Method of making magnetic core inductor integrated with multilevel wiring network

US9357650B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9357650-B2
Application numberUS-201213613011-A
CountryUS
Kind codeB2
Filing dateSep 13, 2012
Priority dateSep 11, 2012
Publication dateMay 31, 2016
Grant dateMay 31, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method, comprising: depositing by high-vacuum (HV) sputtering a layer of a magnetic material on a first insulating layer, said first insulating layer disposed on a first wiring plane of a multilevel wiring network, said magnetic material having a thickness between about 10 nm and 1000 nm; disposing a second insulating layer over said layer of said magnetic material; repeating in alternate fashion said depositing step and said disposing step up to about 100 times each, resulting in a magnetic member with a laminated configuration; masking and patterning for said magnetic member in such manner that after said patterning a remaining portion of said magnetic member comprises a planar magnetic core; and wherein said method is characterized as fabricating a planar inductor suitable for integrating into said multilevel wiring network that is arranged into wiring planes, wherein said inductor comprises said planar magnetic core. 2. The method of claim 1 , wherein in said disposing step said magnetic material is oxidized, wherein forming said insulating layer. 3. The method of claim 1 , wherein said method further comprises selecting a material for said insulating layer in such manner that said insulating layer is commonly etchable with said layer of said magnetic material. 4. The method of claim 3 , wherein said magnetic material comprises Co X Zr Y Ta 1-X-Y , and said material for said insulating layer comprises CoO. 5. The method of claim 1 , wherein said steps of masking and patterning comprise a liftoff process. 6. The method of claim 1 , wherein said steps of masking and patterning comprise developing a positive photoresist over said magnetic member and etching away an unneeded portion of said magnetic member.

Assignees

Inventors

Classifications

  • for inductive purposes, e.g. printed inductor with ferrite core · CPC title

  • Cross-Sectional Technologies · mapped topic

  • H05K1/181Primary

    associated with surface mounted components · CPC title

  • incorporating printed inductors · CPC title

  • Assembling to base an electrical component, e.g., capacitor, etc. · CPC title

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Frequently asked questions

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What does patent US9357650B2 cover?
An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two w…
Who is the assignee on this patent?
Sturcken Noah Andrew, Ferric Inc
What technology area does this patent fall under?
Primary CPC classification H05K1/181. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 31 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).