Electronic package and implantable medical device including same

Patent metadata

Field	Value
Publication number	US-12237281-B2
Application number	US-202117469098-A
Country	US
Kind code	B2
Filing date	Sep 8, 2021
Priority date	Sep 9, 2020
Publication date	Feb 25, 2025
Grant date	Feb 25, 2025

Abstract

Various embodiments of an electronic package and an implantable medical device that includes such package are disclosed. The electronic package includes a monolithic package substrate having a first major surface and a second major surface, an integrated circuit disposed in an active region of the package substrate, and a conductive via disposed through an inactive region of the package substrate and extending between the first major surface and the second major surface of the package substrate. The conductive via is separated from the active region by a portion of the inactive region of the substrate.

First claim

What is claimed is:

1. An implantable medical device comprising:
a power source;
an electronics module comprising an electronic package that comprises:
a monolithic package substrate comprising a first major surface and a second major surface;
an integrated circuit disposed in an active region of the package substrate; and
a conductive via disposed through an inactive region of the package substrate and extending between the first major surface and the second major surface of the package substrate, wherein the conductive via is separated from the active region by a portion of the inactive region of the substrate; and

a feedthrough header assembly electrically connected to the electronics module.

2. The device of claim 1 , further comprising an elongated tubular housing extending between a first end and a second end along a longitudinal axis, wherein a first portion of the housing adjacent to the first end encloses the electronics module and a second portion of the housing adjacent to the second end encloses the power source.

3. The device of claim 1 , wherein the active region of the electronic package takes a rectangular shape in a plane parallel to the first major surface of the package substrate, wherein the inactive region further comprises a second portion, wherein the portion and second portion of the inactive region are disposed on opposing sides of the active region in the plane parallel to the first major surface of the package substrate.

4. The device of claim 3 , wherein the electronic package further comprises a second conductive via disposed through the inactive region of the package substrate and extending between the first major surface and the second major surface of the package substrate, wherein the second conductive via is separated from the active region by the second portion of the inactive region of the substrate.

5. The device of claim 1 , wherein the electronic package further comprises a patterned conductive layer disposed adjacent to at least one of the first major surface or the second major surface of the package substrate and electrically connected to the conductive via and the integrated circuit.

6. The device of claim 5 , wherein the patterned conductive layer is disposed adjacent to the first major surface of the substrate, wherein the electronic package further comprises a second patterned conductive layer disposed adjacent to the second major surface of the substrate and electrically connected to the conductive via.

7. The device of claim 6 , wherein the electronic package further comprises a dielectric layer disposed between the patterned conductive layer and the first major surface of the package substrate.

8. The device of claim 7 , wherein the electronic package further comprises a dielectric layer disposed between the second patterned conductive layer and the second major surface of the package substrate.

9. The device of claim 1 , wherein the active region of the integrated circuit of the electronic package is embedded within the inactive region of the package substrate such that the active region is surround by the inactive region in a plane parallel to the first major surface of the package substrate.

10. The device of claim 1 , wherein the conductive via of the electronic package extends in a direction substantially orthogonal to the first and second major surfaces of the substrate.

11. The device of claim 1 , wherein the electronic package further comprises a guard ring disposed in the first major surface of substrate, wherein the guard ring circumscribes the active region and the integrated circuit.

12. The device of claim 1 , wherein the conductive via of the electronic package comprises a dielectric layer disposed on one or more walls of the via.

13. The device of claim 12 , wherein the conductive via of the electronic package further comprises conductive material disposed in the via such that the dielectric material is between the conductive material and the one or more walls of the via.

14. The device of claim 13 , wherein the conductive via of the electronic package further comprises insulating material disposed within the via such that the conductive material is disposed between the one or more walls of the via and the insulating material.

15. The device of claim 1 , wherein the integrated circuit of the electronic package comprises at least one of a field effect transistor (FET), metal oxide semiconductor (MOS), MOSFET, insulated gate bipolar junction transistor (IGBT), thyristor, bipolar transistor, diode, MOS-controlled thyristor, resistor, capacitor, inductor, sensor-mixed signal application-specific integrated circuit (ASIC), digital circuit, or analog circuit.

16. The device of claim 1 , wherein the electronic package further comprises a conductive pillar disposed within the conductive via and electrically connected to the integrated circuit.

17. The device of claim 1 , wherein the electronic package further comprises a conductive pad disposed on either the first major surface or the second major surface of the substrate and electrically connected to the integrated circuit.

18. The device of claim 1 , wherein the electronics module further comprises a feedthrough header assembly electrically connected to one or more electronic layers of the electronics module.

19. The device of claim 18 , further comprising an electrode electrically connected to the one or more electronic layers of the electronics module by a feedthrough header assembly.

20. The device of claim 1 , further comprising an electrical contact assembly disposed between the power source and the electronics module and configured to provide an electrical connection between the power source and the electronics module.

Assignees

• Medtronic Inc

Inventors

• Henschel Mark E
• Shi Songhua

Classifications

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/942

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title

• H10W72/923

  Bond pads having multiple stacked layers · CPC title

• H10W72/244

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title

• H10W72/90

  Bond pads, in general · CPC title