Metal resin composite-molded article and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-11697232-B2
Application number	US-201816632257-A
Country	US
Kind code	B2
Filing date	Jul 19, 2018
Priority date	Jul 20, 2017
Publication date	Jul 11, 2023
Grant date	Jul 11, 2023

Abstract

A metal resin composite-molded article which can suppress deformation induced by laser processing in a technique for improving the adhesion between a metal plate and a resin by forming grooves on the surface of the metal plate by means of a laser, even if the metal plate is thin. A metal resin composite-molded article obtained by insert-molding a resin composition on a metal plate having a thickness of 500 μm or less, grooves are formed on the surface of the metal plate in which the resin composition is inserted, the width of the grooves is 30-300 μm, the depth of the grooves is at most 24% of the thickness of the metal plate, and the ratio of the width to the depth is 0.1-2.5.

First claim

The invention claimed is:

1. A method for producing a metal resin composite molded article, the method comprising insert molding a resin composition to a copper plate in a rolled shape having a thickness H of 450 μm or less,
wherein the method comprises a step of forming on a surface of the copper plate a groove by laser scanning, to which the resin composition is inserted, and
wherein an energy per unit area of the surface is 0.234-0.26 J/mm 2 and the surface is scanned a number of times sufficient to achieve a width Y of the groove of 35 to 300 μm, a depth X of the groove of 5-23.8% of the thickness H of the copper plate, and a ratio of the depth X to the width Y, X/Y, of 0.1 to 2.29.

Assignees

• Polyplastics Co
• Yamase Electric Co Ltd

Inventors

• Kondo Hidemi

Classifications

• B29C45/14811

  Multilayered articles (B29C45/14827 takes precedence) · CPC title

• B29C45/14311 Primary

  using means for bonding the coating to the articles (B29C45/14795 takes precedence) · CPC title

• B23K26/364

  for making a groove or trench, e.g. for scribing a break initiation groove · CPC title

• B32B15/08

  of synthetic resin · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title