Cold plate with controlled deformation
US-2026101470-A1 · Apr 9, 2026 · US
Bellows
Bellows · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W40/772 |
| Official title | {Bellows} |
| Display label | Bellows |
| Total patents | 35 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2016 | 1 |
| 2017 | 1 |
| 2018 | 1 |
| 2019 | 5 |
| 2020 | 4 |
| 2021 | 10 |
| 2022 | 1 |
| 2023 | 6 |
| 2024 | 3 |
| 2025 | 2 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor Cooling Device, Power Conversion Device, and Method for Manufacturing Semiconductor Cooling Device
US-2025385159-A1 · Dec 18, 2025 · US
Heterogeneous integrated multi-chip cooler module
US-12300577-B2 · May 13, 2025 · US
Airflow control in active cooling systems
US-12033917-B2 · Jul 9, 2024 · US
Heterogeneous integrated multi-chip cooler module
US-2024222223-A1 · Jul 4, 2024 · US
Cooling systems with main and remote cooling masses having integrated flexibility
US-2024096741-A1 · Mar 21, 2024 · US
Flexible thermal system
US-2023309265-A1 · Sep 28, 2023 · US
Configurable heatsink
US-2023297147-A1 · Sep 21, 2023 · US
Configurable heatsink
US-11703921-B2 · Jul 18, 2023 · US
Waterproof casing with a sealing grommet in a casting hole
US-11646245-B2 · May 9, 2023 · US
Evaporator stacks and electronic assemblies
US-11594468-B2 · Feb 28, 2023 · US
Pressure controllable encapsulated liquid thermal interface
US-11545415-B2 · Jan 3, 2023 · US
Cooling device
US-11262135-B2 · Mar 1, 2022 · US
Semiconductor device
US-11164841-B2 · Nov 2, 2021 · US
Evaporator stacks and electronic assemblies
US-2021320047-A1 · Oct 14, 2021 · US
Configurable heatsink
US-2021278885-A1 · Sep 9, 2021 · US
Water cooling module
US-11069595-B2 · Jul 20, 2021 · US
Flexible base design for chipset heat sink
US-11049793-B2 · Jun 29, 2021 · US
Pressure controllable encapsulated liquid thermal interface
US-2021183742-A1 · Jun 17, 2021 · US
Airflow control in active cooling systems
US-2021183739-A1 · Jun 17, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W40/772?
- CPC H10W40/772 is the Cooperative Patent Classification code for “Bellows.”
- How many patents are filed under CPC H10W40/772 (Bellows)?
- Our database includes 35 publications tagged with this CPC code.
- Is patent activity under CPC H10W40/772 growing?
- Publication counts under this code: 3 in 2024 vs 2 in 2025 (latest complete years).