Copper foil for high frequency circuit and method for manufacturing the same
US-2019145014-A1 · May 16, 2019 · US
Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same
US2022087032A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022087032-A1 |
| Application number | US-201917426310-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 24, 2019 |
| Priority date | Feb 4, 2019 |
| Publication date | Mar 17, 2022 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A surface treated copper foil includes: a copper foil; a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm; a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer; a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer; and a silane coupling agent treatment layer on the rust prevention treatment layer. An amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.
First claim
Opening claim text (preview).
1 . A surface treated copper foil comprising: a copper foil; a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm; a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer; a rust prevention treatment layer containing at least chromium on the heat resistance treatment layer; and a silane coupling agent treatment layer on the rust prevention treatment layer, wherein an amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m 2 . 2 . The surface treated copper foil according to claim 1 , wherein the heat resistance treatment layer contains nickel, or nickel and phosphorus. 3 . A copper-clad laminate comprising: an insulating layer containing a cured product of a resin composition; and the surface treated copper foil according to claim 1 on one surface or both surfaces of the insulating layer. 4 . A copper foil with resin comprising: a resin layer containing a resin composition or a semi-cured product of the resin composition; and the surface treated copper foil according to claim 1 on one surface of the resin layer. 5 . A circuit board comprising: the copper-clad laminate according to claim 3 , wherein a conductor pattern as a circuit is provided on a surface of the circuit board. 6 . A circuit board comprising the resin-attached copper foil according to claim 4 , wherein a conductor pattern as a circuit is provided on a surface of the circuit board.
Assignees
Inventors
Classifications
Surface topography of the layers, e.g. rough, dendritic or nodular layers · CPC title
Strips or foils · CPC title
by cathodic processes · CPC title
of copper · CPC title
of nickel or cobalt · CPC title
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- What does patent US2022087032A1 cover?
- A surface treated copper foil includes: a copper foil; a finely roughened particle treatment layer of copper on at least one surface of the copper foil, the finely roughened particle treatment layer including fine copper particles having a particle size of 40 to 200 nm; a heat resistance treatment layer containing nickel on the finely roughened particle treatment layer; a rust prevention treatm…
- Who is the assignee on this patent?
- Panasonic Ip Man Co Ltd, Fukuda Metal Foil & Powder Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C25D5/12. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Mar 17 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).