Multi-component electronic module with integral coolant-cooling

Patent metadata

Field	Value
Publication number	US-9265176-B2
Application number	US-201313790241-A
Country	US
Kind code	B2
Filing date	Mar 8, 2013
Priority date	Mar 8, 2013
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.

First claim

What is claimed is:

1. A coolant-cooled electronic module comprising:
a multi-component assembly comprising multiple electronic components disposed on a substrate;
a module lid assembly, the module lid assembly comprising:
a module lid comprising multiple openings through the module lid aligned over the multiple electronic components of the multi-component assembly;
multiple thermally conductive elements disposed within the multiple openings in the module lid, each thermally conductive element of the multiple thermally conductive elements comprising a coolant-cooled surface and a conduction surface, the coolant-cooled surface and the conduction surface being opposite surfaces of the thermally conductive element, and the conduction surface being coupled to a respective electronic component of the multiple electronic components of the multi-component assembly;

an inner manifold element disposed over the module lid assembly, the inner manifold element comprising opposite first and second main surfaces, the first main surface being configured to facilitate flow of coolant onto, at least in part, the coolant-cooled surfaces of the multiple thermally conductive elements, and including coolant supply openings disposed over the coolant-cooled surfaces of the multiple thermally conductive elements, and the first main surface including coolant exhaust channels formed in the first main surface and disposed, at least in part, adjacent to the coolant-cooled surfaces of the multiple thermally conductive elements, the coolant exhaust channels extending outwards towards a respective peripheral side edge of the inner manifold element;
an outer manifold element disposed over the inner manifold element and coupled to the module lid, with the inner manifold element being between the outer manifold element and the module lid, wherein the inner manifold element and the outer manifold element define, at least in part, a coolant supply manifold over the second main surface of the inner manifold element, and the outer manifold element and the module lid define, at least in part, a coolant return manifold, the coolant supply openings being in fluid communication with the coolant supply manifold, and the coolant exhaust channels being in fluid communication with the coolant return manifold, and the coolant supply manifold, coolant supply openings, coolant exhaust channels, and coolant return manifold facilitate flow of coolant across the coolant-cooled surfaces of the multiple thermally conductive elements.

2. A coolant-cooled electronic module comprising:
a multi-component assembly comprising multiple electronic components disposed on a substrate;
a module lid assembly, the module lid assembly comprising:
a module lid comprising multiple openings through the module lid aligned over the multiple electronic components of the multi-component assembly;
multiple thermally conductive elements disposed within the multiple openings in the module lid, each thermally conductive element of the multiple thermally conductive elements comprising a coolant-cooled surface and a conduction surface, the coolant-cooled surface and the conduction surface being opposite surfaces of the thermally conductive element, and the conduction surface being coupled a respective electronic component of the multiple electronic components of the multi-component assembly.

an inner manifold element disposed over the module lid assembly, the inner manifold element comprising opposite first and second main surfaces, the first main surface being configured to facilitate flow of coolant onto, at least in part, the coolant-cooled surfaces of the multiple thermally conductive elements, and including coolant supply openings disposed over the coolant-cooled surfaces of the multiple thermally conductive elements, and coolant exhaust channels disposed, at least in part, adjacent to the coolant-cooled surfaces of the multiple thermally conductive elements:
an outer manifold element disposed over the inner manifold element and coupled to the module lid, with the inner manifold element between the outer manifold element and the module lid, wherein the inner manifold element and the outer manifold element define, at least in part, a coolant supply manifold over the second main surface of the inner manifold element, and the outer manifold element and the module lid define, at least in part, a coolant return manifold, the coolant supply openings being in fluid communication with the coolant supply manifold, and the coolant exhaust channels being in fluid communication with the coolant return manifold, and the coolant supply manifold, coolant supply openings, coolant exhaust channels, and coolant return manifold facilitate flow of coolant across the coolant-cooled surfaces of the multiple thermally conductive elements;
wherein the multiple thermally conductive elements are each sealed along a periphery thereof to the module lid, and wherein each thermally conductive element comprises opposite coolant-cooled and conduction surfaces, with the conduction surface thereof disposed in spaced opposing relation to a surface of the respective electronic component of the multiple electronic components, and in thermal contact with the surface of the respective electronic component via a thermal interface material disposed there between; and
wherein each coolant supply opening of the multiple coolant supply openings is centrally disposed over the coolant-cooled surface of the respective thermally conductive element, and the multiple coolant exhaust channels comprise multiple pairs of first and second coolant exhaust channels, each pair of first and second coolant exhaust channels being disposed, at least in part, adjacent to the coolant-cooled surface of the respective thermally conductive element of the multiple thermally conductive elements at opposite sides thereof to facilitate exhausting of coolant from that coolant-cooled surface.

3. The coolant-cooled electronic module of claim 2 , wherein each coolant supply opening comprises a coolant supply slot, and the respective pair of first and second coolant exhaust channels are disposed at opposite sides of the coolant-cooled surface of the one thermally conductive element.

4. The coolant-cooled electronic module of claim 3 , wherein the coolant-cooled surface of each thermally conductive element of the multiple thermally conductive elements comprises a plurality of channels formed therein to facilitate heat transfer from the thermally conductive element to the coolant flowing across the coolant-cooled surface.

5. The coolant-cooled electronic module of claim 4 , wherein the coolant supply slots are centrally disposed over the respective coolant-cooled surfaces, and each provides a coolant flow onto the respective coolant-cooled surface, which bifurcates into orthogonal coolant flow within the plurality of channels formed in the coolant-cooled surface of the respective thermally conductive element.

6. The coolant-cooled electronic module of claim 5 , wherein the plurality of channels in the coolant-cooled surface of each thermally conductive element are curved and decrease in cross-sectional flow area from the central region thereof to the opposite sides of the coolant-cooled surface with the pair of first and second coolant exhaust channels disposed adjacent thereto.

7. The coolant-cooled electronic module of claim 1 , wherein the inner manifold element further comprises a manifold wall extending from the second main surface, and the coolant supply manifold is defined within the manifold wall of the inner manifold element, and the coolant return manifold is defined, at least in part, outside and around the manifold wall of the inner manifold element.

8. The coolant-cooled electronic module of cla

Assignees

• IBM

Inventors

• Arvelo Amilcar R
• Campbell Levi A
• Ellsworth Jr Michael J
• Mckeever Eric J

Classifications

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title