Heterogeneous integrated multi-chip cooler module

Patent metadata

Field	Value
Publication number	US-12300577-B2
Application number	US-202218092136-A
Country	US
Kind code	B2
Filing date	Dec 30, 2022
Priority date	Dec 30, 2022
Publication date	May 13, 2025
Grant date	May 13, 2025

Abstract

An exemplary apparatus includes a substrate; a plurality of chips mounted onto the substrate; a plurality of cold plates corresponding to the plurality of chips; means for pressing each of the cold plates toward a corresponding one of the chips; means for delivering coolant flow to the cold plates; and means for adjusting the cooling power of the plurality of cold plates, responsive to at least one sensed parameter of the plurality of chips.

First claim

What is claimed is:

1. An apparatus comprising:
a fluid manifold that has a principal inlet, a principal outlet, an inlet chamber, an outlet chamber, and a chip-facing surface that has matching pluralities of subsidiary outlets and inlets, wherein the principal inlet and each subsidiary outlet fluidly connects to the inlet chamber and the principal outlet and each subsidiary inlet fluidly connects to the outlet chamber;
a plurality of pairs of bellows that are respectively attached and fluidly connected to corresponding pairs of the subsidiary outlets and inlets;
a plurality of cold plates that each are fluidly connected between one of the pairs of bellows; and
at least one spring that is positioned between the outlet chamber and a cold plate from the plurality of cold plates.

2. The apparatus of claim 1 , wherein the at least one spring is captured between one of the cold plates and the chip-facing surface of the fluid manifold.

3. The apparatus of claim 1 , further comprising an inlet flow control valve that fluidly connects one of the subsidiary outlets to the inlet chamber.

4. The apparatus of claim 3 , further comprising a cooling control module is electrically connected to the inlet flow control valve.

5. The apparatus of claim 1 , further comprising a one way valve that fluidly connects one of the subsidiary inlets to the outlet chamber.

6. The apparatus of claim 1 , wherein at least one of the cold plates comprises a pin field.

7. The apparatus of claim 1 , wherein at least one of the cold plates comprises a microchannel cooler.

8. The apparatus of claim 1 , wherein each of the cold plates has a chip-facing surface, further comprising a thermoelectric cooler that is mounted to the chip-facing surface of one of the cold plates.

9. The apparatus of claim 8 , further comprising a cooling control module that is electrically connected to the thermoelectric cooler.

10. The apparatus of claim 1 , further comprising:
a substrate that has an upper surface;
a plurality of chips that are mounted on the upper surface of the substrate; and
a frame that connects the fluid manifold to the substrate with the chip-facing surface of the fluid manifold facing toward the substrate, and with each of the cold plates pressed toward one of the plurality of chips.

11. The apparatus of claim 10 , further comprising thermal interface material between each cold plate and a corresponding one of the plurality of chips.

12. The apparatus of claim 1 , wherein a material of the fluid manifold has a thermal conductivity that is less than 10% of a thermal conductivity of a material of the cold plates.

13. A method for cooling a multi-chip module that comprises a plurality of chips of differing vertical heights and operating temperature specifications, the method comprising:
assembling a plurality of cold plates to a manifold, wherein the assembling comprises connecting a first plurality of bellows between inlets of the cold plates and an inlet chamber of the manifold, connecting a second plurality of bellows between outlets of the cold plates and an outlet chamber of the manifold, and inserting springs between the cold plates and the manifold, wherein at least one spring is inserted between the outlet chamber and a cold plate;
attaching the manifold and cold plates to the multi-chip module by a frame that holds the manifold with each cold plate pressed against a corresponding chip of the multi-chip module; and
flowing a coolant through the manifold and the cold plates.

14. The method of claim 13 , further comprising:
sensing a parameter of one of the chips; and
operating a flow control valve of the manifold to regulate coolant flow through one of the cold plates that is attached to the one of the chips, responsive to the sensed parameter.

15. The method of claim 14 , wherein sensing the parameter comprises monitoring a temperature sensor.

16. The method of claim 14 , wherein sensing the parameter comprises monitoring a compute load.

17. The method of claim 13 , further comprising:
sensing a parameter of one of the chips; and
adjusting electrical current delivered to a thermoelectric cooler that is attached to the one of the chips, responsive to the sensed parameter.

18. The method of claim 17 , wherein sensing the parameter comprises monitoring a thermocouple.

19. The method of claim 17 , wherein sensing the parameter comprises monitoring a compute load.

20. An apparatus that comprises:
a substrate;
a plurality of chips mounted onto the substrate;
a plurality of cold plates corresponding to the plurality of chips;
at least one spring for pressing each of the cold plates toward a corresponding one of the chips;
a manifold for delivering coolant flow to the cold plates, the manifold comprising an inlet chamber and an outlet chamber that are both connected to the plurality of cold plates, wherein the at least one spring is positioned between the outlet chamber and a cold plate from the plurality of cold plates; and
means for adjusting the cooling power of the plurality of cold plates, responsive to at least one sensed parameter of the plurality of chips.

Assignees

• IBM

Inventors

• Chainer Timothy J
• Takken Todd Edward
• Rubin Joshua M
• Kumar Arvind

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W40/772

  Bellows · CPC title

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/28

  comprising Peltier coolers · CPC title