Bonding (soldering by means of radiant energy B23K1/005)

Bonding (soldering by means of radiant energy B23K1/005) · Cooperative Patent Classification (CPC)

Separating, mixing, shaping, printing, and transporting materials.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeB23K26/20
Official titleBonding (soldering by means of radiant energy B23K1/005)
Display labelBonding (soldering by means of radiant energy B23K1/005)
Total patents425

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is declining.

Patents filed per year
YearPatents
201596
201654
201753
201836
201932
202032
202132
202224
202328
202419
202518
20261

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC B23K26/20?
CPC B23K26/20 is the Cooperative Patent Classification code for “Bonding (soldering by means of radiant energy B23K1/005).”
How many patents are filed under CPC B23K26/20 (Bonding (soldering by means of radiant energy B23K1/005))?
Our database includes 425 publications tagged with this CPC code.
Is patent activity under CPC B23K26/20 growing?
Publication counts under this code: 19 in 2024 vs 18 in 2025 (latest complete years).