Systems and Methods for Integrated Multi-Layer Magnetic Films
US-2015171157-A1 · Jun 18, 2015 · US
US9991040B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9991040-B2 |
| Application number | US-201514746994-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 23, 2015 |
| Priority date | Jun 23, 2014 |
| Publication date | Jun 5, 2018 |
| Grant date | Jun 5, 2018 |
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Inductive elements comprising anisotropic media and biasing coils for magnetically biasing thereof and methods of manufacture and operation for use in applications such as microelectronics. Application of an electrical current through the bias coils generates a magnetic field that biases the magnetic material such that a desirable orientation of anisotropy is achieved throughout the magnetic core and enables modulation of the inductive response of the device. Electrical conductors coupled to interconnects are magnetically coupled to magnetic core layers to produce self and/or mutual inductors.
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What is claimed is: 1. A semiconductor device comprising a biased inductor, the inductor comprising: an anisotropic magnetic core lying in a core plane; an inductor coil wrapped around the core, the inductor coil extending in a direction parallel to the core plane, the inductor coil configured to generate a first magnetic field parallel to the core plane; and a bias coil integrated in said semiconductor device adjacent to said core, the bias coil configured to generate a bias magnetic field orthogonal to the first magnetic field along a length of the core, the bias magnetic field inducing an orientation of anisotropy in said core such that an easy axis of magnetization in the core is parallel to the bias magnetic field that passes through said core and a hard axis of magnetization is parallel to the first magnetic field along a length of the core, wherein the bias coil is configured to generate sufficient heat to permanently or semi-permanently fix said orientation of anisotropy in said core. 2. The device of claim 1 wherein the core has a rectangular cross section in a plane parallel to the core plane. 3. The device of claim 1 wherein the core has a circular cross section in a plane parallel to the core plane. 4. The device of claim 3 wherein said circular cross section is in the form of a toroid. 5. The device of claim 3 wherein the first magnetic field extends in an arc along said circular cross section. 6. The device of claim 3 wherein the bias magnetic field extends radially from a center of the circular cross section. 7. The device of claim 1 wherein the bias coil is configured to receive a current greater than or equal to about 10 mA to generate sufficient heat to permanently or semi-permanently fix said orientation of anisotropy in said core. 8. The device of claim 1 wherein the bias coil is configured to receive the current for greater than or equal to about 15 minutes to generate sufficient heat to permanently or semi-permanently fix said orientation of anisotropy in said core. 9. The device of claim 1 wherein the bias coil is configured to receive a current greater than or equal to 10 mA to generate sufficient heat to permanently or semi-permanently fix said orientation of anisotropy in said core. 10. The device of claim 1 wherein the bias coil is configured to receive the current for greater than or equal to 15 minutes to generate sufficient heat to permanently or semi-permanently fix said orientation of anisotropy in said core. 11. The device of claim 1 wherein the bias coil is configured to generate sufficient heat to raise a temperature of the core to greater than 100 degrees Celsius to permanently or semi-permanently fix said orientation of anisotropy in said core. 12. A semiconductor device comprising an inductor assembly, the inductor assembly comprising: a toroidal shaped inductor core made of an anisotropic magnetic material, said toroidal core generally having an axis of symmetry and lying in a core plane perpendicular to said axis of symmetry; an inductor coil wound about said toroidal core, said inductor coil arranged to generate a first magnetic field parallel to said core plane; and a bias coil integrated in said semiconductor device adjacent to said toroidal core, the bias coil wound parallel to said core plane and arranged to generate a bias magnetic field parallel to said axis of symmetry of said core, the bias magnetic field inducing an orientation of anisotropy in said core such that an easy axis of magnetization in the core is parallel to the bias magnetic field that passes through said core and a hard axis of magnetization is parallel to the first magnetic field along a length of the core, wherein the bias coil is configured to generate sufficient heat to permanently or semi-permanently fix said orientation of anisotropy in said core. 13. The device of claim 12 wherein a first portion of the inductor coil is fabricated in a first layer of the semiconductor device, a second portion of the inductor coil is fabricated in a second layer of the semiconductor device, the first and second portions of the coil being electrically connected through a plurality of VIAs formed in a third layer of the semiconductor device, the third layer between the first and second layers. 14. The device of claim 13 wherein the bias coil is formed in a fourth layer of the semiconductor device, the second layer between the third and fourth layers. 15. The device of claim 13 wherein the magnetic core is disposed in the third layer, the core disposed proximal to at least one said VIA. 16. The device of claim 12 , said easy axis and said hard axis being perpendicular to one another and both generally lying in said core plane. 17. The device of claim 12 , said toroidal core having a generalized circular cross section in said core plane. 18. The device of claim 12 , said toroidal core having a generalized rectangular cross section in a plane perpendicular to said core plane and containing said axis of symmetry. 19. The device of claim 12 , wherein said core comprises at least one of Co, Ni, and Fe.
Fe-Ni based alloys (pure Fe or Ni H01F1/14, H01F1/16 or H01F1/20) · CPC title
for applying magnetic films to substrates · CPC title
with stacked layers · CPC title
Coil winding · CPC title
structurally combined with ferromagnetic material · CPC title
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