Surface-emitting laser with multilayer thermally conductive mirror
US-2024106199-A1 · Mar 28, 2024 · US
Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01S5/02476 |
| Official title | {Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements} |
| Display label | Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements |
| Total patents | 649 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 38 |
| 2016 | 41 |
| 2017 | 44 |
| 2018 | 45 |
| 2019 | 59 |
| 2020 | 81 |
| 2021 | 73 |
| 2022 | 68 |
| 2023 | 82 |
| 2024 | 64 |
| 2025 | 46 |
| 2026 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Mounting layer for cooling structure
US-9515453-B2 · Dec 6, 2016 · US
Laser ablation process for manufacturing submounts for laser diodes and laser diode units
US-2016352070-A1 · Dec 1, 2016 · US
Interposer
US-2016315448-A1 · Oct 27, 2016 · US
Laser module with simplified alignment
US-2016315447-A1 · Oct 27, 2016 · US
Housing for laser diodes and method for producing a housing
US-9461438-B2 · Oct 4, 2016 · US
Integrated parallel optical transceiver
US-2016226591-A1 · Aug 4, 2016 · US
Laser diode with cooling along even the side surfaces
US-2016204575-A1 · Jul 14, 2016 · US
Thermal management in packaged VCSELs
US-9391427-B2 · Jul 12, 2016 · US
Nitride semiconductor light emitting device
US-9385277-B2 · Jul 5, 2016 · US
Semiconductor laser device and manufacturing method thereof, and submount manufacturing method
US-2016181760-A1 · Jun 23, 2016 · US
Method of achieving acceptable performance in and fabrication of a monolithic photonic integrated circuit (PIC) with integrated arrays of laser sources and modulators employing an extended identical active layer (EIAL)
US-9372306-B1 · Jun 21, 2016 · US
Laser package having multiple emitters configured on a support member
US-9371970-B2 · Jun 21, 2016 · US
Heat removal from photonic devices
US-2016141831-A1 · May 19, 2016 · US
Mounting layer for cooling structure
US-2016118770-A1 · Apr 28, 2016 · US
Semiconductor laser device and manufacturing method thereof, and submount manufacturing method
US-9318871-B2 · Apr 19, 2016 · US
Compact infrared countermeasure emitter
US-9310167-B1 · Apr 12, 2016 · US
Semiconductor laser device
US-2016099543-A1 · Apr 7, 2016 · US
Laser Diode Apparatus
US-2016087399-A1 · Mar 24, 2016 · US
Semiconductor laser element, methods of manufacturing the same and semiconductor laser device
US-2016072257-A1 · Mar 10, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01S5/02476?
- CPC H01S5/02476 is the Cooperative Patent Classification code for “Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements.”
- How many patents are filed under CPC H01S5/02476 (Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements)?
- Our database includes 649 publications tagged with this CPC code.
- Is patent activity under CPC H01S5/02476 growing?
- Publication counts under this code: 64 in 2024 vs 46 in 2025 (latest complete years).