Packages for high-power laser devices

Patent metadata

Field	Value
Publication number	US-12068574-B2
Application number	US-202117377832-A
Country	US
Kind code	B2
Filing date	Jul 16, 2021
Priority date	Jun 20, 2016
Publication date	Aug 20, 2024
Grant date	Aug 20, 2024

Abstract

In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.

First claim

What is claimed is:

1. A laser package comprising:
a bottom anode cooler having (i) a top surface, (ii) a bottom surface opposite the top surface, (iii) an entry recess defined in the bottom surface, (iv) a top recess defined in the top surface, and (v) fluidly connecting the entry recess and the top recess, a plurality of hollow ports for forming jets of cooling fluid therethrough, wherein the top surface of the bottom anode cooler comprises (a) a first portion surrounding the top recess, and (b) a second portion extending toward a rear side of the bottom anode cooler; and
disposed above the bottom anode cooler, a top anode cooler having (i) a top surface and (ii) a bottom surface opposite the top surface, the bottom surface comprising an impingement surface and an outer border surrounding the impingement surface, wherein (a) the outer border is coupled to the first portion of the bottom anode cooler, and (b) the top anode cooler does not overlie the second portion of the top surface of the bottom anode cooler,
wherein (i) the impingement surface defines a non-planar pattern, whereby cooling fluid introduced into the bottom anode cooler and jetted through the ports strikes the impingement surface of the top anode cooler, and (ii) the top surface of the bottom anode cooler defines a front depression extending from the first portion to a front side of the bottom anode cooler and recessed below the first portion.

2. The laser package of claim 1 , wherein the top anode cooler does not overlie the front depression.

3. The laser package of claim 1 , wherein the front depression is recessed below the first portion of the top surface of the bottom anode cooler by 0.025 mm to 50 mm.

4. The laser package of claim 1 , wherein the second portion is coplanar with the first portion.

5. The laser package of claim 1 , wherein at least a portion of the non-planar pattern protrudes into the top recess of the bottom anode cooler.

6. The laser package of claim 1 , further comprising:
disposed over the top anode cooler, a beam emitter configured to emit a plurality of beams;
focusing optics for focusing the plurality of beams toward a dispersive element;
the dispersive element for receiving and dispersing the received beams; and
a partially reflective output coupler positioned to receive the dispersed beams, transmit a portion of the dispersed beams therethrough as an output beam, and reflect a second portion of the dispersed beams back toward the dispersive element,
whereby the cooling fluid striking the impingement surface of the top anode cooler cools the beam emitter during operation thereof.

7. The laser package of claim 6 , wherein the dispersive element comprises a diffraction grating.

8. The laser package of claim 1 , wherein both the top anode cooler and the bottom anode cooler are electrically insulating.

9. The laser package of claim 1 , wherein at least a portion of at least one of the bottom anode cooler or the top anode cooler comprises at least one of copper, aluminum, stainless steel, CuW, tungsten, WC, alumina, mullite, diamond, or SiC.

10. The laser package of claim 1 , wherein the bottom anode cooler comprises alumina and the top anode cooler comprises SiC.

11. The laser package of claim 1 , wherein the non-planar pattern comprises a plurality of raised features.

12. The laser package of claim 1 , wherein the bottom anode cooler defines a plurality of raised struts disposed between openings of the ports.

13. The laser package of claim 1 , further comprising a cathode cooler (i) disposed over the top anode cooler, wherein a portion of the cathode cooler overhangs and does not contact the top surface of the top anode cooler.

14. The laser package of claim 13 , wherein the cathode cooler is not configured for the flow of cooling fluid therethrough.

15. The laser package of claim 1 , wherein the top anode cooler is not configured for the flow of cooling fluid therethrough.

16. The laser package of claim 1 , wherein a surface area of an entirety of the top surface of the top anode cooler is smaller than a surface area of an entirety of the second portion of the top surface of the bottom anode cooler.

17. The laser package of claim 1 , wherein the bottom anode cooler defines therewithin an exit channel fluidly connecting the top recess with an exit aperture defined in the bottom surface of the bottom anode cooler and spaced away from the entry recess.

18. The laser package of claim 17 , wherein an entire portion of the bottom surface of the bottom anode cooler extending between the entry recess and the exit aperture is planar and parallel to the second portion of the top surface of the bottom anode cooler.

19. A laser package comprising:
a bottom anode cooler having (i) a top surface, (ii) a bottom surface opposite the top surface, (iii) an entry recess defined in the bottom surface, (iv) a top recess defined in the top surface, and (v) fluidly connecting the entry recess and the top recess, a plurality of hollow ports for forming jets of cooling fluid therethrough, wherein the top surface of the bottom anode cooler comprises (a) a first portion surrounding the top recess, and (b) a second portion extending toward a rear side of the bottom anode cooler; and
disposed above the bottom anode cooler, a top anode cooler having (i) a top surface and (ii) a bottom surface opposite the top surface, the bottom surface comprising an impingement surface and an outer border surrounding the impingement surface, wherein (a) the outer border is coupled to the first portion of the bottom anode cooler, and (b) the top anode cooler does not overlie the second portion of the top surface of the bottom anode cooler,
wherein (i) the impingement surface defines a non-planar pattern, whereby cooling fluid introduced into the bottom anode cooler and jetted through the ports strikes the impingement surface of the top anode cooler, (ii) the bottom anode cooler defines therewithin an exit channel fluidly connecting the top recess with an exit aperture defined in the bottom surface of the bottom anode cooler and spaced away from the entry recess, and (iii) the exit channel is not parallel or perpendicular to the top surface of the bottom anode cooler or to the bottom surface of the bottom anode cooler.

20. The laser package of claim 1 , further comprising an attachment material attaching the outer border of the bottom surface of the top anode cooler to the first portion of the top surface of the bottom anode cooler.

21. The laser package of claim 20 , wherein the attachment material comprises at least one of an adhesive, solder, or a brazing material.

22. The laser package of claim 19 , wherein the top surface of the bottom anode cooler defines a front depression extending from the first portion to a front side of the bottom anode cooler and recessed below the first portion.

23. The laser package of claim 22 , wherein the top anode cooler does not overlie the front depression.

24. The laser package of claim 22 , wherein the front depression is recessed below the first portion of the top surface of the bottom anode cooler by 0.025 mm to 50 mm.

25. The laser package of claim 19 , wherein the second portion is coplanar with the first portion.

26. The laser package of claim 19 , wherein at least a portion of the non-planar pattern protrudes into the top recess of the bottom anode cooler.

27. The laser package of cl

Assignees

• Lochman Bryan
• Sauter Matthew
• Chann Bien
• Deutsch Michael
• Panasonic Corp Of North America

Inventors

• Lochman Bryan
• Sauter Matthew
• Chann Bien
• Deutsch Michael

Classifications

• H01S5/02355

  Fixing laser chips on mounts · CPC title

• H01S5/4025

  Array arrangements, e.g. constituted by discrete laser diodes or laser bar (H01S5/42 takes precedence) · CPC title

• H01S5/02315

  Support members, e.g. bases or carriers · CPC title

• H01S5/02476

  Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements · CPC title

• H01S5/4087

  emitting more than one wavelength · CPC title