Over-current protection device
US-2024387080-A1 · Nov 21, 2024 · US
Thermistors (H01C7/02 - H01C7/06 take precedence)
Thermistors (H01C7/02 - H01C7/06 take precedence) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01C7/008 |
| Official title | {Thermistors (H01C7/02 - H01C7/06 take precedence)} |
| Display label | Thermistors (H01C7/02 - H01C7/06 take precedence) |
| Total patents | 511 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 69 |
| 2016 | 65 |
| 2017 | 74 |
| 2018 | 50 |
| 2019 | 50 |
| 2020 | 40 |
| 2021 | 45 |
| 2022 | 30 |
| 2023 | 23 |
| 2024 | 30 |
| 2025 | 28 |
| 2026 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Heat sink for electronic component and associated manufacturing method
US-2024183524-A1 · Jun 6, 2024 · US
Ceramic electronic component
US-2024153709-A1 · May 9, 2024 · US
Negative differential resistance device
US-2015380133-A1 · Dec 31, 2015 · US
Vertical structure LEDs
US-9224907-B2 · Dec 29, 2015 · US
Thermistor material and method of preparing the same
US-2015371742-A1 · Dec 24, 2015 · US
Temperature sensor
US-2015362381-A1 · Dec 17, 2015 · US
Metal-nitride thermistor material, manufacturing method therefor, and film-type thermistor sensor
US-2015337433-A1 · Nov 26, 2015 · US
Laminated ceramic electronic component and method for producing laminated ceramic electronic component
US-2015332854-A1 · Nov 19, 2015 · US
Metal-nitride thermistor material, manufacturing method therefor, and film-type thermistor sensor
US-2015332817-A1 · Nov 19, 2015 · US
Semiconductor ceramic composition, method for producing the same, and PTC element
US-9190194-B2 · Nov 17, 2015 · US
Metal-nitride thermistor material, manufacturing method therefor, and film-type thermistor sensor
US-2015325345-A1 · Nov 12, 2015 · US
Electronic-component mounting structure
US-9184362-B2 · Nov 10, 2015 · US
Metal-nitride thermistor material, manufacturing method therefor, and film-type thermistor sensor
US-2015315695-A1 · Nov 5, 2015 · US
Laminated chip composite resistor combining thermistor and varistor and preparation method thereof
US-9159477-B2 · Oct 13, 2015 · US
Electronic component package structure
US-9153762-B2 · Oct 6, 2015 · US
Temperature sensor element, method for manufacturing same, and temperature sensor
US-9153365-B2 · Oct 6, 2015 · US
Laminated chip electronic component, board for mounting the same, and packing unit thereof
US-9155197-B2 · Oct 6, 2015 · US
Laminated ceramic electronic component and method for producing laminated ceramic electronic component
US-9129745-B2 · Sep 8, 2015 · US
Multilayer ceramic electronic component, series of electronic components stored in a tape, and method of manufacturing multilayer ceramic electronic component
US-9131625-B2 · Sep 8, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01C7/008?
- CPC H01C7/008 is the Cooperative Patent Classification code for “Thermistors (H01C7/02 - H01C7/06 take precedence).”
- How many patents are filed under CPC H01C7/008 (Thermistors (H01C7/02 - H01C7/06 take precedence))?
- Our database includes 511 publications tagged with this CPC code.
- Is patent activity under CPC H01C7/008 growing?
- Publication counts under this code: 30 in 2024 vs 28 in 2025 (latest complete years).