Sensor arrangement and method for producing a sensor arrangement

Patent metadata

Field	Value
Publication number	US-12259283-B2
Application number	US-202117639236-A
Country	US
Kind code	B2
Filing date	Oct 13, 2021
Priority date	Oct 13, 2020
Publication date	Mar 25, 2025
Grant date	Mar 25, 2025

Abstract

In an embodiment a sensor arrangement includes a sensor element including a ceramic base body and at least two electrodes, wherein the electrodes are arranged on an outer side of the ceramic base body, at least two contacting elements configured for making electrical contact with the sensor element, the contacting elements being connected to the electrodes in a connection region and a glass sheath, wherein at least the ceramic base body and the connection region are completely enclosed in the glass sheath, wherein the glass sheath is pressure tensioned, and wherein a coefficients of expansion of the glass sheath, the contacting elements and the sensor element are adapted to one another for the pressure tensioning of the glass sheath.

First claim

The invention claimed is:

1. A sensor arrangement comprising:
a sensor element comprising a ceramic base body and at least two electrodes, wherein the electrodes are arranged on an outer side of the ceramic base body;
at least two contacting elements configured for making electrical contact with the sensor element, the contacting elements being connected to the electrodes in a connection region;
a ceramic cap; and
a glass sheath,
wherein at least the ceramic base body and the connection region are completely enclosed in the glass sheath,
wherein the glass sheath is pressure tensioned,
wherein coefficients of expansion of the glass sheath, the contacting elements and the sensor element are adapted to one another for the pressure tensioning of the glass sheath,
wherein the sensor arrangement is configured to measure a temperature,
wherein the glass sheath has a smaller coefficient of expansion than the ceramic base body and the contacting elements, and
wherein the ceramic cap is at least partially fused to the glass sheath.

2. The sensor arrangement according to claim 1 , wherein the electrodes have a lead-free gold or silver thick-film metallization.

3. The sensor arrangement according to claim 1 , wherein the contacting elements have a nickel-iron alloy or silver with small amounts of nickel.

4. The sensor arrangement according to claim 1 , wherein the contacting elements have a protective layer, and wherein the protective layer comprises Ni, Cu or Ag.

5. The sensor arrangement according to claim 1 , wherein the glass sheath comprises a recrystallizing barium zinc silicate glass.

6. The sensor arrangement according to claim 1 , wherein the glass sheath comprises a material with a melting temperature below a melting temperature of a material of the electrodes.

7. The sensor arrangement according to claim 1 , wherein the glass sheath comprises a material with a softening temperature above an application temperature of the sensor arrangement.

8. The sensor arrangement according to claim 1 , wherein the sensor arrangement is configured to operate at a high application temperature which is ≥300° C. and ≤650° C.

9. A method for producing a sensor arrangement, the method comprising:
providing a sensor element comprising a ceramic base body and at least two electrodes;
providing at least two contacting elements and partially immersing the contacting elements in a contacting paste;
pressing the contacting elements onto the electrodes in a connection region;
sintering thereby forming a sintered system;
partially immersing the sintered system at a defined speed in a glass paste so that the sensor element and at least the connection region are completely enclosed in the glass paste to form a glass sheath;
laterally moving the sintered system in the glass paste and subsequently extracting the sintered system from the glass paste at a defined speed;
drying; and
glazing.

10. The method according to claim 9 , wherein drying comprises first drying at room temperature and subsequently drying at elevated temperature in a furnace.

11. The method according to claim 9 , wherein glazing comprises heating the glass sheath to a temperature above a glass softening temperature and melting the glass sheath.

12. The method according to claim 9 , wherein the glass sheath comprises a recrystallizing barium zinc silicate glass.

13. The method according to claim 9 , wherein an area of the contacting elements immersed in the contacting paste is smaller than an edge length of the ceramic base body.

14. The method according to claim 9 , wherein the electrodes have a lead-free gold or silver thick-film metallization.

15. The method according to claim 9 , wherein the contacting elements comprise a nickel-iron alloy or silver with small amounts of nickel, and/or wherein the contacting elements comprise a protective layer, the protective layer comprising Ni, Cu or Ag.

16. A method for producing the sensor arrangement of claim 1 , the method comprising:
providing the sensor element;
providing the at least two contacting elements and partially immersing the contacting elements in a contacting paste;
pressing the contacting elements onto the electrodes in the connection region;
sintering thereby forming a sintered system;
attaching a glass preform to the sintered system so that the sensor element and at least the connection region are completely inserted in the glass preform; and
melting the glass preform to form the glass sheath.

17. The method according to claim 16 , wherein melting comprises heating the glass preform to a temperature above a glass softening temperature.

18. The method according to claim 16 , wherein the glass sheath comprises a recrystallizing barium zinc silicate glass.

19. The method according to claim 16 , wherein an area of the contacting elements immersed in the contacting paste is smaller than an edge length of the ceramic base body.

20. The method according to claim 16 , wherein the contacting elements comprise a nickel-iron alloy or silver with small amounts of nickel, and/or wherein the contacting elements comprise a protective layer, the protective layer comprising Ni, Cu or Ag.

21. A method for producing a sensor arrangement, the method comprising:
providing a sensor element comprising a ceramic base body and at least two electrodes;
providing at least two contacting elements and partially immersing the contacting elements in a contacting paste;
pressing the contacting elements onto the electrodes in a connection region;
sintering thereby forming a sintered system;
providing a ceramic cap and partially inserting the sintered system in the ceramic cap;
partially filling the ceramic cap with a glass paste at a defined speed;
further inserting the sintered system into the ceramic cap partially filled with glass paste at a defined speed so that the sensor element and the connection region are completely arranged in the ceramic cap;
laterally moving the ceramic cap at a predetermined speed to wet the sensor element and the connection region with the glass paste;
further filling the ceramic cap with the glass paste so that the sensor element and at least the connection region are completely enclosed by the glass paste to form a glass sheath;
drying; and
glazing.

22. The method according to claim 21 , wherein glazing comprises heating the glass sheath to a temperature above a glass softening temperature and melting the glass sheath.

23. The method according to claim 21 , wherein, prior to further inserting the sintered system into the ceramic cap, laterally moving the ceramic cap at a predetermined speed for distributing the glass paste in the ceramic cap.

Assignees

• Tdk Electronics Ag

Inventors

• Ihle Jan
• Seifert Torben
• Sabeder-Daiminger Sasa
• Hojas Gerhard

Classifications

• G01K1/12

  for preventing damage due to heat overloading · CPC title

• H01C7/008

  Thermistors (H01C7/02 - H01C7/06 take precedence) · CPC title

• H01C1/148

  the terminals embracing or surrounding the resistive element (H01C1/142 takes precedence) · CPC title

• G01K7/08

  the object to be measured forming one of the thermoelectric materials, e.g. pointed type · CPC title

• G01K1/08

  Protective devices, e.g. casings · CPC title