Heterostructure and method of fabrication

Patent metadata

Field	Value
Publication number	US-12101080-B2
Application number	US-202318302440-A
Country	US
Kind code	B2
Filing date	Apr 18, 2023
Priority date	Jun 12, 2015
Publication date	Sep 24, 2024
Grant date	Sep 24, 2024

Abstract

The present invention relates to a heterostructure, in particular, a piezoelectric structure, comprising a cover layer, in particular, a layer of piezoelectric material, the material of the cover layer having a first coefficient of thermal expansion, assembled to a support substrate, the support substrate having a second coefficient of thermal expansion substantially different from the first coefficient of thermal expansion, at an interface wherein the cover layer comprises at least a recess extending from the interface into the cover layer, and its method of fabrication.

First claim

What is claimed is:

1. A substrate for use in fabricating an acoustic wave device, comprising:
a support substrate;
a charge trapping layer on a surface of the support substrate;
a cover material over the charge trapping layer on a side thereof opposite the support substrate along a bonding interface; and
a layer of adhesive material positioned between the cover material and the charge trapping layer;
wherein the cover material exhibits a first coefficient of thermal expansion (CTE1) that is different from a second coefficient of thermal expansion (CTE2) of the support substrate.

2. The substrate of claim 1 , wherein the CTE1 and the CTE2 define a maximum coefficient of thermal expansion and a minimum coefficient of thermal expansion and wherein the maximum coefficient of thermal expansion divided by the minimum coefficient of thermal expansion is greater than 2.

3. The substrate of claim 2 , wherein the maximum coefficient of thermal expansion divided by the minimum coefficient of thermal expansion is greater than 6.0.

4. The substrate of claim 1 , wherein the cover material has a thickness below 10 μm.

5. The substrate of claim 1 , wherein the charge trapping layer electrically disconnects or decouples the cover material from the support substrate.

6. The substrate of claim 1 , wherein the charge trapping layer has a thickness below 10 μm.

7. A heterostructure for use in fabricating an acoustic wave device, comprising:
a support substrate;
a charge trapping layer on a surface of the support substrate; and
a cover material bonded over the charge trapping layer on a side thereof opposite the support substrate along a bonding interface;
wherein the bonding interface is located between the cover material and the charge trapping layer; and
wherein the cover material exhibits a first coefficient of thermal expansion (CTE1) that is different from a second coefficient of thermal expansion (CTE2) of the support substrate; and
wherein a highest coefficient of thermal expansion of the CTE1 and the CTE2 divided by a lowest coefficient of thermal expansion of the CTE1 and the CTE2 is greater than 2.

8. The heterostructure of claim 7 , wherein the support substrate has a resistivity higher than 1 kOhm/cm.

9. The heterostructure of claim 7 , wherein the highest coefficient of thermal expansion of the CTE1 and the CTE2 divided by the lowest coefficient of thermal expansion of the CTE1 and the CTE2 is greater than 4.

10. The heterostructure of claim 9 , wherein the highest coefficient of thermal expansion divided by the lowest coefficient of thermal expansion is greater than 6.

11. The heterostructure of claim 7 , wherein at least one of the CTE1 and 11 the CTE2 is anisotropic.

12. The heterostructure of claim 7 , wherein the support substrate comprises at least one material selected from among the group consisting of: Si, Ge, GaAs, InP, SiGe, and sapphire.

13. A heterostructure for use in fabricating an acoustic wave device, comprising:
a support substrate;
a charge trapping layer on a surface of the support substrate; and
a cover material bonded over the charge trapping layer on a side thereof opposite the support substrate along a bonding interface;
wherein the bonding interface is located between the cover material and the charge trapping layer;
wherein the cover material exhibits a first coefficient of thermal expansion (CTE1) that is substantially different from a second coefficient of thermal expansion (CTE2) of the support substrate; and
wherein the charge trapping layer has a thickness below 1 μm.

14. A substrate for use in fabricating an acoustic wave device, comprising:
a support substrate comprising at least one material selected from among the group consisting of:
Si, Ge, GaAs, InP, SiGe, and sapphire, the support substrate having a first coefficient of thermal expansion (CTE1);

a porous and/or polycrystalline trap-rich layer on a surface of the support substrate;
a cover material bonded over the porous and/or polycrystalline trap-rich layer on a side thereof opposite the support substrate, the cover material having a second coefficient of thermal expansion (CTE2) different from the CTE1; and
a layer of adhesive material between the cover material and the porous and/or polycrystalline trap-rich layer.

15. The substrate of claim 14 , wherein the cover material comprises a piezoelectric material.

16. The substrate of claim 14 , wherein the CTE1 is at least two times larger than the CTE2.

17. The substrate of claim 14 , wherein the CTE2 is at least two times larger than the CTE1.

18. The substrate of claim 14 , wherein the cover material has a thickness below 10 μm, the trap-rich layer has a thickness below 10 μm, and the substrate has a resistivity higher than 1 kOhm/cm.

19. The substrate of claim 14 , further comprising at least one recess extending at least partially into the cover material from a side thereof proximate the support substrate.

Assignees

• Soitec Silicon On Insulator

Inventors

• Castex Arnaud
• Delprat Daniel
• Aspar Bernard
• Radu Ionut

Classifications

• H03H3/10

  for obtaining desired frequency or temperature coefficient · CPC title

• H03H9/02834 Primary

  of temperature influence (cut angles H03H9/02543) · CPC title

• H03H9/6496

  Reducing ripple in transfer characteristic · CPC title

• H10N30/704 Primary

  based on piezoelectric or electrostrictive films or coatings · CPC title

• H10N35/01

  Manufacture or treatment · CPC title