Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-12131918-B2
Application number	US-202217667459-A
Country	US
Kind code	B2
Filing date	Feb 8, 2022
Priority date	Mar 29, 2021
Publication date	Oct 29, 2024
Grant date	Oct 29, 2024

Abstract

A substrate processing apparatus includes a process chamber including a first body and a second body that are coupled to each other to form a processing space therein, a clamping member configured to clamp the first body and the second body, and an anti-friction member mounted in a groove formed in a contact region between the first body or the second body and the clamping member.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a process chamber comprising a first body with a top surface, a side surface, and a first protrusion portion extending outwardly from the side surface and a second body with a second protrusion portion at an upper portion of the second body, wherein the first protrusion portion and the second protrusion portion are coupled with each other, and wherein a processing space is defined by the first body and the second body coupled with each other and a top surface of the first protrusion is connected to the side surface and is lower than the top surface of the first body;
a clamping member configured to clamp the first protrusion portion of the first body and the second protrusion portion of the second body;
an anti-friction member mounted in a groove formed at a contact region between the clamping member and at least one of the first body and the second body; and
a fastening member disposed in the contact region and configured to fix the anti-friction member at the contact region.

2. The substrate processing apparatus of claim 1 ,
wherein the groove comprises:
a first body groove formed at the first body in a first contact region between the clamping member and the first body; and
a second body groove formed at the second body in a second contact region between the clamping member and the second body.

3. The substrate processing apparatus of claim 1 ,
wherein the groove comprises:
a first clamping groove formed at the clamping member in a first contact region between the clamping member and the first body; and
a second clamping groove formed at the clamping member in a second contact region between the clamping member and the second body.

4. The substrate processing apparatus of claim 1 ,
wherein the anti-friction member is made of at least one of polyether ether ketone (PEEK), polyimide (PI), poly-aramid, polyethylene terephthalate (PET), zirconia, SiC, SiN, and alumina.

5. The substrate processing apparatus of claim 1 ,
wherein the anti-friction member includes a metallic body and a resin coating or a diamond-like coating (DLC) on a surface of the metallic body.

6. The substrate processing apparatus of claim 1 ,
wherein the anti-friction member has a surface area smaller than a surface area of the groove.

7. The substrate processing apparatus of claim 6 ,
wherein the anti-friction member and a side wall of the groove are spaced apart from each other by a predetermined gap, and
wherein the predetermined gap is larger than the amount of deformation of the anti-friction member caused by pressure acting on the anti-friction member.

8. The substrate processing apparatus of claim 1 ,
wherein an upper surface of the anti-friction member is higher than an upper surface of the first body.

9. The substrate processing apparatus of claim 1 ,
wherein the anti-friction member has a through-hole that is aligned with a closed-end hole of the at least one of the first body and the second body, and
wherein the fastening member is disposed in the through-hole of the anti-friction member and the closed-end hole of the at least one of the first body and the second body to fix the anti-friction member at the contact region.

Assignees

• Semes Co Ltd

Inventors

• Lee Sang Min
• Oh Seung Hoon
• Im Yong Joon
• Yang Hyo Won

Classifications

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/0404

  for general liquid treatment, e.g. etching followed by cleaning · CPC title

• H10P72/0406 Primary

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P72/0411

  for wet cleaning or washing · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title