Plating apparatus and plating method

Patent metadata

Field	Value
Publication number	US-RE45687-E
Application number	US-201414272891-A
Country	US
Kind code	E1
Filing date	May 8, 2014
Priority date	Dec 4, 2007
Publication date	Sep 29, 2015
Grant date	Sep 29, 2015

Abstract

A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.

First claim

What is claimed is:

1. An electroplating apparatus for electroplating an object, comprising:
a plating tank for holding a plating solution containing additives;
an anode to be immersed in the plating solution in said plating tank; and
an object holder for holding the object, said object holder being configured so that a surface of the object to be held by said object holder will be immersed in the plating solution and will be located within said plating tank at a position opposite said anode when the object is held by said object holder;
wherein said plating tank is separated into a plating object processing chamber and a plating solution distribution chamber by a separation plate having a large number of plating solution passage holes; and
wherein said plating solution distribution chamber has a shield plate configured to regulate an electric field while ensuring distributed flows of the plating solution.

2. The electroplating apparatus of claim 1 , further comprising:
a regulation plate between said anode and said object holder, said regulation plate being formed of dielectric material and including:
a cylindrical portion having an inner periphery with a shape corresponding to a shape of an outer periphery of the object; and
a flange portion connected to an anode-side peripheral end of said cylindrical portion, said flange portion being configured to regulate an electric field formed between said anode and the object; and

an electric field-shielding member in contact with said separation plate and attached to a lower end of said flange portion.

3. The electroplating apparatus of claim 1 , wherein said plating solution distribution chamber is separated by said shield plate into an anode-side solution distribution chamber and a cathode-side solution distribution chamber, and a plating solution supply route is configured to supply the plating solution to said anode-side solution distribution chamber and said cathode-side solution distribution chamber.

4. The electroplating apparatus of claim 1 , further comprising a paddle plate between said anode and said object holder for stirring the plating solution.

5. The electroplating apparatus of claim 4 , wherein said paddle plate has a plurality of vertically-extending strip-shaped portions, said electroplating apparatus further comprising:
a paddle drive section for moving said paddle plate; and
a controller for controlling said paddle drive section so as to move said paddle plate in a reciprocating manner along the surface of the object such that, when said paddle plate is located at a farthest-right position, said strip-shaped portions do not cover the same portion of the surface of the object covered by said strip-shaped portions when said paddle plate is located at a farthest-left position.

6. The electroplating apparatus of claim 1 , further comprising a regulation plate between said anode and said object holder, said regulation plate including a cylindrical portion having an inner periphery with a shape corresponding to a shape of an outer periphery of the object.

7. The electroplating apparatus of claim 6 , wherein said regulation plate further includes a flange portion through which said cylindrical portion extends.

8. The electroplating apparatus of claim 1 , wherein said object holder is movable so as to transport the object.

9. An electroplating apparatus for electroplating an object, comprising:
a plating tank for holding a plating solution containing additives;
an anode to be immersed in the plating solution in said plating tank;
an anode holder for holding said anode;
a substrate holder for holding the substrate, said substrate holder being configured so that a surface of the substrate to be held by said substrate holder will be immersed in the plating solution and will be located within said plating tank at a position opposite said anode when the substrate is held by said substrate holder;
a regulation plate located between said anode and the substrate held by said substrate holder, said regulation plate having an opening for regulating a distribution of electric potential; and
a diaphragm covering an entirety of said opening of said regulation plate; and
a positioning/holding section comprising a single unitary member detachably holding each of said anode holder, said substrate holder, and said regulation plate such that a central axis of said anode held by said anode holder, a central axis of the substrate to be held by said substrate holder, and a central axis of said opening of said regulation plate are coaxial.

10. The electroplating apparatus of claim 9 , further comprising a paddle plate between said regulation plate and said substrate holder for stirring the plating solution.

11. The electroplating apparatus of claim 10 , wherein said paddle plate has a plurality of vertically-extending strip-shaped portions, said electroplating apparatus further comprising:
a paddle drive section for moving said paddle plate; and
a controller for controlling said paddle drive section so as to move said paddle plate in a reciprocating manner along the surface of the substrate such that, when said paddle plate is located at a farthest-right position, said strip-shaped portions do not cover the same portion of the surface of the substrate covered by said strip-shaped portions when said paddle plate is located at a farthest-left position.

12. The electroplating apparatus of claim 9 , wherein said regulation plate includes a cylindrical portion having an inner periphery with a shape corresponding to a shape of an outer periphery of the substrate.

13. The electroplating apparatus of claim 12 , wherein said regulation plate further includes a flange portion through which said cylindrical portion extends.

14. The electroplating apparatus of claim 9 , wherein said substrate holder is movable so as to transport the substrate.

15. An electroplating apparatus for electroplating an object, comprising:
a plating tank for holding a plating solution containing additives, said plating tank having a processing chamber with a bottom surface;
an anode to be immersed in the plating solution in said plating tank;
a substrate holder for holding the substrate, said substrate holder being configured so that a surface of the substrate to be held by said substrate holder will be immersed in the plating solution and will be located within said plating tank at a position opposite said anode when the substrate is held by said substrate holder;
a regulation plate located between said anode and the substrate held by said substrate holder, said regulation plate having an opening for regulating a distribution of electric potential;
a diaphragm covering an entirety of said opening of said regulation plate; and
an elastic electric field-shielding member located at a lower end of said regulation plate on an anode-facing side of said regulation plate such that a lower end of said electric field-shielding member elastically contacts said bottom surface of said processing chamber of said plating tank, said electric field-shielding member being configured to prevent leakage of electric current between said regulation plate and said bottom surface of said processing chamber of said plating tank.

16. The electroplating apparatus of claim 15 , further comprising a paddle plate between said regulation plate and said substrate holder for stirring the plating solution.

17. The electroplating apparatus of claim 16 , wherein said paddle plate has a plurality of vertically-extending strip-shaped portions, said electroplating apparatus further com

Assignees

• Ebara Corp

Inventors

• Saito Nobutoshi
• Fujikata Jumpei
• Yamamoto Tadaaki
• Kamimura Kenji

Classifications

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D21/10 Primary

  Agitating of electrolytes; Moving of racks · CPC title

• C25D17/007

  Current directing devices · CPC title

• C25D17/008 Primary

  Current shielding devices · CPC title

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title