Micro jet impingement heat sink

Patent metadata

Field	Value
Publication number	US-10306802-B1
Application number	US-201514957011-A
Country	US
Kind code	B1
Filing date	Dec 2, 2015
Priority date	Aug 28, 2015
Publication date	May 28, 2019
Grant date	May 28, 2019

Abstract

A heat sink for cooling an integrated circuit device includes a body having a first side and a second side. A fluid inlet opening is formed in the second side of the body for receiving pressurized fluid from a fluid source. A plurality of impingement openings are formed in the first side of the body. At least one fluid delivery channel is provided and configured to deliver pressurized fluid from the fluid inlet opening to the plurality of impingement openings for generating a plurality of fluid streams expelled from the plurality of impingement openings. A plurality of fluid diverters are formed on the first side of the body and arranged generally between each of the plurality of impingement openings for diverting a flow of fluid around each of the plurality of impingement openings.

First claim

What is claimed is:

1. A heat sink for cooling an electronic device, comprising:
a body having a first side and a second side opposite the first side;
a fluid inlet opening for receiving pressurized fluid from a fluid source;
a plurality of impingement openings formed in the first side of the body;
at least one fluid delivery channel formed through a portion of the body and configured to deliver pressurized fluid from the fluid inlet opening to the plurality of impingement openings for generating a plurality of fluid streams expelled from the plurality of impingement openings;
a plurality of fluid diverters formed on the first side of the body and arranged between each of the plurality of impingement openings for diverting a flow of fluid across the first side of the body around each of the plurality of impingement openings,
wherein each of the plurality of fluid diverters comprises a cross-section defining a vertex, and wherein the vertex of each of the plurality of fluid diverters is oriented toward a direction of the flow of fluid;
a plurality of fluid return openings formed in the first side of the body and configured to carry fluid away from the first side of the body, the plurality of fluid return openings interspersed between the plurality of fluid diverters and impingement jets so as to receive a portion of the fluid diverted by the plurality of diverters;
wherein the at least one fluid delivery channel is located proximate the first side of said heat sink and configured to transport low temperature fluid to downstream impingement openings to enable jet impingement with low temperature fluid along a length of an electronic device to be cooled; and
a second fluid delivery channel isolated from the first fluid delivery channel and located proximate the second side of the heat sink, the second fluid delivery channel configured to receive and transport from the plurality of fluid return openings higher temperature return fluid having impinged on a length of the electronic device to be cooled.

2. The heat sink of claim 1 , wherein each of the plurality of fluid diverters are sized and positioned so as to divert the flow of fluid toward the plurality of fluid return openings.

3. The heat sink of claim 1 , wherein each of the plurality of fluid diverters comprises a triangular cross section.

4. The heat sink of claim 1 , wherein the plurality of impingement openings are arranged in a plurality of first columns on the first side of the body,
wherein the plurality of fluid return openings and fluid diverters are arranged in a plurality of second columns on the first side of the body, with each second column comprising alternating fluid return openings and fluid diverters, and
wherein each first column is positioned between a pair of second columns.

5. The heat sink of claim 1 , wherein the fluid inlet opening is formed in the second side of the body.

6. The heat sink of claim 1 , wherein the plurality of fluid diverters are formed integrally with the body.

7. A heat sink for cooling an electronic device, comprising:
a body having a first side and a second side;
a plurality of impingement jets formed in the first side of the body, each impingement jet comprising an aperture formed in the body and responsive to a source of pressurized fluid for generating a plurality of fluid streams expelled from the body;
a plurality of fluid return openings formed in the first side of the body and configured to carry fluid away from the first side of the body; and
a plurality of fluid diverters formed on the first side of the body and arranged between each of the plurality of impingement jets for diverting a flow of fluid around each of the plurality of impingement jets,
wherein the plurality of impingement jets, fluid return openings, and fluid diverters are arranged in a pattern of rows and columns, wherein
the plurality of impingement jets are arranged in a plurality of first columns on the first side of the body,
the plurality of fluid return openings and fluid diverters are arranged in a plurality of second columns on the first side of the body, with each second column comprising alternating fluid return openings and fluid diverters, and
wherein each first column of impingement jets is positioned between a pair of second columns of alternating fluid return openings and fluid diverters, and
wherein alternating rows of said pattern comprise alternating first and second rows defined by: a) fluid return openings in a plurality of first rows on the first side of the body; and b) alternating impingement jets and fluid diverters in a plurality of second rows on the first side of the body.

8. The heat sink of claim 7 , further comprising at least one fluid delivery channel formed in the body and configured to deliver pressurized fluid to the plurality of impingement jets.

9. The heat sink of claim 8 , further comprising a fluid inlet opening in communication with the at least one fluid delivery channel formed in the body for receiving pressurized fluid from a fluid source.

10. The heat sink of claim 7 , wherein the plurality of apertures defining the plurality of impingement jets open toward the first side of the body.

11. The heat sink of claim 10 , wherein the body defines a first planar surface on the first side thereof.

12. The heat sink of claim 11 , further comprising a recess formed in the first side of the body defining a second planar surface.

13. The heat sink of claim 12 , wherein the plurality of apertures defining the plurality of impingement jets are formed in the second planar surface.

14. The heat sink of claim 13 , wherein the plurality of fluid diverters are formed on the second planar surface.

15. The heat sink of claim 14 , wherein the plurality of impingement jets are oriented such that the plurality of fluid streams expelled therefrom impinge on a surface of an integrated circuit device mounted to the first planar surface.

16. A cooling system for an electronic device, comprising:
a heat sink configured to be mounted to the electronic device, the heat sink comprising:
a body defining a plurality of impingement jets, each impingement jet comprising an aperture formed in the body and responsive to a source of pressurized fluid for generating a plurality of fluid streams; and
a plurality of fluid diverters formed on the body and arranged between each of the plurality of impingement jets for diverting a flow of fluid around each of the plurality of impingement jets, and
a plurality of fluid return openings formed in the body and configured to carry fluid away from the body, the plurality of fluid return openings positioned in a pattern of columns and rows comprising alternating fluid return openings and diverters along a given column, and sequentially positioned fluid return openings along a given row,
wherein each of said plurality of fluid return openings is further positioned in relation to a corresponding one of said plurality of diverters, and to a corresponding one of said plurality of impingement jets, so as to receive and carry away a portion of the fluid diverted by the corresponding diverter away from a downstream impingement jet; and

a fluid routing element configured to be mounted between the heat sink and a host cooling system for delivering pressurized fluid from the host cooling system to the plurality of impingement jets.

17. The system of claim 16 , wherein each of the plurality of fluid return openings is oval-shaped and has dimensions greater than those of said plurality of impingement jets.

18. The system of clai

Assignees

• Lockheed Corp

Inventors

• Ditri John
• Hahn Joseph W
• Mcnulty Michael K

Classifications

• H10W40/254

  Diamond · CPC title

• H10W40/251

  Organics · CPC title

• H10W40/475 Primary

  using jet impingement (H10W40/776 takes precedence) · CPC title

• H05K7/20281

  Thermal management, e.g. liquid flow control · CPC title

• H05K7/20272

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title