Systems and methods for multi-level pulsing in RF plasma tools

US12283463B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12283463-B2
Application numberUS-202017605982-A
CountryUS
Kind codeB2
Filing dateApr 24, 2020
Priority dateApr 29, 2019
Publication dateApr 22, 2025
Grant dateApr 22, 2025

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Systems and methods for multi-level pulsing are described. The systems and methods include generating four or more states. During each of the four or more states, a radio frequency (RF) generator generates an RF signal. The RF signal has four or more power levels, and each of the four or more power levels corresponds to the four or more states. The multi-level pulsing facilitates a finer control in processing a substrate.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for generating a multi-state plasma impedance, comprising: receiving, from a processor by a first radio frequency (RF) generator and a second RF generator, a synchronization signal having a plurality of cycles that repeat periodically; generating a first RF signal by the first RF generator, wherein the first RF signal includes at least two parameter levels within one of the plurality of cycles; generating a second RF signal by the second RF generator, wherein the second RF signal includes at least three parameter levels within the one of the plurality of cycles; and modifying a time of transition between the at least two parameter levels or a time of transition among the at least three parameter levels based on a number of plasma impedance states to be achieved. 2. The method of claim 1 , further comprising: supplying the first RF signal to a first impedance matching network coupled to a first electrode of a plasma chamber; and supplying the second RF signal to a second impedance matching network coupled to a second electrode of the plasma chamber. 3. The method of claim 1 , wherein the synchronization signal is a digital pulsed signal having a duty cycle, wherein the duty cycle repeats during the plurality of cycles. 4. The method of claim 1 , wherein the synchronization signal repeatedly transitions between a first logic level and a second logic level during the plurality of cycles, wherein the first logic level is greater than the second logic level. 5. The method of claim 1 , wherein the at least two parameter levels of the first RF signal include a first positive parameter level and a second positive parameter level, wherein the second positive parameter level of the first RF signal is greater than the first positive parameter level of the first RF signal, wherein the at least three parameter levels of the second RF signal include a zero parameter level, a first positive parameter level, and a second positive parameter level, wherein the second positive parameter level of the second RF signal is less than the first positive parameter level of the second RF signal. 6. The method of claim 1 , wherein a combination of one of the at least two parameter levels of the first RF signal and one of the at least three parameter levels of the second RF signal defines a plasma impedance state. 7. The method of claim 1 , wherein the at least two parameter levels of the first RF signal includes a first parameter level and a second parameter level, and the at least three parameter levels of the second RF signal includes a first parameter level, a second parameter level, and a third parameter level, wherein the first RF signal transitions between the first and second parameter levels at two transition times during the one of the plurality of cycles, wherein the second RF signal transitions among the first, second, and third parameter levels at three transition times during the one of the plurality of cycles, wherein at least one of the three transitions times of the second RF signal is different from at least one of the two transition times of the first RF signal to generate the multi-state plasma impedance. 8. The method of claim 1 , wherein the at least two parameter levels of the first RF signal includes a first parameter level and a second parameter level, and the at least three parameter levels of the second RF signal includes a zero parameter level, a second parameter level, and a first parameter level, the method further comprising: transitioning the first RF signal from the second parameter level to the first parameter level at a first transition time during the one of the plurality of cycles; transitioning the first RF signal from the first parameter level to the second parameter level at a second transition time during the one of the plurality of cycles; transitioning the second RF signal from the first parameter level to the zero parameter level at a third transition time during the one of the plurality of cycles; transitioning the second RF signal from the zero parameter level to the second parameter level at a fourth transition time during the one of the plurality of cycles; and transitioning the second RF signal from the second parameter level to the first parameter level at a fifth transition time during the one of the plurality of cycles, wherein at least one of the first and second transition times is different from at least one of the third, fourth, and fifth transition times during the one of the plurality of cycles to generate the multi-state plasma impedance. 9. A controller system for generating a multi-state plasma impedance, comprising: a first processor of a first radio frequency (RF) generator, wherein the first processor is configured to receive a synchronization signal having a plurality of cycles that repeat periodically, wherein the first processor is configured to control a first RF power supply of the first RF generator to generate a first RF signal, wherein the first RF signal includes at least two parameter levels within one of the plurality of cycles; and a second processor of a second RF generator, wherein the second processor is configured to receive the synchronization signal, wherein the second processor is configured to control a second RF power supply of the second RF generator to generate a second RF signal, wherein the second RF signal includes at least three parameter levels within the one of the plurality of cycles, wherein the first processor is configured to control the first RF power supply to modify a time of transition between the at least two parameter levels or the second processor is configured to control the second RF power supply to modify a time of transition among the at least three parameter levels based on a number of plasma impedance states to be achieved. 10. The controller system of claim 9 , wherein the first RF power supply is configured to supply the first RF signal to a first impedance matching network coupled to a first electrode of a plasma chamber, wherein the second RF power supply is configured to supply the second RF signal to a second impedance matching network coupled to a second electrode of the plasma chamber. 11. The controller system of claim 9 , wherein the synchronization signal is a digital pulsed signal having a duty cycle, wherein the duty cycle repeats during the plurality of cycles. 12. The controller system of claim 9 , wherein the synchronization signal repeatedly transitions between a first logic level and a second logic level during the plurality of cycles, wherein the first logic level is greater than the second logic level. 13. The controller system of claim 9 , wherein the at least two parameter levels of the first RF signal include a first positive parameter level and a second positive parameter level, wherein the second positive parameter level of the first RF signal is greater than the first positive parameter level of the first RF signal, wherein the at least three parameter levels of the second RF signal include a zero parameter level, a first positive parameter level, and a second positive parameter level, wherein the second positive parameter level of the second RF signal is less than the first positive parameter level of the second RF signal. 14. The controller system of claim 9 , wherein a combination of one of the at least two parameter levels of the first RF signal and one of the at least three parameter levels of the second RF signal defines a plasma impedance state. 15. The controller system of claim 9 , wherein the at least two parameter levels of the first RF signal includes a fi

Assignees

Inventors

Classifications

  • Circuits specially adapted for controlling the RF discharge · CPC title

  • Adjustment of width or dutycycle of pulses (pulse width modulation H03K7/08 {; to maintain energy constant H03K3/015}) · CPC title

  • Amplitude modulation, includes pulsing · CPC title

  • Radio frequency generated discharge (H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence) · CPC title

  • Matching circuits · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12283463B2 cover?
Systems and methods for multi-level pulsing are described. The systems and methods include generating four or more states. During each of the four or more states, a radio frequency (RF) generator generates an RF signal. The RF signal has four or more power levels, and each of the four or more power levels corresponds to the four or more states. The multi-level pulsing facilitates a finer contro…
Who is the assignee on this patent?
Lam Res Corp
What technology area does this patent fall under?
Primary CPC classification H01J37/32146. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 22 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).