Conductive material, conductive paste, circuit board, and semiconductor device

Patent metadata

Field	Value
Publication number	US-9402313-B2
Application number	US-201414163031-A
Country	US
Kind code	B2
Filing date	Jan 24, 2014
Priority date	Mar 7, 2008
Publication date	Jul 26, 2016
Grant date	Jul 26, 2016

Abstract

A conductive material includes a first metal part whose main ingredient is a first metal; a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal can form a metallic compound with the first metal; and a third metal part whose main ingredient is a third metal, which third metal can make a eutectic reaction with the second metal.

First claim

What is claimed is:

1. A circuit board, comprising:
a plurality of circuit parts;
a connecting part including conductive material, comprising:
a first metal part whose main ingredient is a first metal;
a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal forms a metallic compound with the first metal; and
a third metal part whose main ingredient is a third metal, which third metal makes a eutectic reaction with the second metal;
wherein the circuit parts are connected to each other by the connecting part,
the first metal is copper (Cu) or a copper (Cu) alloy, the second metal is tin (Sn) or a tin (Sn) alloy, and the third metal is a powder of bismuth (Bi), indium (In) or an alloy whose main ingredient is bismuth (Bi),
the eutectic reaction of the second metal and the third metal is made at a temperature equal to or lower than a glass transition temperature of an insulation substrate, and
the metallic compound is formed of the first metal and the second metal and a temperature of a melting point of the metallic compound is higher than a heat-resistant temperature of the insulation substrate.

2. The circuit board as claimed in claim 1 ,
wherein the connecting part is formed of the metallic compound and the third metal, which metallic compound is formed by the first metal being the main ingredient of the first metal part and the second metal being the main ingredient of the second metal part, the third metal being the main ingredient of the third metal part.

3. The circuit board as claimed in claim 1 ,
wherein the circuit board is a multi-layer wiring board where a plurality of resin substrates having the circuit parts is stacked.

4. A semiconductor device, comprising:
a semiconductor element; and
a wiring board having a main surface where the semiconductor element is connected,
wherein the wiring board is the circuit board as claimed in claim 1 .

5. A semiconductor device, comprising:
a semiconductor element; and
a wiring board having a main surface where the semiconductor element is connected,
wherein the wiring board and the semiconductor element are connected to each other by a connecting part including a conductive material comprising
a first metal part whose main ingredient is a first metal;
a second metal part formed on the first metal part and whose main ingredient is a second metal, the second metal having a melting point lower than a melting point of the first metal, which second metal forms a metallic compound with the first metal; and
a third metal part whose main ingredient is a third metal, which third metal makes a eutectic reaction with the second metal,
the first metal is copper (Cu) or a copper (Cu) alloy, the second metal is tin (Sn) or a tin (Sn) alloy, and the third metal is a powder of bismuth (Bi), indium (In) or an alloy whose main ingredient is bismuth (Bi),
the eutectic reaction of the second metal and the third metal is made at a temperature equal to or lower than a glass transition temperature of an insulation substrate, and
the metallic compound is formed of the first metal and the second metal and a temperature of a melting point of the metallic compound is higher than a heat-resistant temperature of the insulation substrate.

6. The semiconductor device as claimed in claim 5 ,
wherein the connecting part is formed of the metallic compound and the third metal, which metallic compound is formed of the first metal being the main ingredient of the first metal part and the second metal being the main ingredient of the second metal part, the third metal being the main ingredient of the third metal part.

Assignees

• Fujitsu Ltd

Inventors

• Sakuyama Seiki
• Sakai Taiji

Classifications

• H05K2201/10378

  Interposers · CPC title

• H05K2203/0425

  Solder powder or solder coated metal powder · CPC title

• H01B1/026 Primary

  Alloys based on copper · CPC title

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K3/462

  characterized by laminating only or mainly similar double-sided circuit boards · CPC title