Overmolded reconstructed camera module

Patent metadata

Field	Value
Publication number	US-9768225-B2
Application number	US-201615232532-A
Country	US
Kind code	B2
Filing date	Aug 9, 2016
Priority date	Feb 2, 2015
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

A camera module including a die having a top side and a bottom side, an image sensor is positioned on the top side of the die and a conductive via is formed through the die to provide an electrical connection between the top side and the bottom side; an overmold casing formed around the die; and a lens holder assembly attached to the top side of the die and the overmold casing. A method of producing a camera module including providing an image sensor die that is overmolded within a casing, the image sensor die having a top side and a bottom side, wherein an image sensor is positioned on the top side and a conductive via is formed through the image sensor die from the top side to the bottom side; and attaching a lens holder to the top side of the image sensor die.

First claim

What is claimed is:

1. A camera module comprising:
a microelectronic die positioned within a first casing, the microelectronic die having a top side and a bottom side, an image sensor is positioned on the top side of the microelectronic die, and a conductive via is formed through the microelectronic die to provide an electrical connection between the top side and the bottom side;
an electronic device positioned within a second casing formed on a top side of the first casing; and
a lens holder assembly positioned over the top side of the microelectronic die and coupled to the second casing.

2. The camera module of claim 1 further comprising:
a transparent member positioned over the image sensor, the transparent member being attached directly to the top side of the microelectronic die and surrounded by the second casing.

3. The camera module of claim 1 further comprising:
a metal layer, wherein the metal layer is (a) on one of the top side or the bottom side of the microelectronic die and (b) extends from the via and over the first casing to redistribute the electrical connection to a location outside of the microelectronic die.

4. The camera module of claim 1 wherein the first casing and the second casing are overmolded to the microelectronic die and the electronic device, respectively.

5. The camera module of claim 1 where the electronic device is a passive surface-mount device.

6. The camera module of claim 1 wherein the electronic device is electrically connected to the conductive via by a redistribution layer encased between the first casing and the second casing.

7. The camera module of claim 2 wherein the first casing is molded directly to, and contacts, the top side of the microelectronic die and portions of the transparent member.

8. The camera module of claim 1 wherein the first casing or the second casing is made of a polymer, an elastomer, a glass, or a thermoplastic material.

9. A method of producing a camera module, the method comprising:
providing a carrier having an adhesive tape layer;
attaching a microelectronic die to the adhesive tape layer, the microelectronic die having a first side with an image sensor formed thereon and a second side, and wherein a conductive via is formed between the first side and the second side, the adhesive tape layer being attached to the second side;
forming a first casing around the microelectronic die;
positioning a surface-mount device over the first side of the microelectronic die and the first casing;
attaching a transparent member to the first side of the microelectronic die, the transparent member being positioned over the image sensor such that the image sensor is enclosed between the microelectronic die and the transparent member; and
forming a second casing over the first casing and around the surface-mount device.

10. The method of claim 9 further comprising:
positioning a lens holder assembly over the transparent member and the second casing to form an overmolded camera module; and
removing the carrier having the adhesive tape layer such that the second side of the microelectronic die is exposed.

11. The method of claim 9 wherein the first casing is formed by a molding process comprising:
positioning a mold cope over the microelectronic die and the transparent member; and
injecting mold material between the mold cope and the carrier to form the first casing.

12. The method of claim 9 further comprising:
prior to attaching a lens holder assembly, removing the adhesive tape layer and carrier to expose the second side of the microelectronic die; and
forming a redistribution layer between the via and the first casing.

13. The method of claim 9 wherein the first casing and the second casing are formed by a molding process comprising:
molding a first mold material around the microelectronic die to form the first casing around the microelectronic die;
forming a redistribution layer between an end of the via at the first side of the microelectronic die and the first casing;
positioning the surface-mount device over the first side of the microelectronic die and the first casing such that it is electrically connected to the redistribution layer; and
molding a second mold material around the surface-mount device to form the second casing, wherein the surface-mount device and redistribution layer are encased within the first casing and the second casing.

14. A method of producing a camera module, the method comprising:
providing an image sensor die that is positioned within a first casing and an electronic device positioned within a second casing positioned on the first casing, the image sensor die having a top side and a bottom side, wherein an image sensor and a transparent member are positioned on the top side and a conductive via is formed through the image sensor die from the top side to the bottom side; and
mounting a lens holder assembly to the second casing and over the top side of the image sensor die.

15. The method of claim 14 wherein an injection molding process is used to form the first casing and the second casing.

16. The method of claim 15 wherein the injection molding process comprises:
injection molding the first casing around the image sensor die;
forming a redistribution layer on the top side of the image sensor die and the first casing;
mounting the electronic device over the redistribution layer and the first casing; and
injection molding the second casing over the electronic device and the first casing.

17. The method of claim 14 further comprising:
forming a redistribution layer between the via and on the first casing.

18. The method of claim 17 wherein the redistribution layer is formed on the top side of the die and a top side of the first casing such that it is between the first casing and the second casing.

19. The method of claim 17 wherein the redistribution layer is formed on the bottom side of the die.

Assignees

• Apple Inc

Inventors

• Vittu Julien C

Classifications

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W74/141

  the encapsulations being on at least the sidewalls of the semiconductor body · CPC title

• H10W74/019

  using temporary auxiliary substrates (H10W74/017 takes precedence) · CPC title

• H10W74/016

  using moulds · CPC title

• H10W72/9413

  on encapsulations · CPC title