Micro-optomechanical system and method for the production thereof

US12282040B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12282040-B2
Application numberUS-201815733175-A
CountryUS
Kind codeB2
Filing dateDec 4, 2018
Priority dateDec 5, 2017
Publication dateApr 22, 2025
Grant dateApr 22, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

The present invention relates to a micro-optomechanical system ( 500 ) and to a method for the production thereof. The micro-optomechanical system ( 500 ) comprises at least one optical subsystem ( 100 ) configured for emitting at least one optical actuator signal ( 212 ) and for receiving at least one optical sensor signal ( 211 ); and at least one optomechanical structure ( 150 ) which is producible in direct contact with the optical subsystem ( 100 ) by means of a direct writing microstructuring method, wherein the optical subsystem ( 100 ) comprises at least one optical actuation element ( 219 ) and at least one optical sensor element ( 140 ), wherein the optical actuator signal ( 212 ) in interaction with the optical actuation element ( 219 ) is configured for changing a mechanical state of the optomechanical structure ( 150 ), and wherein the optical sensor signal ( 211 ) in interaction with the optical sensor element ( 140 ) is configured for detecting the change in the mechanical state of the optomechanical structure ( 150 ) or a variable related thereto. The micro-optomechanical systems ( 500 ) provided have virtually any desired shaping in conjunction with very high resolution and are therefore suitable for a wide range of applications.

