Implantable medical devices and methods of forming same

Patent metadata

Field	Value
Publication number	US-2016184593-A1
Application number	US-201514966279-A
Country	US
Kind code	A1
Filing date	Dec 11, 2015
Priority date	Dec 24, 2014
Publication date	Jun 30, 2016
Grant date	—

Abstract

Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

First claim

What is claimed is:

1 . An implantable medical device system, comprising:
a housing; electronics disposed within the housing; a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics, the feedthrough assembly comprising a non-conductive substrate and a feedthrough, the feedthrough comprising:
a via from an outer surface to an inner surface of the non-conductive substrate;
a conductive material disposed in the via; and
an external contact disposed over the via on the outer surface of the non-conductive substrate, wherein the external contact is electrically coupled to the conductive material disposed in the via, and wherein the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via; and
a connector header disposed on the housing of the implantable medical device, the connector header comprising a housing that surrounds the feedthrough assembly, wherein the connector header further comprises a receptacle adapted to receive a proximal portion of a lead and electrically couple a contact of the lead to the external contact of the feedthrough assembly.

2 . The system of claim 1 , wherein the feedthrough assembly further comprises a weld ring hermetically sealed to the non-conductive substrate by a laser bond adjacent a perimeter of the substrate, wherein the weld ring surrounds the external contact.

3 . The system of claim 2 , wherein the weld ring is hermetically sealed to the housing of the implantable medical device by a laser bond between the housing and the weld ring and the weld ring includes an electrical pathway for electrically coupling the housing to a portion of the inner surface.

4 . The system of claim 1 , wherein the housing of the implantable medical device is hermetically sealed to the non-conductive substrate of the feedthrough assembly by a laser bond between the housing and the non-conductive substrate.

5 . The system of claim 1 , wherein the feedthrough further comprises an internal contact disposed over the via on the inner surface of the non-conductive substrate, wherein the internal contact is electrically coupled to the conductive material disposed in the via, wherein the internal contact is electrically coupled to the electronics.

6 . The system of claim 5 , further comprising a conductor that electrically couples the electronics and the internal contact of the feedthrough assembly.

7 . The system of claim 1 , wherein the laser bond that hermetically seals the external contact to the outer surface of the non-conductive substrate comprises an interfacial layer between the external contact and the non-conductive substrate.

8 . The system of claim 7 , wherein the interfacial layer has a thickness in a direction normal to the outer surface of the non-conductive substrate of no greater than 10 μm.

9 . The system of claim 1 , wherein the non-conductive substrate is substantially transmissive to light having a wavelength between 10 nm and 30 μm.

10 . The system of claim 1 , wherein the non-conductive substrate comprises at least one of glass, quartz, silica, sapphire, silicon carbide, diamond, and gallium nitride, and alloys or combinations thereof.

11 . The system of claim 1 , wherein the external contact comprises at least one of titanium, niobium, zirconium, tantalum, stainless steel, platinum, and iridium, and alloys or combinations thereof.

12 . The system of claim 1 , wherein the external contact comprises a thickness in a direction normal to the outer surface of the non-conductive substrate of at least 10 micrometers.

13 . The system of claim 1 , wherein the feedthrough assembly further comprises a second feedthrough, wherein the system further comprises an electronic device disposed on the inner surface of the non-conductive substrate, wherein the electronic device is electrically coupled to conductive material in a via of the second feedthrough by a conductor disposed on the inner surface, and wherein the electronic device is attached to the non-conductive substrate by a bond.

14 . The system of claim 13 , wherein the electronic device comprises an integrated circuit.

15 . The system of claim 1 , wherein the via comprises an opening at the outer surface of the non-conductive substrate that has a diameter of no greater than 500 micrometers.

16 . The system of claim 1 , wherein the laser bond that hermetically seals the external contact to the outer surface of the non-conductive substrate forms a closed shape in a plane parallel to the outer surface of the non-conductive substrate.

17 . The system of claim 1 , further comprising a conductor disposed on the outer surface of the non-conductive substrate and electrically coupled to the external contact.

18 . The system of claim 1 , wherein the non-conductive substrate is substantially transmissive to a transmitted light having a pre-determined magnitude such that the energy transmitted through the substantially transparent substrate material is at least one of: sufficient to activate the bonding process at the interface via absorption by the opaque material, and absorbable by the transparent material without melting, distorting, or otherwise modifying the bulk properties of the transparent material away from the bonding region.

19 . The system of claim 1 , wherein the feedthrough further comprises a filtering capacitor electrically coupled to the via on the inner surface of the non-conductive substrate, wherein the filtering capacitor comprises a dielectric member interposed between two conductive layers.

20 . A method of forming an implantable medical device comprising a housing and electronics disposed within the housing, wherein forming the implantable medical device comprises:
forming a feedthrough assembly comprising a non-conductive substrate; and attaching the feedthrough assembly to the housing by forming a laser bond between the feedthrough assembly and the housing that hermetically seals the feedthrough assembly to the housing.

21 . The method of claim 20 , wherein forming the feedthrough assembly comprises:
forming a via through the non-conductive substrate, the non-conductive substrate comprising an outer surface and an inner surface; forming a conductive material in the via that is electrically coupled to the external contact; forming an external contact over the via, wherein the external contact is electrically coupled to the conductive material formed in the via; and attaching the external contact to the outer surface of the non-conductive substrate by forming a laser bond that surrounds the via and hermetically seals the external contact to the outer surface of the non-conductive substrate.

22 . The method of claim 20 , further comprising electrically coupling the external contact of the feedthrough assembly to the electronics in the housing.

23 . The method of claim 20 , wherein attaching the feedthrough assembly to the housing comprises attaching a weld ring of the feedthrough assembly to the housing by forming the laser bond between the weld ring and the housing that hermetically seals the feedthrough assembly to the housing.

24 . The method of claim 20 , wherein attaching the feedthrough assembly to the housing comprises attaching the non-conductive substrate of the feedthrough assembly to the housing by forming the laser bond between the non-conductive substrate and the housing t

Assignees

• Medtronic Inc

Inventors

• Ruben David A
• Sandlin Michael S

Classifications

• A61N1/3754 Primary

  Feedthroughs · CPC title

• H05K3/42

  Plated through-holes {or plated via connections} · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title

• H05K5/066 Primary

  sealed by fusion of the joining parts without bringing material; sealed by brazing · CPC title

• H05K7/06

  on insulating boards {, e.g. wiring harnesses (for printed circuits H05K1/18, H05K3/30)} · CPC title