Metal member, metal member surface processing method, semiconductor device, semiconductor device manufacturing method, and composite molded body

Patent metadata

Field	Value
Publication number	US-2016207148-A1
Application number	US-201414914061-A
Country	US
Kind code	A1
Filing date	Nov 10, 2014
Priority date	Dec 9, 2013
Publication date	Jul 21, 2016
Grant date	—

Abstract

An object is to form a rough surface for ensuring adhesion between a metal member and other members, or a rough surface for suppressing solder expansion in the metal member using an energy beam having energy density lower than a related art. A surface processing method of a metal member, in which a metal thin film is arranged on a surface of a base, includes: melting or evaporating a surface portion of the metal thin film by irradiating the metal thin film with a pulse-oscillated laser beam having energy density of 100 J/cm 2 or less and a pulse width of 1 μs or less; and roughening the surface of the metal thin film by solidifying the surface portion of the metal thin film after the melting or evaporating. The metal thin film is made of at least one of Ni, Au, Pd, and Ag as a main component.

First claim

1 . A surface processing method of a metal member in which a metal thin film is arranged on a surface of a base made of a conductive metal material, the surface processing method comprising:
forming the metal thin film with a material having at least one of Ni, Au, Pd, and Ag as a main component; melting or evaporating a surface portion of the metal thin film by irradiating the surface of the metal thin film with a laser beam which is pulse-oscillated, and has energy density of 100 J/cm 2 or less and a pulse width equal to or less than 1 μs; and roughening the surface of the metal thin film by solidifying the surface portion of the metal thin film after the melting or evaporating.

2 . The surface processing method of the metal member according to claim 1 , wherein:
the melting or evaporating includes:
arranging a plurality of beam sources of the laser beam along a direction of a plurality of normal lines to the surface of the metal thin film, the normal lines respectively passing through a plurality of different positions on at least one straight line, which is parallel with the surface of the metal thin film; and
irradiating the laser beam on the plurality of different positions on the at least one straight line on the surface of the metal thin film.

3 . The surface processing method of the metal member according to claim 2 , wherein:
the melting or evaporating further includes:
moving the beam sources of the laser beam along the straight line; and
sequentially irradiating the laser beam on the plurality of different positions on the straight line.

4 . The surface processing method of the metal member according to claim 2 , wherein:
the at least one straight line includes a plurality of straight lines; and the plurality of straight lines are parallel with each other.

5 . A manufacturing method of a semiconductor device, which includes a lead frame, an IC chip, and a molded resin, wherein: the lead frame has the base, and the metal thin film formed on a surface of the base; the IC chip is mounted on the surface of the metal thin film; the molded resin is formed so as to cover the IC chip and so as to contact with the surface of the metal thin film, the manufacturing method of the semiconductor device comprising:
roughening a portion of the surface of the metal thin film, which contacts with the molded resin, by the surface processing method of the metal member according to claim 1 .

6 . A semiconductor device comprising:
a lead frame which includes a base made of a conductive metal material, and a metal thin film arranged on a surface of the base; an IC chip which is mounted on a surface of the metal thin film; and a molded resin which covers the IC chip and contacts with the surface of the metal thin film, wherein: the metal thin film is made of a material which has at least one of Ni, Au, Pd, and Ag as a main component; a groove having a width in a range between 5 μm and 300 μm and extending along a straight line parallel with the surface of the base is arranged at a surface portion of the surface of the metal thin film, which contacts with the molded resin; a plurality of convex portions are arranged around the groove at the surface portion of the metal thin film; and a fine unevenness is arranged to have a size, in which an average height of the convex portions is in a range between 1 nm and 500 nm, an average width of the convex portions is in a range between 1 nm and 300 nm, and an average distance between the convex portions is in a range between 1 nm and 300 nm.

7 . A semiconductor device comprising:
a lead frame which includes a base made of a conductive metal material, and a metal thin film arranged on a surface of the base; an IC chip which is mounted on a surface of the metal thin film; and a molded resin which covers the IC chip and contacts with the surface of the metal thin film, wherein: the metal thin film is made of a material which has at least one of Ni, Au, Pd, and Ag as a main component; a groove having a width in a range between 5 μm and 300 μm and extending along a straight line parallel with the surface of the base is arranged at a surface portion of the surface of the metal thin film, which contacts with the molded resin; a plurality of convex portions are arranged in the groove at the surface portion of the metal thin film; and a fine unevenness is arranged to have a size, in which an average height of the convex portions is in a range between 1 nm and 500 nm, an average width of the convex portions is in a range between 1 nm and 300 nm, and an average distance between the convex portions is in a range between 1 nm and 300 nm.

8 . The semiconductor device according to claim 6 , wherein:
the fine unevenness is made of oxide obtained by oxidizing the material of the metal thin film, or is made of an alloy of the material of the metal thin film and a material of the base.

9 . A composite molded body comprising:
a metal member which includes a base made of a conductive metal material, and a metal thin film arranged on a surface of the base; and an electronic component which is bonded to a surface of the metal thin film through a solder, wherein: the metal thin film is made of a material which has at least one of Ni, Au, Pd, and Ag as a main component; a laser irradiation groove having a width in a range between 5 μm and 300 μm is arranged at least at a portion of the surface of the metal thin film, which is disposed around a region in which the solder is disposed; a plurality of convex portions are arranged around the groove; and a fine unevenness is arranged to have a size, in which an average height of the convex portions is in a range between 1 nm and 500 nm, an average width of the convex portions is in a range between 1 nm and 300 nm, and an average distance between the convex portions is in a range between 1 nm and 300 nm.

10 . The composite molded body according to claim 9 , wherein:
the groove and the fine unevenness are arranged along an entire circumference of a surrounding of a region of the surface of the metal thin film, in which the solder is disposed.

11 . A semiconductor device comprising:
a lead frame which includes a base made of a conductive metal material, and a metal thin film arranged on a surface of the base; an IC chip which is bonded to a surfaced of the metal thin film through a solder; and a molded resin which covers the IC chip and contacts with the surface of the metal thin film, wherein: the metal thin film is made of a material which has at least one of Ni, Au, Pd, and Ag as a main component; a laser irradiation groove having a width in a range between 5 μm and 300 μm is arranged at a portion of the surface of the metal thin film, which contacts with the molded resin, and is arranged at least at a portion of the surface of the metal thin film, which is disposed around a region in which the solder is disposed; a plurality of convex portions are arranged around the groove; and a fine unevenness is arranged to have a size in which an average height of the plurality of convex portions is in a range between 1 nm and 500 nm, an average width of the convex portions is in a range between 1 nm and 300 nm, and an average distance between the convex portions is in a range between 1 nm and 300 nm.

12 . The semiconductor device according to claim 11 , wherein:
the groove and the fine unevenness are arranged along an entire circumference of a surrounding of a region of the surface of the metal thin film, in which the solder is disposed.

13 . The surface processing method of a metal member according to claim 2 , wherein:
the at least one straigh

Assignees

• Denso Corp

Inventors

• Kobayashi Wataru
• Hayashi Eiji
• Kouda Kazuki

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/931

  Shapes of bond pads · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title