Manufacturing method of a molded photosensitive assembly for an array imaging module

Patent metadata

Field	Value
Publication number	US-12298533-B2
Application number	US-202217740887-A
Country	US
Kind code	B2
Filing date	May 10, 2022
Priority date	Mar 12, 2016
Publication date	May 13, 2025
Grant date	May 13, 2025

Abstract

A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

First claim

What is claimed is:

1. A manufacturing method of a molded photosensitive assembly of an array imaging module including at least two optical lenses, comprising:
providing at least a circuit board having one or more electronic elements and one or more connecting elements electrically coupled at said circuit board;
providing at least two photosensitive units electrically coupled at said circuit board, wherein each of said photosensitive units has a photosensitive area and a non-photosensitive area encircling said photosensitive area, wherein said one or more connecting element electrically connect said non-photosensitive area to said circuit board;
providing an enclosing film at a mold engaging surface of said circuit board that is substantially the surface being molded;
molding a molded base to integrally enclose, package and seal said circuit board and said non-photosensitive area, to integrally and sealedly embed and enclose said one or more electronic elements and said one or more connecting elements therein to form an integrated body, wherein when a first mold body and a second mold body are coupled with each other in a mold closing state, said enclosing film is sandwiched between said mold engaging surface of said first mold body and said circuit board to prevent said first mold body from direct contacting with said circuit board so as to provide a buffering and sealing effect between said mold engaging surface and said circuit board to ensure a sealing engagement that prevents a fluid state mold material flowing to said coupling areas of said circuit board and ensures a flatness of said coupling areas of said circuit board, and wherein said molded base has at least two optical windows formed therein to communicate and align with said at least two photosensitive units respectively to define at least two photosensitive paths for said at least two photosensitive units respectively, wherein each of said optical windows is configured to have a tapered size that a cross section of said optical window is gradually increased from said photosensitive area of said photosensitive unit, such that an inner wall of said optical window is slanted and is extended from said photosensitive unit, wherein said at least two optical windows form at least two light channels through said photosensitive units and the optical lenses respectively; and
providing at least one light filter to be coupled at a top side of said molded base and positioned above said light window and said photosensitive unit, wherein said light filter, said molded base and said circuit board form a sealed enclosure for said photosensitive unit.

2. The manufacturing method according to claim 1 , wherein the method further comprises a step of electrically connecting the photosensitive units to the circuit board via at least a lead wire.

3. The manufacturing method according to claim 1 , wherein the molding step further comprises a step of enclosing the lead wire by the molded base.

4. The manufacturing method according to claim 1 , wherein the method further comprises a step of forming at least a coupling slot at a top side of the molded base for engaging with a supporter, optical lenses, or drivers.

5. The manufacturing method according to claim 1 , wherein the method further comprises a step of forming a step-like platform that upwardly extends from an inner side of the molded base for spacedly supporting the light filters and the optical lenses in position, so that said molded base comprises an enclosing portion, a light filter mounting portion and a lens mounting portion, wherein said enclosing portion is integrally molded at said circuit board and said non-photosensitive area to integrally and sealedly embed and enclose said one or more electronic elements and said one or more connecting elements therein, wherein said light filter mounting portion and said lens mounting portion are extended integrally and upwardly from said enclosing portion to form a step-like platform to stably support said at least one light filter and the at least two optical lenses, wherein said lens mounting portion has at least two lens inner wall which are flat surfaces for coupling with the at least two optical lenses respectively.

6. The manufacturing method according to claim 1 , wherein the molding step further comprises a step of forming a threaded structure at an inner wall of the molded base for coupling with the optical lenses with a corresponding threaded configuration.

7. The manufacturing method according to claim 1 , wherein before the molding step, the method further comprises a step of forming at least a reinforcing slot, which is an indention cavity, at the circuit board, wherein the molded base is extended into the reinforcing slot to enhance the strength of the circuit board.

8. The manufacturing method according to claim 1 , wherein the method further comprises a step of forming at least a reinforcing slot, which is a through slot, at the circuit board, wherein the molded base is extended into the reinforcing slot to enhance the strength of the circuit board.

9. The manufacturing method according to claim 1 , wherein before the molding step, the method further comprises a step of forming at least a reinforcing layer overlapped and connected to the circuit board to reinforce the strength of the circuit board.

10. The manufacturing method according to claim 1 , wherein the molding step further comprises a step of forming a shielding layer that encloses the circuit board and the molded base to enhance the strength of the circuit board and to prevent any electromagnetic interference of the molded photosensitive assembly.

11. The manufacturing method according to claim 1 , wherein the molding step further comprises a step of pre-setting a plurality of connecting wires in the molded base that are electrically connected to the circuit board for electrically connecting with the drivers respectively.

12. The manufacturing method according to claim 1 , wherein the molding step further comprises a step of pre-setting a plurality of terminal slots at the top side of the molded base for enabling the driver connecting terminals of the connecting wires exposing at the terminal slots respectively.

13. The manufacturing method according to claim 1 , wherein the molding step further comprises a step of pre-setting a plurality of terminal slots in the molded base and a plurality of circuit terminals at the circuit board and extended to expose at the terminal slots respectively for the driver connecting terminals of the drivers inserted into the terminal slots to connect with the circuit terminals respectively.

14. The manufacturing method according to claim 1 , wherein the molding step further comprises a step of pre-setting a plurality of engraving circuits electrically connected to the circuit board, wherein the engraving circuits are embedded in the molded base for electrically connecting with the drivers respectively.

15. The manufacturing method according to claim 14 , wherein the engraving circuit is formed by Laser Direct Structuring (LDS) to be embedded in the molded base.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Zhao Bojie
• Tanaka Takehiko
• Guo Nan
• Chen Zhenyu
• Jiang Heng
• Luan Zhongyu
• Xi Fengsheng
• Chen Feifan
• Ding Liang

Classifications

• H10W90/00

  Package configurations · CPC title

• G02B7/006

  Filter holders · CPC title

• H04N23/55 Primary

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/51

  Housings · CPC title

• H04N23/45

  for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title