Method of printed circuit board dielectric molding or machining and electrolytic metallization

Patent metadata

Field	Value
Publication number	US-12336113-B2
Application number	US-202418617879-A
Country	US
Kind code	B2
Filing date	Mar 27, 2024
Priority date	Mar 28, 2023
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

A method for making a printed circuit board (PCB) with a tridimensional (3D) dielectric substrate having opposite sides and made of fiber-reinforced polymer. Each side comprises channels and pockets formed by molding or machining a dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB. The channels and pockets in a same side of the 3D dielectric substrate have a uniform depth. Side walls of the channels and pockets have a draft angle in a range of at least about 5 degrees to at least about 15 degrees.

First claim

What is claimed is:

1. A method of manufacturing a printed circuit board (PCB) stator for an axial field rotary energy device, the method comprising:
forming a PCB panel as a tridimensional (3D) dielectric substrate comprising fiber-reinforced polymer with opposite sides;
forming each side with channels and pockets by molding the 3D dielectric substrate, and the channels and pockets define a layout for conductive traces and pads, respectively, of the PCB panel;
forming the channels and pockets in a same side of the 3D dielectric substrate at a uniform depth that is equal to or greater than 140 μm;
forming side walls of the channels and pockets of the 3D dielectric substrate at a draft angle in a range of about 5 degrees to about 15 degrees;
depositing by electrolytic metallization and forming the conductive traces and pads into the channels and pockets, respectively, of the 3D dielectric substrate; and
making the outer surfaces of the conductive traces and pads flush with respective sides of the 3D dielectric substrate.

2. The method of claim 1 , wherein the channels and pockets of a first side of the sides of the 3D dielectric substrate are formed at a first depth, and the channels and pockets of a second side of the sides of the 3D dielectric substrate are formed at a second depth.

3. The method of claim 2 , wherein the first and second depths are the same or within 25 μm of each other.

4. The method of claim 2 , wherein the first depth differs from the second depth.

5. A method of manufacturing a printed circuit board (PCB) stator for an axial field rotary energy device, the method comprising:
forming a PCB panel as a tridimensional (3D) dielectric substrate comprising fiber-reinforced polymer with opposite sides;
forming each side with channels and pockets by machining the 3D dielectric substrate, and the channels and pockets define a layout for conductive traces and pads, respectively, of the PCB panel;
forming the channels and pockets in a same side of the 3D dielectric substrate at a uniform depth that is equal to or greater than 140 μm;
forming side walls of the channels and pockets of the 3D dielectric substrate at a draft angle in a range of at least about 5 degrees to about 15 degrees;
depositing by electrolytic metallization and forming the conductive traces and pads into the channels and pockets, respectively, of the 3D dielectric substrate; and
making the outer surfaces of the conductive traces and pads flush with respective sides of the 3D dielectric substrate.

6. The method of claim 5 , wherein the channels and pockets of a first side of the sides of the 3D dielectric substrate are formed at a first depth, and the channels and pockets of a second side of the sides of the 3D dielectric substrate are formed at a second depth.

7. The method of claim 6 , wherein the first and second depths are the same or within 25 μm of each other.

8. The method of claim 6 , wherein the first depth differs from the second depth.

Assignees

• Infinitum Electric Inc

Inventors

• Carignan Edward C
• Guedes-Pinto Paulo

Classifications

• H02K15/08

  Forming windings by laying conductors into or around core parts · CPC title

• C25D5/56

  of plastics · CPC title

• C25D5/02 Primary

  Electroplating of selected surface areas · CPC title

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• H02K15/02

  of stator or rotor bodies · CPC title