Packages for high-power laser devices

Patent metadata

Field	Value
Publication number	US-10490972-B2
Application number	US-201715627917-A
Country	US
Kind code	B2
Filing date	Jun 20, 2017
Priority date	Jun 20, 2016
Publication date	Nov 26, 2019
Grant date	Nov 26, 2019

Abstract

In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.

First claim

What is claimed is:

1. A laser package comprising:
a bottom anode cooler defining at least partially therethrough a plurality of ports for forming jets of cooling fluid therethrough, the plurality of ports being arranged in a two-dimensional array, wherein a top surface of the bottom anode cooler comprises (i) a port portion in which the plurality of ports are defined and (ii) a planar portion surrounding the port portion, and wherein the port portion is elevated above the planar portion; and
disposed above the bottom anode cooler, a top anode cooler (i) comprising a laser platform for receiving a laser emitter thereon, and (ii) defining a recess therein, the recess (a) being disposed beneath the laser platform and (b) having an impingement surface facing the ports of the bottom anode cooler, whereby cooling fluid introduced into the bottom anode cooler and vertically jetted through the ports strikes the impingement surface of the top anode cooler to cool a laser emitter disposed on the laser platform, wherein a bottom surface of the top anode cooler comprises (i) a recessed portion in which the recess is defined and (ii) a planar portion surrounding the recessed portion and elevated thereover, and wherein a top surface of the top anode cooler comprises (i) a planar portion adjoining the laser platform and not configured for receipt of the laser emitter thereon and (ii) an output portion adjoining the laser platform and recessed below the laser platform, whereby the laser emitter is configured to emit one or more beams toward the output portion when received on the laser platform,
wherein at least a portion of the impingement surface defines a non-planar pattern, spaced vertically away from and disposed vertically over the ports, for enhancing a cooling effect of the vertically jetted cooling fluid that strikes the pattern, and
wherein (i) the port portion of the bottom anode cooler is received within the recessed portion of the top anode cooler, and (ii) away from the recess, a top surface of the planar portion of the bottom anode cooler is directly coupled to and in direct contact with a bottom surface of the planar portion of the top anode cooler.

2. The package of claim 1 , wherein at least a portion of at least one of the bottom anode cooler or the top anode cooler comprises at least one of copper, aluminum, stainless steel, CuW, tungsten, WC, alumina, mullite, diamond, or SiC.

3. The package of claim 1 , wherein the pattern comprises at least one of a plurality of dimples, a plurality of grooves, or a plurality of studs.

4. The package of claim 1 , wherein at least a portion of the impingement surface defines a plurality of struts for enhancing mechanical stability of the laser platform, each of the struts extending vertically through only a portion of a depth of the recess defined in the top anode cooler.

5. The package of claim 1 , further comprising:
a cathode cooler disposed over the top anode cooler, wherein a first portion of the cathode cooler overhangs and does not contact the laser platform of the top anode cooler, and a second portion of the cathode cooler is directly coupled to the top anode cooler.

6. The package of claim 1 , wherein the ports are spaced away from the impingement surface to form a mixing channel, and further comprising, through the bottom anode cooler, (i) an inlet line for conducting the cooling fluid through the ports and into a proximal end of the mixing channel, and (ii) an outlet line for conducting the cooling fluid out of a distal end of the mixing channel.

7. The package of claim 6 , wherein the mixing channel has a height selected from the range of approximately 0.01 mm to approximately 30 mm.

8. The package of claim 6 ,
a ratio of the height of the mixing channel to a diameter of at least one of the ports is selected from the range of approximately 0.1 to approximately 30.

9. The package of claim 1 , wherein a center-to-center spacing of the ports is selected from the range of approximately 0.1 mm to approximately 8 mm.

10. The package of claim 1 , wherein a diameter of at least one of the ports is selected from the range of approximately 0.025 mm to approximately 5 mm.

11. The package of claim 1 , wherein a coefficient of thermal expansion of at least one of the top anode cooler or the bottom anode cooler is selected from the range of approximately 0.5 ppm to approximately 12 ppm.

12. The package of claim 1 , further comprising a laser emitter disposed on the laser platform.

13. The package of claim 12 , wherein the laser emitter comprises a laser diode bar configured to emit a plurality of beams.

14. The package of claim 1 , wherein a coefficient of thermal expansion of the top anode cooler is equal to a coefficient of thermal expansion of the bottom anode cooler.

15. The package of claim 1 , wherein the top anode cooler and the bottom anode cooler are composed of the same material.

16. A wavelength beam combining laser system comprising:
a beam emitter emitting a plurality of discrete beams;
focusing optics for focusing the plurality of beams onto a dispersive element;
a dispersive element for receiving and dispersing the received focused beams;
a partially reflective output coupler positioned to receive the dispersed beams, transmit a portion of the dispersed beams therethrough as a multi-wavelength output beam, and reflect a second portion of the dispersed beams back toward the dispersive element;
a bottom anode cooler defining at least partially therethrough a plurality of ports for forming jets of cooling fluid therethrough, the plurality of ports being arranged in a two-dimensional array, wherein a top surface of the bottom anode cooler comprises (i) a port portion in which the plurality of ports are defined and (ii) a planar portion surrounding the port portion, and wherein the port portion is elevated above the planar portion; and
disposed above the bottom anode cooler, a top anode cooler (i) comprising a laser platform for receiving a laser emitter thereon, and (ii) defining a recess therein, the recess (a) being disposed beneath the laser platform and (b) having an impingement surface facing the ports of the bottom anode cooler, whereby cooling fluid introduced into the bottom anode cooler and vertically jetted through the ports strikes the impingement surface of the top anode cooler to cool a laser emitter disposed on the laser platform, wherein a bottom surface of the top anode cooler comprises (i) a recessed portion in which the recess is defined and (ii) a planar portion surrounding the recessed portion and elevated thereover, and wherein a top surface of the top anode cooler comprises (i) a planar portion adjoining the laser platform and not configured for receipt of the laser emitter thereon and (ii) an output portion adjoining the laser platform and recessed below the laser platform, whereby the laser emitter is configured to emit the beams toward the output portion when received on the laser platform,
wherein at least a portion of the impingement surface defines a non-planar pattern, spaced vertically away from and disposed vertically over the ports, for enhancing a cooling effect of the vertically jetted cooling fluid that strikes the pattern, and
wherein (i) the port portion of the bottom anode cooler is received within the recessed portion of the top anode cooler, and (ii) away from the recess, a top surface of the planar portion of the bottom anode cooler is directly coupled to and in direct contact with a bottom surface of the planar portion of the top anode cooler.

17. The laser system of claim 16 , where

Assignees

• Teradiode Inc

Inventors

• Lochman Bryan
• Liu Thomas
• Sauter Matthew
• Chann Bien
• Huang Robin
• Tayebati Parviz
• Deutsch Michael

Classifications

• H01S5/04254

  characterised by the shape · CPC title

• B23K26/703

  Cooling arrangements (by using a fluid stream B23K26/14) · CPC title

• H01S5/4087

  emitting more than one wavelength · CPC title

• B23K26/21

  by welding · CPC title

• B23K26/382

  by boring · CPC title