Forming windings by laying conductors into or around core parts

Forming windings by laying conductors into or around core parts · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH02K15/08
Official titleForming windings by laying conductors into or around core parts
Display labelForming windings by laying conductors into or around core parts
Total patents147

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is stable.

Patents filed per year
YearPatents
20158
201616
201722
201812
201915
202020
202113
202214
20238
20247
202512

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H02K15/08?
CPC H02K15/08 is the Cooperative Patent Classification code for “Forming windings by laying conductors into or around core parts.”
How many patents are filed under CPC H02K15/08 (Forming windings by laying conductors into or around core parts)?
Our database includes 147 publications tagged with this CPC code.
Is patent activity under CPC H02K15/08 growing?
Publication counts under this code: 7 in 2024 vs 12 in 2025 (latest complete years).