Electronic device module having an imaging unit

Patent metadata

Field	Value
Publication number	US-2016150133-A1
Application number	US-201514822883-A
Country	US
Kind code	A1
Filing date	Aug 10, 2015
Priority date	Nov 26, 2014
Publication date	May 26, 2016
Grant date	—

Abstract

An electronic device module includes a substrate, an imaging unit disposed on the substrate and electrically connected thereto, a resin member disposed on the substrate and covering an peripheral region of the imaging unit, a lens unit disposed above the imaging unit, and a frame having a portion that is disposed on a top surface of the resin member and supports the lens unit.

First claim

What is claimed is:

1 . An electronic device module, comprising:
a substrate; an imaging unit disposed on the substrate and electrically connected thereto; a resin member disposed on the substrate and covering a peripheral region of the imaging unit; a lens unit disposed above the imaging unit; and a frame having a portion that is disposed on the resin member and supports the lens unit.

2 . The electronic device module according to claim 1 , wherein
the imaging unit is electrically connected to the substrate through a bonding wire, and the resin member covers the wiring.

3 . The electronic device module according to claim 1 , wherein
the imaging unit includes an array of light receiving elements facing the lens unit and a logic circuit disposed in the peripheral region, and the resin member covers the logic circuit and does not cover the array of light receiving elements.

4 . The electronic device module according to claim 1 , wherein
the substrate includes an electrode pad, and the lens unit is electrically connected to the electrode pad through a wiring.

5 . The electronic device module according to claim 4 , wherein
at least a portion of the wiring is formed on a side surface of the resin member.

6 . The electronic device module according to claim 4 , wherein
the resin member does not cover the electrode pad, and at least a portion of the electrode pad is exposed.

7 . The electronic device module according to claim 6 , wherein
the resin member has a recessed portion on a side surface thereof, and the portion of the electrode pad is exposed through the recessed portion of the resin member.

8 . The electronic device module according to claim 1 , wherein
the frame has a portion covering a top surface and side surfaces of the resin member.

9 . The electronic device module according to claim 8 , wherein
the frame includes a conductive layer that is formed on an outer surface of the portion and electrically connected to the substrate.

10 . The electronic device module according to claim 1 , wherein
the frame includes a conductive layer that is formed on an outer surface thereof and electrically connected to the substrate.

11 . The electronic device module according to claim 1 , wherein
the frame lies on the top surface of the resin member and does not cover a side surface of the resin member.

12 . The electronic device module according to claim 1 , further comprising:
an electronic unit disposed on the substrate, wherein the resin member does not cover the electronic unit.

13 . The electronic device module according to claim 12 , wherein
the electronic unit is a controller configured to control the imaging unit.

14 . The electronic device module according to claim 1 , wherein
the substrate includes a test electrode pad disposed thereon and electrically connected to the imaging unit, and the resin member does not cover the test electrode pad.

15 . The electronic device module according to claim 1 , wherein the substrate is a flexible film.

16 . An electronic device module, comprising:
a substrate having an electrode pad for electrical connection with an external device; an imaging unit disposed on the substrate and electrically connected thereto; and a resin member disposed on the substrate and covering an peripheral region of the imaging unit, the electrode pad being not covered by the resin member.

17 . The electronic device module according to claim 16 , wherein
the imaging unit is electrically connected to the substrate through a wiring, and the resin member covers the wiring.

18 . The electronic device module according to claim 16 , wherein
the imaging unit includes an array of light receiving elements and a logic circuit disposed in the peripheral region, and the resin member covers the logic circuit and does not cover the array of light receiving elements.

19 . The electronic device module according to claim 16 , further comprising:
a lens unit disposed above the imaging unit; and a frame having a portion that is disposed on a top surface of the resin member and supports the lens unit.

20 . The electronic device module according to claim 19 , wherein
the frame has a portion covering a top surface and side surfaces of the resin member.

Assignees

• Toshiba Kk

Inventors

• Suzuki Daigo
• Happoya Akihiko
• Ootsubo Jun
• Lin Fongru

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H04N23/55 Primary

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/56

  provided with illuminating means · CPC title

• H04N23/51 Primary

  Housings · CPC title