Process variability aware adaptive inspection and metrology

Patent metadata

Field	Value
Publication number	US-12092965-B2
Application number	US-202117313135-A
Country	US
Kind code	B2
Filing date	May 6, 2021
Priority date	Feb 13, 2015
Publication date	Sep 17, 2024
Grant date	Sep 17, 2024

Abstract

A defect prediction method for a device manufacturing process involving processing one or more patterns onto a substrate, the method including: determining values of one or more processing parameters under which the one or more patterns are processed; and determining or predicting, using the values of the one or more processing parameters, an existence, a probability of existence, a characteristic, and/or a combination selected from the foregoing, of a defect resulting from production of the one or more patterns with the device manufacturing process.

First claim

What is claimed is:

1. A non-transitory computer-readable medium having instructions therein, the instructions, upon execution by a computer system, configured to cause the computer system to at least:
obtain measured values of one or more processing parameters under which one or more patterns are processed onto a plurality of areas on a substrate, the measured values processed into the form of a map conveying the location of the measured values on the plurality of areas on the substrate;
identify, based on the values of the one or more processing parameters, areas across the substrate for which the one or more patterns are, or are prone to be, defective resulting from production of the one or more patterns with a device manufacturing process; and
generate a map conveying the location of the identified areas on the substrate.

2. The computer-readable medium of claim 1 , wherein the instructions are further configured to cause the computer system to cause inspection, by an inspection apparatus, of one or more identified areas of the identified areas of the map.

3. The computer-readable medium of claim 1 , wherein the instructions configured to cause the computer system to identify areas for which the one or more patterns are, or are prone to be, defective are further configured to perform a simulation for the one or more patterns based on the values of the one or more processing parameters.

4. The computer-readable medium of claim 1 , wherein the one or more processing parameters are selected from: focus, depth of focus, focus error, dose, an illumination parameter, or a projection optics parameter.

5. The computer-readable medium of claim 1 , wherein the one or more patterns comprise an identified process window limiting pattern.

6. The computer-readable medium of claim 1 , wherein the areas also enclose one or more patterns that are not, or not prone to be, defective.

7. The computer-readable medium of claim 1 , wherein the instructions configured to cause the computer system to identify areas for which the one or more patterns are, or are prone to be, defective are further configured to use a machine learning classification model.

8. The computer-readable medium of claim 1 , wherein the instructions are further configured to cause the computer system to control or configure, based on the map conveying the location of the identified areas on the substrate, a patterning process for processing the one or more patterns onto substrates.

9. The computer-readable medium of claim 1 , wherein the instructions configured to cause the computer system to identify areas for which the one or more patterns are, or are prone to be, defective are further configured to evaluate data relating to overlap of structures, of the one or more patterns, to be formed on substrates.

10. A substrate inspection tool configured to inspect patterns processed onto a substrate, wherein the substrate inspection tool comprises the computer-readable medium of claim 1 .

11. A non-transitory computer-readable medium having instructions therein, the instructions, upon execution by a computer system, configured to cause the computer system to at least:
obtain measured values of one or more processing parameters under which one or more patterns are processed onto a plurality of areas on a substrate, the measured values processed into the form of a map conveying the location of the measured values on the plurality of areas on the substrate;
perform a simulation, or apply a model, based on the values of the one or more processing parameters to identify areas for which the one or more patterns are, or are prone to be, defective; and
generate a map conveying the location of the identified areas on the substrate.

12. The computer-readable medium of claim 11 , wherein the instructions are further configured to cause the computer system to cause inspection, by an inspection apparatus, of one or more identified areas of the identified areas of the map.

13. The computer-readable medium of claim 11 , wherein the one or more processing parameters are selected from: focus, depth of focus, focus error, dose, an illumination parameter, or a projection optics parameter.

14. The computer-readable medium of claim 11 , wherein the one or more patterns comprise an identified process window limiting pattern.

15. The computer-readable medium of claim 11 , wherein the areas also enclose one or more patterns that are not, or not prone to be, defective.

16. The computer-readable medium of claim 11 , wherein the instructions configured to cause the computer system to perform a simulation, or apply a model are configured to cause the computer system to perform the simulation and do so by use of a computational model.

17. The computer-readable medium of claim 11 , wherein the instructions are further configured to cause the computer system to control or configure, based on the map conveying the location of the identified areas on the substrate, a patterning process for processing the one or more patterns onto substrates.

18. The computer-readable medium of claim 11 , wherein the instructions configured to cause the computer system to identify areas for which the one or more patterns are, or are prone to be, defective are further configured to evaluate data relating to overlap of structures, of the one or more patterns, to be formed on substrates.

19. A substrate inspection tool configured to inspect patterns processed onto a substrate, wherein the substrate inspection tool comprises the computer-readable medium of claim 11 .

20. A non-transitory computer-readable medium having instructions therein, the instructions, upon execution by a computer system, configured to cause the computer system to at least:
determine a group of patterns of interest, the patterns of interest being patterns for processing onto a substrate and having a high or increased probability of producing a defect relative to other patterns for processing onto the substrate;
obtain measured values of one or more processing parameters under which one or more patterns of the group of patterns of interest are processed onto a plurality of areas on a substrate, the measured values processed into the form of a map conveying the location of the measured values on the plurality of areas on the substrate;
perform a simulation based on the values of the one or more processing parameters to identify areas across the substrate where the one or more patterns of the group of patterns of interest are, or are prone to be, defective; and
generate a map conveying the location of the identified areas on the substrate.

21. The computer-readable medium of claim 20 , wherein the instructions are further configured to cause the computer system to cause inspection, by an inspection apparatus, of one or more identified areas of the identified areas of the map.

22. The computer-readable medium of claim 20 , wherein the one or more processing parameters are selected from: focus, depth of focus, focus error, dose, an illumination parameter, or a projection optics parameter.

23. The computer-readable medium of claim 20 , wherein the areas also enclose one or more patterns that are not, or not prone to be, defective.

24. The computer-readable medium of claim 23 , wherein the one or more processing parameters are selected from: focus, depth of focus, focus error, dose, an illumination parameter, or a projection optics parameter.

25. The computer-rea

Assignees

• Asml Netherlands Bv

Inventors

• Vellanki Venugopal
• Jain Vivek Kumar
• Hunsche Stefan

Classifications

• G03F7/70666

  Aerial image, i.e. measuring the image of the patterned exposure light at the image plane of the projection system · CPC title

• G03F7/70641

  Focus · CPC title

• G03F1/84

  Inspecting · CPC title

• G03F1/60

  Substrates · CPC title

• G06F2119/18

  Manufacturability analysis or optimisation for manufacturability · CPC title