Method for manufacturing printed wiring board and printed wiring board

Patent metadata

Field	Value
Publication number	US-12317425-B2
Application number	US-202318188654-A
Country	US
Kind code	B2
Filing date	Mar 23, 2023
Priority date	Mar 25, 2022
Publication date	May 27, 2025
Grant date	May 27, 2025

Abstract

A method for manufacturing a printed wiring board includes forming a first conductor layer, forming an adhesive layer including a nitrogen-based organic compound and covering a surface of the first layer, forming a resin insulating layer covering the adhesive layer and having the second surface facing the first conductor layer, forming a protective film on the first surface of the insulating layer, forming an opening in the insulating layer such that the opening penetrates through the insulating layer and reaches the adhesive layer, applying plasma to the opening of the insulating layer such that the plasma cleans an inside of the opening, removing the protective film from the insulating layer after cleaning the inside of the opening, forming a second conductor layer on the first surface of the insulating layer, and forming a via conductor in the opening such that the via conductor connects the first layer and second layer.

First claim

The invention claimed is:

1. A method for manufacturing a printed wiring board, comprising:
forming a first conductor layer including a conductor circuit;
forming, on the first conductor layer, an adhesive layer comprising a nitrogen-based organic compound such that the adhesive layer covers a surface of the first conductor layer;
forming, on the first conductor layer, a resin insulating layer such that the resin insulating layer covers the adhesive layer and has a second surface facing the first conductor layer on an opposite side with respect to a first surface;
forming a protective film on the first surface of the resin insulating layer;
forming an opening for a via conductor in the resin insulating layer such that the opening penetrates through the resin insulating layer and reaches the adhesive layer;
applying plasma to the opening of the resin insulating layer such that the plasma cleans an inside of the opening of the resin insulating layer;
removing the protective film from the resin insulating layer after cleaning the inside of the opening of the resin insulating layer;
forming a second conductor layer on the first surface of the resin insulating layer; and
forming a via conductor in the opening of the resin insulating layer such that the via conductor connects the first conductor layer and the second conductor layer,
wherein the applying of the plasma includes applying the plasma to the opening of the resin insulating layer such that the plasma removes a portion of the adhesive layer exposed from the opening of the resin insulating layer, and the first conductor layer is formed such that the surface of the first conductor layer has arithmetic mean roughness Ra in a range of 0.02 μm to 0.5 μm.

2. The method for manufacturing a printed wiring board according to claim 1 , wherein the forming of the second conductor layer includes forming a seed layer on the first surface of the resin insulating layer by sputtering, forming a plating resist on the seed layer, forming an electrolytic plating film on part of the seed layer exposed from the plating resist, removing the plating resist, and removing part of the seed layer exposed from the electrolytic plating film.

3. The method for manufacturing a printed wiring board according to claim 2 , wherein the forming of the seed layer includes forming a first layer by sputtering, and forming a second layer on the first layer by sputtering such that a material of the second layer is different from a material of the first layer.

4. The method for manufacturing a printed wiring board according to claim 3 , wherein the material of the first layer and the material of the second layer are a combination of copper alloys of different materials or a combination of a copper alloy and copper.

5. The method for manufacturing a printed wiring board according to claim 4 , wherein the copper alloys have a copper content of 90% or more of a total weight.

6. The method for manufacturing a printed wiring board according to claim 3 , wherein the material of the first layer is a copper alloy comprising at least one of silicon, aluminum, titanium, nickel, chromium, iron, molybdenum, silver, carbon, oxygen, tin, calcium and magnesium, and the material of the second layer is copper.

7. The method for manufacturing a printed wiring board according to claim 3 , wherein the material of the first layer includes at least one of aluminum, titanium, nickel, chromium, calcium, magnesium, iron, molybdenum and silver, and the material of the second layer is copper.

8. The method for manufacturing a printed wiring board according to claim 1 , wherein the forming of the opening for the via conductor in the resin insulating layer includes applying laser such that the laser penetrates through the protective film and the resin insulating layer at a same time.

9. The method for manufacturing a printed wiring board according to claim 1 , wherein the forming of the resin insulating layer includes no roughening of the first surface of the resin insulating layer.

10. The method for manufacturing a printed wiring board according to claim 2 , wherein the forming of the resin insulating layer includes no roughening of the first surface of the resin insulating layer before the forming of the seed layer.

11. The method for manufacturing a printed wiring board according to claim 1 , wherein the forming of the second conductor layer includes forming a pair wiring comprising a first signal wiring and a second signal wiring.

12. The method for manufacturing a printed wiring board according to claim 1 , wherein the forming of the protective film includes forming a release layer between the first surface and the protective film, and the forming of the opening for the via conductor in the resin insulating layer includes forming the opening for the via conductor in the resin insulating layer such that the opening penetrates through the protective film, the release layer, and the resin insulating layer and reaches the adhesive layer.

13. A printed wiring board, comprising:
a first conductor layer;
a resin insulating layer formed on the first conductor layer;
a second conductor layer formed on a surface of the resin insulating layer;
a via conductor formed in an opening formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer; and
an adhesive layer comprising a nitrogen-based organic compound and formed between the resin insulating layer and a surface of the first conductor layer other than a portion exposed from the opening,
wherein the first conductor layer is formed such that the surface of the first conductor layer has arithmetic mean roughness Ra in a range of 0.02 μm to 0.5 μm.

14. The printed wiring board according to claim 13 , wherein the second conductor layer includes a seed layer formed on the surface of the resin insulating layer such that the seed layer includes a first layer, and a second layer formed on the first layer and comprising a material that is different from a material of the first layer.

15. The printed wiring board according to claim 14 , wherein the material of the first layer and the material of the second layer are a combination of copper alloys of different materials or a combination of a copper alloy and copper.

16. The printed wiring board according to claim 15 , wherein the copper alloys have a copper content of 90% or more of a total weight.

17. The printed wiring board according to claim 14 , wherein the material of the first layer is a copper alloy comprising at least one of silicon, aluminum, titanium, nickel, chromium, iron, molybdenum, silver, carbon, oxygen, tin, calcium and magnesium, and the material of the second layer is copper.

18. The printed wiring board according to claim 13 , wherein the resin insulating layer is formed such that the first surface of the resin insulating layer includes no roughening.

19. The printed wiring board according to claim 14 , wherein the resin insulating layer is formed such that the first surface of the resin insulating layer includes no roughening.

20. The printed wiring board according to claim 15 , wherein the resin insulating layer is formed such that the first surface of the resin insulating layer includes no roughening.

Assignees

• Ibiden Co Ltd

Inventors

• Ishida Atsushi

Classifications

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K3/188

  by direct electroplating · CPC title

• H05K3/16

  by cathodic sputtering · CPC title

• H05K2203/095

  Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes · CPC title

• H05K1/0298

  Multilayer circuits · CPC title