shell on a surface of the core, the shell comprising at least one metal and nanoparticles,
wherein the metal particle is a transient liquid phase particle, and
the at least one metal of the core has a higher melting point than a melting point of the at least one metal of the shell.

2. The metal particle for adhesive paste of claim 1 , wherein the nanoparticles include at least one of metal oxides, metal nitrides, semimetal nitrides, metal carbides, graphene, and carbon nanotubes.

3. The metal particle for adhesive paste of claim 1 , wherein an amount of the nanoparticles is 0.01 wt % to 10 wt % with respect to a total weight of the shell.

4. The metal particle for adhesive paste of claim 1 , wherein the nanoparticles each have a size of 1 nm to 1,000 nm.

5. The metal particle for adhesive paste of claim 1 , wherein the nanoparticles include at least one of La 2 O 3 , CeO 2 , SiC, ZrO 2 , TiO 2 , Y 2 O 3 , and AlN.

6. The metal particle for adhesive paste of claim 1 , wherein the nanoparticles are present at a grain boundary of the at least one metal of the shell.

7. The metal particle for adhesive paste of claim 1 , wherein
the core has a diameter of 1 μm to 100 μm,
the shell has a thickness of 100 nm to 20 μm, and
a ratio of a thickness of the shell to a thickness of the core in the metal particle is 0.05 to 0.5.

8. The metal particle for adhesive paste of claim 1 , wherein the core comprises one of tin, copper, gold, silver, germanium, antimony, aluminum, titanium, palladium, chromium, molybdenum, nickel, tungsten, zinc, or a combination thereof.

9. The metal particle for adhesive paste of claim 1 , wherein the shell comprises one of tin, indium, gallium, silver, bismuth, zinc, or a combination thereof.

10. The metal particle for adhesive paste of claim 1 , wherein
the at least one metal of the core comprises copper, and
the at least one metal of the shell comprises one of indium, silver, or a combination thereof, and
the nanoparticles in the shell comprise one or more of CeO 2 , La 2 O 3 , SiC, ZrO 2 , TiO 2 , Y 2 O 3 , and AlN.

11. The metal particle for adhesive paste of claim 1 , further comprising:
an intermetallic compound (IMC) between the at least one metal of the core and the at least one metal of the shell.

12. A solder paste comprising:
the metal particle for adhesive paste according to claim 1 .

13. A composite bonding structure comprising: a solder ball; and
a heat-treatment product of the solder paste of claim 12 attached to the solder ball.

14. The composite bonding structure of claim 13 , wherein
the heat-treatment product of the solder paste comprises the core of the metal particle, and a shell metal matrix formed by melting the at least one metal of the shell of the metal particle,
wherein the nanoparticles are uniformly dispersed or distributed in the shell metal matrix.

15. The composite bonding structure of claim 13 , wherein
the solder ball comprises at least one of an Sn—Ag—Cu alloy, an Sn—Bi alloy, an Sn—Bi—Ag alloy, and an Sn—Ag—Cu—Ni alloy.

16. The composite bonding structure of claim 13 , wherein the heat-treatment product of the solder paste is obtained by a reflow process of the solder paste at a temperature of 180° C. to 220° C.

17. A semiconductor device, comprising:
a printed circuit board;
a semiconductor chip; and
the composite bonding structure according to claim 13 between the printed circuit board and the semiconductor chip.

18. A method of preparing a metal particle for adhesive paste, the method comprising:
preparing a mixture containing a core-forming metal particle or a core-forming metal precursor, and a shell-forming metal precursor; and
obtaining a composition by adding nanoparticles to the mixture, and contacting the composition, wherein
a melting point of a metal in the shell-forming metal precursor is lower than a melting point of the core-forming metal particle or a metal in the core-forming metal precursor, and
the nanoparticles include at least one of metal oxides, metal nitrides, semimetal nitrides, metal carbides, graphene, and carbon nanotubes.

19. The method of claim 18 , wherein
the mixture is a plating solution, and
the contacting of the composition is performed by electroplating or electroless plating using the composition.

20. The method of claim 18 , wherein the nanoparticles are ultrasonically dispersed.

21. A composite structure, comprising:
at least one core structure, the at least one core structure including at least one metal; and
at least one shell structure surrounding the at least one core structure, the at least one shell structure including a metal material and nanoparticles distributed in the metal material, wherein
a melting point of the at least one metal is greater than a melting point of the metal material in the at least one shell structure.

22. The composite structure of claim 21 , wherein
the at least one core structure is a plurality of core structures spaced apart from each other,
the at least one shell structure is a plurality of shells,
each corresponding shell surrounds a corresponding core structure among the plurality of core structures,
the plurality of shells are connected to each other, and
the nanoparticles are distributed in each of the plurality of shells.

23. The composite structure of claim 21 , wherein
the at least one core structure is a plurality of core structures spaced apart from each other, and
the at least one shell structure is a shell matrix surrounding the plurality of core structures and extending between adjacent core structures among the plurality of core structures.

24. The composite structure of claim 21 , wherein
the nanoparticles include at least one of metal oxides, metal nitrides, semimetal nitrides, metal carbides, graphene, and carbon nanotubes, and
the nanoparticles have a size of 1 nm to 1,000 nm.

25. The composite structure of claim 21 , wherein
the nanoparticles include at least one of La 2 O 3 , CeO 2 , SiC, ZrO 2 , TiO 2 , Y 2 O 3 , and AlN,
the at least one metal includes one of tin, copper, gold, silver, germanium, antimony, aluminum, titanium, palladium, chromium, molybdenum, nickel, tungsten, zinc, or a combination thereof, and
the metal material includes one of tin, indium, gallium, silver, bismuth, zinc, or a combination thereof.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Junghoon
• Chu Kunmo

Classifications

• B22F1/17

  Metallic particles coated with metal · CPC title

• B23K35/3602 Primary

  Carbonates, basic oxides or hydroxides · CPC title

• B23K2101/40

  Semiconductor devices · CPC title

• B23K35/368

  Selection of non-metallic compositions of core materials either alone or conjoint with selection of soldering or welding materials · CPC title

• B23K2103/166

  Multilayered materials · CPC title