Rapid thermal processing system with cooling system

Patent metadata

Field	Value
Publication number	US-12362194-B2
Application number	US-202117405142-A
Country	US
Kind code	B2
Filing date	Aug 18, 2021
Priority date	Aug 18, 2020
Publication date	Jul 15, 2025
Grant date	Jul 15, 2025

Abstract

Apparatus, systems, and methods for processing workpieces are provided. In one example, such a method for performing a spike anneal rapid thermal process may include controlling a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber. The method may further include receiving data indicative of a temperature of the workpiece. Furthermore, the method may include monitoring the temperature of the workpiece relative to a temperature setpoint. Moreover, the method may include controlling the heat source to stop heating the workpiece based at least in part on the workpiece reaching the temperature setpoint. Additionally, the method may include controlling a cooling system to begin flowing a cooling gas at a rate of about 300 slm or greater over the workpiece based at least in part on the workpiece reaching the temperature setpoint to reduce a t50 peak width of the workpiece.

First claim

What is claimed is:

1. A thermal processing system for performing rapid thermal processing of semiconductor workpieces, comprising:
a processing chamber;
a workpiece support configured to support a workpiece within the processing chamber, a workpiece plane defined by the workpiece;
a heat source configured to heat the workpiece;
a temperature measurement system configured to generate data indicative of a temperature of the workpiece; and
a cooling system configured to flow a cooling gas over the workpiece supported on the workpiece support, the cooling system comprising a plurality of cooling tubes arranged in a cooling plane, the cooling plane is parallel to the workpiece plane, wherein directly adjacent ones of the plurality of cooling tubes are positioned perpendicular to each other, each cooling tube of the plurality of cooling tubes having an inlet opening and a plurality of radially-spaced outlet openings, wherein a radially innermost outlet opening of each of the plurality of radially-spaced outlet openings of the plurality of cooling tubes is spaced out at a different radial distance from a central axis of the workpiece support.

2. The system of claim 1 , wherein the cooling system further comprises a gas supply coupled to the inlet openings of the plurality of cooling tubes to provide the cooling gas from a gas source through the plurality of cooling tubes and out the plurality of radially-spaced outlet openings of the plurality of cooling tubes, and
wherein the thermal processing system further comprises a controller configured to control the heat source and the cooling system based at least in part on the data indicative of the temperature of the workpiece to provide a flow of cooling gas into the processing chamber at a rate of about 300 slm or greater to reduce a t50 peak width of a workpiece during a thermal process.

3. The system of claim 1 , wherein the plurality of cooling tubes comprises four cooling tubes, where directly adjacent ones of the four cooling tubes are positioned perpendicular to each other.

4. The system of claim 1 , wherein an axis of each of the plurality of radially-spaced outlet openings of the plurality of cooling tubes is angled relative to the cooling plane towards the workpiece plane.

5. The system of claim 1 , wherein the radial distance between adjacent ones of the plurality of radially-spaced outlet openings of each of the plurality of cooling tubes decreases with increasing radial distance from the central axis of the workpiece.

6. The system of claim 1 , wherein the plurality of cooling tubes are comprised of quartz material.

7. The system of claim 1 , wherein the plurality of cooling tubes are spaced apart from a central axis of the workpiece.

8. A cooling system for a rapid thermal processing system, comprising:
four cooling tubes arranged in a cooling plane, each cooling tube extending radially towards a central axis, each cooling tube having an inlet opening and a plurality of radially-spaced outlet openings,
wherein directly adjacent ones of the four cooling tubes are positioned perpendicular to each other; and
a gas supply coupled to the inlet openings of the four cooling tubes to provide a cooling gas from a gas source through the four cooling tubes and out the plurality of radially-spaced outlet openings of the four cooling tubes,
wherein a radially innermost outlet opening of each of the plurality of radially-spaced outlet openings of the four cooling tubes is spaced out at a different radial distance from the central axis.

9. The system of claim 8 , wherein the plurality of radially-spaced outlet openings of the four cooling tubes are radially-spaced apart from the central axis.

10. The system of claim 8 , wherein the radial distance between adjacent ones of the plurality of radially-spaced outlet openings of each of the four cooling tubes decreases with increasing radial distance from the central axis.

11. The system of claim 8 , wherein each of the plurality of radially-spaced outlet openings of the four cooling tubes has a same cross-sectional area.

12. The system of claim 8 , wherein the four cooling tubes are comprised of quartz material.

13. The system of claim 8 , wherein an axis of each of the plurality of radially-spaced outlet openings of the four cooling tubes is angled relative to the cooling plane.

Assignees

• Beijing E Town Semiconductor Tech Co Ltd
• Mattson Tech Inc
• Matson Tech Inc

Inventors

• Sohn Manuel
• Bremensdorfer Rolf
• Hamm Silke
• Hezler Dieter

Classifications

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H10P95/90 Primary

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0434 Primary

  mainly by convection · CPC title