Metal resin composite, preparation method thereof, and electronic product housing having the same

Patent metadata

Field	Value
Publication number	US-12215424-B2
Application number	US-201917280318-A
Country	US
Kind code	B2
Filing date	Sep 10, 2019
Priority date	Sep 28, 2018
Publication date	Feb 4, 2025
Grant date	Feb 4, 2025

Abstract

A metal resin composite includes a metal substrate, a metal layer formed on a surface of the metal substrate, and a resin layer formed on the metal layer. A plurality of microcracks are formed at a surface of the metal layer.

First claim

What is claimed is:

1. A preparation method for a metal resin composite, comprising:
forming a metal layer on a metal substrate;
forming a plurality of microcracks on a surface of the metal layer by contacting the metal layer on the metal substrate with a treating agent containing an acid and an oxidizing agent, wherein each microcrack is an elongate groove along the surface of the metal layer, and a depth of the microcracks is 2000-3000 nm and a width of the microcracks is 230-370 nm; and
forming a resin layer on the metal layer,
wherein at least a part of the plurality of microcracks are connected to each other and form an interconnected network of microcracks.

2. The preparation method according to claim 1 , wherein forming the metal layer on the metal substrate comprises:
forming a metal plating layer on the metal substrate.

3. The preparation method according to claim 2 , wherein forming the metal layer on the metal substrate further comprises:
forming a nickel plating layer, a copper plating layer, or a tin plating layer on the metal substrate.

4. The preparation method according to claim 3 , wherein forming the metal layer on the metal substrate further comprises:
forming an electroless nickel plating layer, an electroless copper plating layer, or an electroless tin plating layer on the metal substrate by an electroless plating method.

5. The preparation method according to claim 4 , wherein the electroless nickel plating layer is an electroless nickel plating layer containing phosphorus in a phosphorus content of 1-3 wt. %.

6. The preparation method according to claim 1 , wherein:
the acid is one or more of: sulfuric acid, hydrochloric acid, hydrogen fluoride, nitric acid, and phosphoric acid; and
the oxidizing agent is one or more of: ferric chloride, copper chloride, persulfate, hydrogen peroxide, peroxydisulfuric acid, perphosphoric acid, and peracetic acid.

7. The preparation method according to claim 1 , wherein:
a content of acid in the treating agent is 10-500 g/L;
a content of oxidizing agent in the treating agent is 10-800 g/L;
contact conditions comprise: a contact temperature of 20-70° C., and a contact time of 0.1-5 min.

8. The preparation method according to claim 1 , wherein forming the resin layer on the metal layer comprises:
injection molding a resin composition on the metal layer to form the resin layer.

9. The preparation method according to claim 8 , wherein the resin in the resin composition is selected from one or more of: polyester, polyamide, polyether ether ketone, polyolefin, polycarbonate, polyarylether, polyetherimide, polyphenyl ether, polyphenylene sulfide, polyimide, polysulfone, and polyurethane.

Assignees

• Byd Co Ltd

Inventors

• Lian Junlan
• Lin Hongye
• Chen Fan
• Li Weitu

Classifications

• C23C18/31

  Coating with metals · CPC title

• B29L2031/34

  Electrical apparatus, e.g. sparking plugs or parts thereof · CPC title

• B29K2705/00

  Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts · CPC title

• B29C45/14778

  the article consisting of a material with particular properties, e.g. porous, brittle · CPC title

• C23C18/1651

  Two or more layers only obtained by electroless plating · CPC title