Substrate processing apparatus, estimation method of substrate processing and recording medium

Patent metadata

Field	Value
Publication number	US-12051587-B2
Application number	US-202117346638-A
Country	US
Kind code	B2
Filing date	Jun 14, 2021
Priority date	Jun 15, 2020
Publication date	Jul 30, 2024
Grant date	Jul 30, 2024

Abstract

A substrate processing apparatus includes a periphery removal unit configured to remove a peripheral portion of a film formed on a surface of a substrate; a profile acquisition unit configured to acquire a removal width profile indicating a relationship between a position in a circumferential direction of the substrate and a width of a portion of the substrate from which the film is removed; and a factor estimation unit configured to output factor information indicating a factor of an error in the width based on the removal width profile.

First claim

We claim:

1. An estimation method of a substrate processing performed by a substrate processing apparatus in which a peripheral portion of a film formed on a surface of a substrate is removed, comprising:
acquiring a removal width profile indicating a relationship between a position in a circumferential direction of the substrate and a width of a portion of the substrate from which the film is removed;
calculating multiple kinds of feature amounts matched to at least one error factor based on the removal width profile; and
outputting factor information indicating a factor of an error in the width based on the removal width profile and a calculation result of the multiple kinds of feature amounts,
wherein the multiple kinds of feature amounts include at least one of an evaluation value of a roundness of a periphery of the film and an evaluation value of a roughness of the periphery of the film.

2. The estimation method of claim 1 , further comprising:
evaluating the width based on the removal width profile,
wherein in the outputting of the factor information, the factor information is output when an evaluation result of the width is out of a predetermined range.

3. The estimation method of claim 1 ,
wherein the multiple kinds of feature amounts further include at least one of an evaluation value of the width, and an evaluation value of an eccentricity of the periphery of the film with respect to a periphery of the substrate.

4. The estimation method of claim 3 ,
wherein the substrate processing includes:
holding and rotating the substrate; and
discharging a removal liquid for removing the film toward a peripheral portion of the substrate which is held and rotated,
wherein the evaluation value of the width is matched to at least a position deviation in the discharging and a change in a discharge rate of the removal liquid in the discharging,
the evaluation value of the eccentricity is matched to at least a position deviation of the substrate in the holding and rotating,
the evaluation value of the roundness is matched to at least a distortion of the substrate and a distortion of the holding and rotating, and
the evaluation value of the roughness is matched to at least a liquid scattering of the removal liquid and a variation in the discharge rate of the removal liquid.

5. The estimation method of claim 1 ,
evaluating contribution levels of the multiple kinds of feature amounts to an error based on the calculation result of the multiple kinds of feature amounts,
wherein in the outputting of the factor information, the factor information is output based on the contribution levels of the multiple kinds of feature amounts to the error.

6. The estimation method of claim 5 ,
wherein in the outputting of the factor information, the factor information is output based on at least one error factor, among multiple kinds of error factors, matched to at least a feature amount having a highest contribution level.

7. The estimation method of claim 1 ,
wherein the multiple kinds of feature amounts include a composite feature amount matched to multiple kinds of error factors, and
in the outputting of the factor information, when a feature amount having a highest contribution level is the composite feature amount, the factor information is output based on multiple kinds of error factors matched to the composite feature amount and a state of the substrate processing.

Assignees

• Tokyo Electron Ltd

Inventors

• Nakamura Hiroshi
• Tadokoro Masahide
• Enomoto Masashi

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P72/0616

  Monitoring of warpages, curvatures, damages, defects or the like · CPC title

• H10P72/0612 Primary

  Production flow monitoring, e.g. for increasing throughput · CPC title

• H10P72/0606

  Position monitoring, e.g. misposition detection or presence detection · CPC title