Device over patterned buried porous layer of semiconductor material
US-2024006524-A1 · Jan 4, 2024 · US
Semiconductors
Semiconductors · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W40/253 |
| Official title | {Semiconductors} |
| Display label | Semiconductors |
| Total patents | 650 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 23 |
| 2016 | 36 |
| 2017 | 53 |
| 2018 | 41 |
| 2019 | 59 |
| 2020 | 64 |
| 2021 | 60 |
| 2022 | 50 |
| 2023 | 59 |
| 2024 | 84 |
| 2025 | 97 |
| 2026 | 24 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method and structure to suppress finFET heating
US-9530684-B2 · Dec 27, 2016 · US
Method for forming metallic sub-collector for HBT and BJT transistors
US-9508552-B1 · Nov 29, 2016 · US
Semiconductor device assembly with heat transfer structure formed from semiconductor material
US-2016343687-A1 · Nov 24, 2016 · US
Fan-out stacked system in package (sip) having dummy dies and methods of making the same
US-2016322330-A1 · Nov 3, 2016 · US
Electronic device with dummy ic die and related methods
US-2016293512-A1 · Oct 6, 2016 · US
Programmable active cooling device
US-2016293515-A1 · Oct 6, 2016 · US
Glass interposer with thermal vias
US-2016286660-A1 · Sep 29, 2016 · US
Method and structure to suppress finfet heating
US-2016284586-A1 · Sep 29, 2016 · US
Electron emission surface for X-ray generation
US-9443691-B2 · Sep 13, 2016 · US
Semiconductor die assemblies with heat sink and associated systems and methods
US-2016233110-A1 · Aug 11, 2016 · US
Electrodeposition methods of gallium and gallium alloy films and related photovoltaic structures
US-9401443-B2 · Jul 26, 2016 · US
Power amplifier package and method thereof
US-2016211214-A1 · Jul 21, 2016 · US
Integrated circuit heat dissipation using nanostructures
US-2016204048-A1 · Jul 14, 2016 · US
Integrated circuit heat dissipation using nanostructures
US-2016204233-A1 · Jul 14, 2016 · US
Resin composition for a surface treatment, and steel sheet coated with same
US-9376576-B2 · Jun 28, 2016 · US
Stacked semiconductor die assemblies with thermal spacers and associated systems and methods
US-2016181125-A1 · Jun 23, 2016 · US
Method and structure to suppress FinFET heating
US-9368493-B2 · Jun 14, 2016 · US
Semiconductor structure with deep trench thermal conduction
US-9349838-B2 · May 24, 2016 · US
Semiconductor die assemblies with heat sink and associated systems and methods
US-9349670-B2 · May 24, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W40/253?
- CPC H10W40/253 is the Cooperative Patent Classification code for “Semiconductors.”
- How many patents are filed under CPC H10W40/253 (Semiconductors)?
- Our database includes 650 publications tagged with this CPC code.
- Is patent activity under CPC H10W40/253 growing?
- Publication counts under this code: 84 in 2024 vs 97 in 2025 (latest complete years).