Hermetic assembly and device including same

Patent metadata

Field	Value
Publication number	US-12233477-B2
Application number	US-202418404992-A
Country	US
Kind code	B2
Filing date	Jan 5, 2024
Priority date	Dec 13, 2019
Publication date	Feb 25, 2025
Grant date	Feb 25, 2025

Abstract

Various embodiments of a hermetic assembly and a method of forming such assembly are disclosed. The hermetic assembly includes a dielectric substrate having a first major surface and a second major surface, a patterned layer connected to the first major surface of the dielectric substrate by a laser bond, and a ferrule having a body and a flange extending from the body. The flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

First claim

What is claimed is:

1. A hermetic assembly comprising:
a dielectric substrate comprising a first major surface and a second major surface;
a patterned layer connected to the first major surface of the dielectric substrate; and
a ferrule comprising a body and a flange extending from the body, wherein the flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

2. The assembly of claim 1 , further comprising a feedthrough disposed in the dielectric substrate.

3. The assembly of claim 2 , wherein the feedthrough comprises:
a via disposed between the first major surface and the second major surface of the dielectric substrate;
a conductive material disposed in the via; and
an external contact disposed over the via adjacent the first major surface of the dielectric substrate, wherein the external contact is electrically connected to the conductive material disposed in the via.

4. The assembly of claim 3 , wherein the external contact of the feedthrough is hermetically sealed to the first major surface of the dielectric substrate by a laser bond that surrounds the via.

5. The assembly of claim 1 , wherein the flange further comprises a major surface that contacts the welding portion of the patterned layer.

6. The assembly of claim 5 , wherein the major surface of the flange is substantially parallel to the first major surface of the dielectric substrate.

7. The assembly of claim 1 , further comprising an electronic component disposed adjacent to at least one of the first major surface or the second major surface of the dielectric substrate, wherein one or more test points are disposed on a surface of the electronic component.

8. The assembly of claim 1 , wherein the ferrule further comprises a tab extending from the body and adapted to connect the ferrule to a header.

9. An implantable medical device comprising a hermetically-sealed package, wherein the package comprises:
a housing; and
a hermetic assembly comprising:
a dielectric substrate comprising a first major surface and a second major surface;
a patterned layer connected to the first major surface of the dielectric substrate; and
a ferrule comprising a body and a flange extending from the body, wherein the flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate;

wherein an edge of the body of the ferrule is connected to an edge of the housing.

10. The device of claim 9 , wherein the patterned layer is connected to the first major surface of the dielectric substrate by a laser bond.

11. The device of claim 9 , wherein the hermetically-sealed package further comprises a second housing connected to a second edge of the body of the ferrule.

12. The device of claim 11 , wherein the second housing comprises an external contact adapted to provide an electrical signal to tissue of a patient.

13. The device of claim 11 , wherein at least one of the housing, the second housing, or the dielectric substrate comprises an elliptical cross-section in a plane that is substantially parallel to the first major surface of the dielectric substrate.

14. The device of claim 11 , further comprising one or more tines that are connected to the second housing.

15. The device of claim 9 , wherein the patterned layer comprises an external electrode disposed on the first major surface of the dielectric substrate.

16. The device of claim 15 , wherein the external electrode is adapted to at least one of direct energy to tissue of a patient or receive energy from tissue of the patient.

17. The device of claim 15 , further comprising an electronic component disposed adjacent to the second major surface of the dielectric substrate, wherein the external contact is electrically connected to the electronic component.

18. A hermetically-sealed package comprising a first hermetic assembly and a second hermetic assembly connected to the first hermetic assembly, wherein each of the first hermetic assembly and second hermetic assembly comprises:
a dielectric substrate comprising a first major surface and a second major surface;
a patterned layer connected to the first major surface of the dielectric substrate; and
a ferrule comprising a body and a flange extending from the body, wherein the flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.

19. The package of claim 18 , wherein the ferrule of the first hermetic assembly is connected to a ferrule of the second hermetic assembly.

20. The package of claim 19 , wherein an edge of the body of the ferrule of the first hermetic assembly is connected to an edge of the body of the ferrule of the second hermetic assembly.

Assignees

• Medtronic Inc

Inventors

• Ruben David A
• Fenner Andreas
• Ries Andrew J
• Munoz Robert A
• Kinsey Christopher T
• Henschel Mark E

Classifications

• A61N1/3754 Primary

  Feedthroughs · CPC title

• A61N1/3968

  Constructional arrangements, e.g. casings (A61N1/375 takes precedence) · CPC title

• B23K26/32

  taking account of the properties of the material involved · CPC title

• A61N1/37512

  Pacemakers · CPC title

• B23K26/20

  Bonding (soldering by means of radiant energy B23K1/005) · CPC title