Structure for radio frequency applications
US-12418120-B2 · Sep 16, 2025 · US
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Aspar Bernard patents
Aspar Bernard is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Aspar Bernard |
| Total patents | 21 |
| First publication | Jun 25, 2015 |
| Latest publication | Sep 16, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Heterostructure and method of fabrication
US-2024396520-A1 · Nov 28, 2024 · US
Heterostructure and method of fabrication
US-12101080-B2 · Sep 24, 2024 · US
Heterostructure and method of fabrication
US-2023275559-A1 · Aug 31, 2023 · US
Heterostructure and method of fabrication
US-11637542-B2 · Apr 25, 2023 · US
Heterostructure and method of fabrication
US-11595020-B2 · Feb 28, 2023 · US
Structure for radio frequency applications
US-2022368036-A1 · Nov 17, 2022 · US
Structure for radio frequency applications
US-11502428-B2 · Nov 15, 2022 · US
Structure for radio frequency applications
US-2021280990-A1 · Sep 9, 2021 · US
Structure for radio frequency applications
US-11043756-B2 · Jun 22, 2021 · US
Recent patents
Latest publications not already listed above.
Heterostructure and method of fabrication
US-2021058058-A1 · Feb 25, 2021 · US
Heterostructure and method of fabrication
US-10826459-B2 · Nov 3, 2020 · US
Heterostructure and method of fabrication
US-2020280298-A1 · Sep 3, 2020 · US
Structure for a radio frequency application
US-2019372243-A1 · Dec 5, 2019 · US
Heterostructure and method of fabrication
US-2018159498-A1 · Jun 7, 2018 · US
Methods for fabrication of semiconductor structures using laser lift-off process, and related semiconductor structures
US-9728458-B2 · Aug 8, 2017 · US
Methods of forming semiconductor structures including MEMS devices and integrated circuits on common sides of substrates, and related structures and devices
US-9511996-B2 · Dec 6, 2016 · US
Methods of forming semiconductor structures including MEMS devices and integrated circuits on opposing sides of substrates, and related structures and devices
US-9481566-B2 · Nov 1, 2016 · US
Methods of forming semiconductor structures including mems devices and integrated circuits on common sides of substrates, and related structures and devices
US-2015210540-A1 · Jul 30, 2015 · US
Methods of forming semiconductor structures including mems devices and integrated circuits on opposing sides of substrates, and related structures and devices
US-2015191344-A1 · Jul 9, 2015 · US
Methods for fabrication of semiconductor structures using laser lift-off process, and related semiconductor structures
US-2015179520-A1 · Jun 25, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Soitec Silicon On Insulator | 21 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H03H3/10 | 9 |
| H03H9/02834 | 9 |
| H03H3/04 | 9 |
| H10N30/704 | 9 |
| H03H9/02574 | 9 |