First claim

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The invention claimed is: 1. A micro-optomechanical system, comprising at least one optical subsystem configured for emitting at least one optical actuator signal and for receiving at least one optical sensor signal; at least one optomechanical structure which is produced from a photoresist in direct contact with the optical subsystem by means of a direct writing microstructuring method, wherein the direct writing microstructuring method is an additive method, wherein the optomechanical structure comprises at least one optical actuation element and at least one optical sensor element, wherein the optical actuator signal in interaction with the optical actuation element is configured for changing a mechanical state of the optomechanical structure, wherein the optical sensor signal in interaction with the optical sensor element is configured for detecting the change in the mechanical state of the optomechanical structure or a variable related thereto, and wherein the optical actuation element and the optical sensor element are integrated in the optomechanical structure to form an inseparable unit; wherein the optical subsystem has a facet; wherein the optical sensor element has a freeform mirror, wherein the optical sensor element is designed as an optical resonator, wherein the optical resonator is formed between the facet and the freeform mirror, wherein the freeform mirror is positioned at a free end of the optomechanical structure; and wherein the optical actuation element includes a heating location on the optomechanical structure where the optical actuator signal impinges to heat the optical actuation element to cause movement, wherein the heating location is positioned proximal to a fixed end of the optomechanical structure that is opposite to the free end. 2. The micro-optomechanical system as claimed in claim 1 , wherein the optomechanical structure and the facet are positioned to form an optical resonator configured to detect position of the optomechanical structure. 3. The micro-optomechanical system as claimed in claim 1 , wherein the change in the mechanical state of the optomechanical structure or the variable related thereto comprises at least one mechanical change in a fiber-optical component of the optomechanical structure, the fiber-optical component is selected from a group consisting of an optical fiber, a single-mode fiber, a multi-core fiber, and a fiber array. 4. The micro-optomechanical system as claimed in claim 1 , wherein the mechanical change comprises a movement selected from a group consisting of bending, translation, oscillation, tilting, contraction, expansion and torsion of the optomechanical structure or of at least one partial region thereof. 5. The micro-optomechanical system as claimed in claim 4 , wherein the optomechanical structure has a light-sensitive coating configured for exciting or amplifying a conversion of the optical actuator signal into the movement. 6. The micro-optomechanical system as claimed in claim 4 , wherein the optomechanical structure has at least one second partial region configured for exciting or for amplifying the conversion of the optical actuator signal into the movement. 7. The micro-optomechanical system as claimed in claim 6 , wherein the second partial region differs from the rest of the optomechanical structure in terms of one or more of a different coefficient of thermal expansion, a different light absorption coefficient or a structure size smaller than the light wavelength of the light radiated in with the optical actuator signal. 8. The micro-optomechanical system as claimed in claim 1 , wherein: the optical sensor element has a resonant optical structure; and the optical actuation element is configured for altering a resonant frequency of the resonant optical structure. 9. The micro-optomechanical system as claimed in claim 1 , wherein: the optical sensor element has an interferometric optical structure; and the optical actuation element is configured for altering a transmission of the interferometric optical structure. 10. The micro-optomechanical system as claimed in claim 1 , wherein the optical sensor element comprises a structure element having a structure size smaller than a light wavelength of the optical sensor signal. 11. The micro-optomechanical system as claimed in claim 1 , wherein the optomechanical structure has a cantilever configured for measurements of surface profiles. 12. The micro-optomechanical system as claimed in claim 1 , wherein the optical subsystem has a fiber plug. 13. The micro-optomechanical system as claimed in claim 1 , wherein the optical subsystem has a micro-optical component. 14. The micro-optomechanical system as claimed in claim 1 , wherein the optical subsystem has an optical amplifier. 15. The micro-optomechanical system as claimed in claim 1 , wherein the optical subsystem has an optical signal processing unit. 16. The micro-optomechanical system as claimed in claim 1 , wherein the optical actuator signal interacts with the optomechanical structure at an actuator coupling point, the optical subsystem has an alignment mark fitted on the optical subsystem, and the relative position of the alignment mark in relation to the coupling point of the optical subsystem has an accuracy better than 10 μm. 17. A micro-optomechanical system, comprising at least one optical subsystem configured for emitting at least one optical actuator signal and for receiving at least one optical sensor signal; at least one optomechanical structure which is produced from a photoresist in direct contact with the optical subsystem by means of a direct writing microstructuring method, wherein the direct writing microstructuring method is an additive method, wherein the optomechanical structure comprises at least one optical actuation element and at least one optical sensor element, wherein the optical actuator signal in interaction with the optical actuation element is configured for changing a mechanical state of the optomechanical structure, wherein the optical sensor signal in interaction with the optical sensor element is configured for detecting the change in the mechanical state of the optomechanical structure or a variable related thereto, and wherein the optical actuation element and the optical sensor element are integrated in the optomechanical structure to form an inseparable unit; wherein the optical subsystem has a facet; wherein the optical sensor element has a freeform mirror, wherein the freeform mirror is positioned at a free end of the optomechanical structure; wherein the optical actuation element includes a heating location on the optomechanical structure where the optical actuator signal impinges to heat the optical actuation element to cause movement, wherein the heating location is positioned proximal to a fixed end of the optomechanical structure that is opposite to the free end; and wherein the optomechanical structure has a tip, wherein the tip is located at the free end of the optomechanical structure, wherein the tip extends from a side of the optomechanical structure that is opposite to the facet to be in proximity to a sample to be examined, wherein the tip is made of the same material as the optomechanical structure, wherein the tip is produced at the same time with the optomechanical structure to be integral with the optomechanical structure. 18. The micro-optomechanical system as claimed in claim 17 , wherein the optomechanical structure and the facet are positioned to form an optical resonator configured to detect position of the opto

Assignees

Inventors

Classifications

  • G01Q60/06Primary

    SNOM [Scanning Near-field Optical Microscopy] combined with AFM [Atomic Force Microscopy] · CPC title

  • by optical means · CPC title

  • the vibrations causing a variation in the relative position of the end of a fibre and another element · CPC title

  • contacting different faces of object, e.g. opposite faces · CPC title

  • the reflecting element being moved or deformed by electrostatic means · CPC title

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What does patent US12282040B2 cover?
The present invention relates to a micro-optomechanical system ( 500 ) and to a method for the production thereof. The micro-optomechanical system ( 500 ) comprises at least one optical subsystem ( 100 ) configured for emitting at least one optical actuator signal ( 212 ) and for receiving at least one optical sensor signal ( 211 ); and at least one optomechanical structure ( 150 ) w…
Who is the assignee on this patent?
Karlsruher Inst Technologie
What technology area does this patent fall under?
Primary CPC classification G01Q60/06. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 22 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).