Integrated circuit with laminated magnetic core inductor and magnetic flux closure layer

Patent metadata

Field	Value
Publication number	US-12048097-B2
Application number	US-202117358318-A
Country	US
Kind code	B2
Filing date	Jun 25, 2021
Priority date	Sep 11, 2012
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

A structure comprises a semiconductor integrated circuit, an inductor, and a magnetic flux closure layer. The inductor is integrated into a multilevel wiring network in the semiconductor integrated circuit. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic flux closure layer is disposed within about 100 μm of a face of the planar laminated magnetic core, the face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core. A second magnetic flux closure layer can be disposed within about 100 μm of an opposing face of the planar laminated magnetic core.

First claim

What is claimed is:

1. A structure comprising:
a semiconductor integrated circuit comprising a multilevel wiring network disposed on a substrate;
an inductor integrated into said multilevel wiring network, said inductor comprising a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of said planar laminated magnetic core, said planar laminated magnetic core comprising a top magnetic layer, a bottom magnetic layer, and an alternating sequence of a middle magnetic layer and a non-magnetic layer, the alternating sequence between the top magnetic layer and the bottom magnetic layer; and
a magnetic flux closure layer disposed within about 100 μm of a bottom face of the planar laminated magnetic core, the bottom face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core and located closer to the substrate than an opposing face of the planar laminated magnetic core,
wherein:
the bottom magnetic layer, the magnetic flux closure layer, and each middle magnetic layer comprise respective anisotropic magnetic materials,
the bottom magnetic layer and the magnetic flux closure layer have respective hard axes of magnetization that are parallel to each other,
each middle magnetic layer has a respective easy axis of magnetization that is parallel to the respective hard axes of magnetization,
the inductor is configured such that:
a magnetic flux passes through the bottom magnetic layer and the magnetic flux closure layer parallel to the respective hard axes of magnetization, and
the magnetic flux passes through each middle magnetic layer parallel to the respective easy axis of magnetization.

2. The structure of claim 1 , wherein the conductive winding is disposed between the planar laminated magnetic core and the magnetic flux closure layer.

3. The structure of claim 1 , wherein the magnetic flux closure layer extends across a length and a width of the face of the planar laminated magnetic core, the length and the width measured with respect to the principal plane of the planar laminated magnetic core.

4. The structure of claim 3 , wherein the magnetic flux closure layer extends beyond the length and the width of the face of the planar laminated magnetic core.

5. The structure of claim 1 , wherein
wire segments in at least one wiring plane in the multilevel wiring network are disposed between the inductor and the substrate, and
the magnetic flux closure layer is disposed between the inductor and the wire segments in the at least one wiring plane.

6. The structure of claim 5 , wherein the magnetic flux closure layer provides a low magnetic reluctance path for an inductor magnetic flux.

7. The structure of claim 6 , wherein the magnetic flux closure layer prevents the magnetic flux from passing through any wire segments in the at least one wiring plane.

8. The structure of claim 1 , wherein a first thickness of the magnetic flux closure layer is less than or equal to a second thickness of each middle magnetic layer, the first and second thicknesses measured with respect to an axis that is orthogonal to the principal plane of the planar laminated magnetic core.

9. The structure of claim 8 , wherein the second thickness of each magnetic layer is the same.

10. The structure of claim 1 , wherein the magnetic flux closure layer comprises the same material as the magnetic layers.

11. The structure of claim 1 , wherein the respective hard axes of magnetization are at least partially aligned with an axis of the conductive winding, the conductive winding extending along the axis of the conductive winding.

12. The structure of claim 1 , wherein the anisotropic magnetic materials in the bottom magnetic layer and the magnetic flux closure layer are the same.

13. The structure of claim 1 , wherein:
the magnetic flux closure layer is a bottom magnetic flux closure layer, and
the structure further comprises a top magnetic flux closure layer,
wherein:
the top magnetic layer and the top magnetic flux closure layer comprise respective anisotropic magnetic materials having respective hard axes of magnetization,
the respective hard axes of magnetization of the top magnetic layer, the top magnetic flux closure layer, the bottom magnetic layer, and the bottom magnetic flux closure layer are parallel to each other, and
the inductor is configured such that the magnetic flux passes through the top magnetic layer and the top magnetic flux closure layer parallel to the respective hard axes of magnetization of the top magnetic layer and the top magnetic flux closure layer.

14. The structure of claim 1 , wherein the top magnetic layer comprises an anisotropic magnetic material having an easy axis of magnetization that is parallel to the respective hard axes of magnetization of the magnetic flux closure layer and the bottom magnetic layer and to the respective easy axis of magnetization of each middle magnetic layer, the magnetic flux passing through the top magnetic layer parallel to the easy axis of magnetization of the top magnetic layer.

15. A structure comprising:
a semiconductor integrated circuit comprising a multilevel wiring network disposed on a substrate;
an inductor integrated into said multilevel wiring network, said inductor comprising a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of said planar laminated magnetic core, said planar laminated magnetic core comprising an alternating sequence of a magnetic layer and a non-magnetic layer, each magnetic layer having a respective thickness measured with respect to an axis that is orthogonal to a principal plane of the planar laminated magnetic core;
a first magnetic flux closure layer disposed within about 100 μm of a face of the planar laminated magnetic core, the first magnetic flux closure layer having a thickness measured with respect to the axis; and
a second magnetic flux closure layer disposed within about 100 μm of an opposing face of the planar laminated magnetic core, the face and the opposing face parallel to the principal plane of the planar laminated magnetic core, the second magnetic flux closure layer having a thickness measured with respect to the axis,
wherein:
a combined thickness of the first and second magnetic flux closure layers is less than a thickness of the planar laminated magnetic core, the thickness of the planar laminated magnetic core measured with respect to the axis.

16. The structure of claim 15 , wherein the conductive winding is disposed between the planar laminated magnetic core and each magnetic flux closure layer.

17. The structure of claim 15 , wherein the first magnetic flux closure layer extends across a length and a width of the face of the planar laminated magnetic core and the second magnetic flux closure layer extends across a length and a width of the opposing face of the planar laminated magnetic core, the respective length and the width measured with respect to the principal plane of the planar laminated magnetic core.

18. The structure of claim 17 , wherein the first magnetic flux closure layer extends beyond the length and the width of the face of the planar laminated magnetic core.

19. The structure of claim 18 , wherein the second magnetic flux closure layer extends beyond the length and the width of the opposing face of the planar laminated magnetic core.

20. The structure of claim 15 , wherein
the face of the planar laminated magnetic core is clos

Assignees

• Ferric Inc

Inventors

• Sturcken Noah
• Davies Ryan
• Lekas Michael

Classifications

• H10W20/497

  Inductive arrangements or effects of, or between, wiring layers · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H01F41/32

  for applying conductive, insulating or magnetic material on a magnetic film {, specially adapted for a thin magnetic film} · CPC title

• H01F17/0033

  with the coil helically wound around a magnetic core · CPC title

• H01F17/0013 Primary

  with stacked layers · CPC title