Kinetically limited nano-scale diffusion bond structures and methods

Patent metadata

Field	Value
Publication number	US-10124559-B2
Application number	US-201514976475-A
Country	US
Kind code	B2
Filing date	Dec 21, 2015
Priority date	Dec 24, 2014
Publication date	Nov 13, 2018
Grant date	Nov 13, 2018

Abstract

Bulk materials having a kinetically limited nano-scale diffusion bond is provided. The bulk materials having a kinetically limited nano-scale diffusion bond includes transparent material, absorbent opaque material and a diffusion bond. The transparent material has properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption. The absorbent opaque material has properties that significantly absorb energy from the electromagnetic beam. The diffusion bond is formed by the electromagnetic beam bonding the transparent material to the absorbent opaque material. Moreover, the diffusion bond has a thickness that is less than 1000 nm.

First claim

The invention claimed is:

1. Bulk materials having a kinetically limited nano-scale diffusion bond comprising:
a transparent material comprising sapphire having properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption, wherein minimal energy absorption is less than 50% of the total energy of the electromagnetic radiation of the electromagnetic beam;
an absorbent opaque material comprising titanium having properties that significantly absorb energy from the electromagnetic beam; and
a diffusion bond formed by the electromagnetic beam bonding the transparent material to the absorbent opaque material, the diffusion bond having a thickness less than 1000 nm.

2. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 1 , further comprising:
the diffusion bond including an interfacial bond joint region that is less than 200 nm and an amorphous diffusion zone that is less than 60 nm thick and within the interfacial bond joint region; and
undisturbed transparent material and undisturbed absorbent opaque material outside the interfacial bond joint, the undisturbed transparent non-metal insulator material and undisturbed absorbent opaque material not being affected by the formation of the bond.

3. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 1 , further comprising:
the diffusion bond including an interfacial bond joint region that is less than 1000 nm; and
undisturbed transparent non-metal insulator material and undisturbed absorbent opaque material outside the interfacial bond joint, the undisturbed transparent non-metal insulator material and undisturbed absorbent opaque material not being affected by the formation of the bond.

4. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 1 , wherein the bond forms a hermetic seal.

5. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 1 , wherein the bond is at least one of corrosion-resistant, crack free, uniform and bio-stable.

6. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 1 , wherein the bond strength is as strong as at least one of the transparent material and the absorbent opaque material.

7. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 1 , wherein the absorbent opaque material is compliant.

8. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 1 , further comprising:
at least one interlayer used to form the bond.

9. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 8 , wherein the at least one inter layer is at least one of an antireflective coating inter layer and a soft sputtered interlayer.

10. Bulk materials having a kinetically limited nano-scale diffusion bond comprising:
a transparent material comprising sapphire having properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption, wherein minimal energy absorption is less than 50% of the total energy of the electromagnetic radiation of the electromagnetic beam;
absorbent material comprising titanium having properties that significantly absorb energy from the electromagnetic beam;
a bond formed by the electromagnetic beam bonding the transparent material to the absorbent material, the bond having an interfacial bond joint that is less than 1000 nm in thickness; and
undisturbed transparent material and undisturbed absorbent material outside the interfacial bond joint, wherein the undisturbed transparent material and undisturbed absorbent opaque material are not affected by the formation of the bond.

11. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 10 , wherein the bond further comprises:
a diffusion zone less than 60 nm thick, the diffusion zone being within the interfacial bond joint.

12. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 10 , wherein the bond forms a hermetic seal.

13. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 10 , wherein the bond is at least one of corrosive resistant, uniform and bio-stable.

14. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 10 , wherein the bond strength is as strong as at least one of the transparent material and the absorbent material.

15. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 10 , wherein the absorbent material is compliant.

16. The bulk materials having a kinetically limited nano-scale diffusion bond of claim 10 , further comprising:
at least one interlayer used to form the bond.

17. The bulk materials having kinetically limited nano-scale diffusion bond of claim 10 , wherein the bond formed by the electromagnetic beam bonding the transparent material to the absorbent material further comprises:
a plurality of spaced bond areas.

18. A method of forming a kinetically limited nano-scale diffusion bond in bulk materials, the method comprising:
positioning a first surface to be bonded of a transparent material comprising sapphire against a second surface to be bonded of an absorbent opaque material comprising titanium, the transparent material having properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption and the absorbent opaque material having properties that significantly absorbs energy from the electromagnetic beam, wherein minimal energy absorption is less than 50% of the total energy of the electromagnetic radiation of the electromagnetic beam;
applying pressure to the transparent material and absorbent opaque material;
selectively passing the electromagnetic beam through the transparent material to the second surface to be bonded of the absorbent opaque material; and
creating the kinetically limited nano-scale diffusion bond with the electromagnetic beam.

19. The method of claim 18 , wherein the kinetically limited nano-scale diffusion bond is formed by stimulating localized atomic mobility sufficient to create an interfacial bond joint less than 1000 nm.

20. The method of claim 18 , wherein the kinetically limited nano-scale diffusion bond is formed by stimulating localized atomic mobility sufficient to create an interfacial bond joint less than 200 nm that includes an interfacial bond joint with a diffusion zone less than 60 nm thick.

21. The method of claim 18 , further comprising:
preparing the first surface of a transparent material and the second surface of an absorbent opaque material to have a roughness of 500 nm or less for bonding.

22. The method claim 18 , further comprising:
introducing at least one interlayer between the first surface of the transparent material and the second surface of the absorbent opaque material prior to applying pressure.

23. A method of forming a kinetically limited nano-scale diffusion bond in bulk materials, the method comprising:
positioning a first surface to be bonded of a transparent material against a second surface to be bonded of an absorbent opaque material, the transparent material having properties that allow an electromagnetic beam of a select wavelength to pass there through without more than minimal energy absorption and the absorbent opaque material having

Assignees

• Medtronic Inc
• Invenios
• Corning Inc

Inventors

• Sandlin Michael S
• Ruben David A
• Karam Raymond M
• Roussos Georges
• Wynne Thomas M

Classifications

• B32B15/04

  comprising metal as the main or only constituent of a layer, {which is} next to another layer of {the same or of} a {different material (next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042)} · CPC title

• B23K2203/14

  Operations & Transport · mapped topic

• B23K2203/172

  Operations & Transport · mapped topic

• B32B7/04 Primary

  Interconnection of layers · CPC title

• B23K2203/54

  Operations & Transport · mapped topic